Lattice Semiconductor Corporation LCMXO256E-3M100C

Mfr. Part

LCMXO256E-3M100C

Manufacturer

Lattice Semiconductor

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Detailed Description

MachXO family low-density FPGA with 256 logic cells and 32 LAB/CLB blocks, 78 I/O pins, commercial temperature. Core supply 1.14V to 1.26V. Surface-mount 100-ball CSBGA package (8x8 mm). RoHS non-compliant. Packaged in trays. In-stock quantity: 2505 units.

Key Features

MachXO non-volatile FPGA for instant-on control and bridging applications

256 logic elements/cells with 32 LAB/CLB blocks

78 user I/O pins for flexible interfacing

1.14V to 1.26V core supply for low-power operation

Commercial temperature range 0°C to 85°C (TJ)

Compact 100-ball CSBGA (8x8 mm) footprint

Surface-mount assembly, supplier device package: 100-CSBGA (8x8)

Part of the Lattice MachXO series (Base PN: LCMXO256)

Key Advantages

Instant-on behavior helps meet fast boot and control sequencing needs

Small footprint saves PCB area in space-constrained designs

Low core voltage reduces system power

Simple, reliable configuration (non-volatile MachXO architecture)

Easy fit for glue logic, interface adaptation, and system management tasks

Packaging

Type: CSBGA (Chip Scale Ball Grid Array); also referenced as 100-LFBGA or CSPBGA in some sources

Ball count and size: 100-ball array; body size 8x8 mm

Mounting: Surface Mount (SMT)

Shipment: Tray packaging for safe handling and automated assembly

Pin configuration: 78 I/O balls plus power, ground, and control pins; see datasheet ball map for exact assignments

Thermal characteristics: Commercial junction temperature 0°C to 85°C (TJ); detailed θJA/θJC values and thermal guidelines are in the datasheet

Electrical properties: Core supply 1.14V to 1.26V; I/O standards and voltage levels depend on bank configuration—refer to the datasheet for supported standards and limits

Materials: Standard BGA construction (mold compound and organic substrate typical); exact materials and finishes are specified in the datasheet

Lifecycle

Current status: Active in many programs; status can change based on manufacturer guidance

Nearing discontinuation: No public indication at this time, but confirm for long-life designs

Equivalent/alternative options:

- Same family and density in other speed grades or packages: LCMXO256E variants (different suffixes may change speed, temperature grade, or package)

- Higher-density MachXO family parts (e.g., LCMXO640E, LCMXO1200E) if more logic or I/O is needed

- Newer-generation families (MachXO2, MachXO3) if you need more features, lower power, or broader I/O standards

- Pin-for-pin compatibility must be verified in the datasheet and package ball map

If you need a precise, drop-in or functional cross, please contact our sales team via our website for tailored recommendations

Key Application Areas

System control and sequencing (power management, reset, clock gating)

Interface bridging and protocol adaptation

Glue logic to connect MCUs, sensors, and peripherals

I/O expansion and simple state machines

Board-level management, status aggregation, and LEDs

Consumer, industrial, and communications equipment needing fast boot logic

Datasheet

Our website hosts the most authoritative datasheet for LCMXO256E-3M100C. For complete specifications, ball maps, timing, electrical limits, and design guidelines, download the datasheet directly from this page.

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