Lattice Semiconductor Corporation LCMXO640E-3FN256C

Mfr. Part

LCMXO640E-3FN256C

Manufacturer

Lattice Semiconductor

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Detailed Description

MachXO family, non-volatile FPGA for low-power, instant-on embedded control and bridging

640 logic elements and 80 LABs/CLBs for compact designs

159 general-purpose I/O in a space-saving 256-ball fine-pitch BGA package

Commercial temperature grade, optimized for 0°C to 85°C operation

Core supply range 1.14 V to 1.26 V (nominal 1.2 V)

Surface-mount device, ideal for high-volume manufacturing

Key Features

640 logic elements/cells for small-to-medium control logic

80 LABs/CLBs for structured logic implementation

159 user I/O for broad connectivity

Non-volatile, instant-on architecture for fast startup and reliable configuration retention

MachXO series ecosystem with mature tooling and documentation

-3 speed grade for balanced performance and power

256-FPBGA (17 mm x 17 mm) footprint for dense PCB layouts

Core voltage 1.14–1.26 V for low-power operation

Commercial temperature support: 0°C to 85°C (TJ)

Key Advantages

Instant-on behavior simplifies power sequencing and reduces system boot time

Low power and small footprint cut system cost and PCB area

High I/O count enables easy bridging between interfaces and processors

Proven MachXO platform reduces design risk and speeds time to market

Robust non-volatile configuration avoids external flash dependency

Mature toolchain and broad community support reduce development effort

Packaging

Type: 256-FPBGA (Fine-Pitch Ball Grid Array)

Material: Molded plastic BGA with solder ball interconnects

Size: 17 mm x 17 mm body outline

Pin configuration: 256-ball grid, 17 x 17 matrix; 159 user I/O available

Mounting: Surface mount (SMT), compatible with standard lead-free reflow

Thermal characteristics: Commercial-grade operation 0°C to 85°C (TJ); use adequate PCB copper and airflow for heat spreading in BGA designs

Electrical properties: Core supply 1.14–1.26 V (nominal 1.2 V); logic capacity 640 cells; 80 LABs/CLBs; 159 I/O; -3 speed grade

Supplier device package: 256-FPBGA (17x17)

Factory packing: Tray for secure handling in production

Lifecycle

Status: Active in production for many embedded and bridging applications

Family continuity: MachXO continues to be supported; newer families (MachXO2, MachXO3) offer similar densities with enhanced features

Equivalent or alternative models:

- Same-family variants: LCMXO640E devices with other speed grades and temperature grades (e.g., industrial-temp options) and alternative packages where available

- Newer-generation alternatives: LCMXO2-640 family devices (e.g., LCMXO2-640HC variants) offering lower power and richer features in TG100 and BGA packages

- Higher-capability alternatives: MachXO3LF devices with comparable low-power, non-volatile behavior for designs needing more features or I/O

For a precise, up-to-date cross-reference list tailored to your design constraints (package, speed grade, temperature, pinout), contact our sales team via the Y-IC website. We will match drop-in or near-drop-in options and provide availability and lead-time.

Key Application Areas

Power-on control, sequencing, and reset supervision

Interface bridging and glue logic between processors, sensors, and peripherals

IO expansion and simple state machines

System management and board-level control

Low-power consumer, industrial, and communications equipment

Compact designs needing instant-on configuration without external memory

Datasheet

Y-IC hosts the most authoritative datasheet for LCMXO640E-3FN256C on our product page. Download it now to get full electrical, timing, and mechanical specifications, application guidance, and design notes.

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