Texas Instruments LMH6629SD/NOPB

Mfr. Part

LMH6629SD/NOPB

Manufacturer

Luminary Micro/Texas Instruments. Y-IC is a quality distributor of this brand and we will provide you with the best products and services.

Detailed Description

Single high-speed, low-noise voltage-feedback operational amplifier in a compact 8-WSON (3x3 mm) package with exposed thermal pad. Wide 900 MHz small-signal bandwidth, high slew capability, and strong output drive for buffers, filters, and ADC/DAC interfaces. Operates from a 2.7 V to 5.5 V single supply. Industrial temperature range -40°C to 125°C. RoHS3 compliant, lead-free NOPB. Mounting is surface-mount. Supplied in Tape & Reel for automated assembly. Base product number LMH6629. Main category Integrated Circuits (ICs), small classification Linear – Amplifiers – Instrumentation, OP Amps, Buffer Amps.

Key Features

Architecture – voltage feedback op amp

Bandwidth – 900 MHz (-3 dB)

Channels – 1

Supply range – 2.7 V to 5.5 V

Supply current – 15.5 mA typical

Output drive – up to 250 mA per channel

Slew rate – 1600 V/s (as provided, please confirm units in the datasheet)

Input bias current – 15 A (as provided, please confirm units in the datasheet)

Input offset voltage – 150 V (as provided, please confirm units in the datasheet)

Operating temperature – -40°C to 125°C

Package – 8-WSON (3x3) with exposed pad, also referenced as 8-WFDFN Exposed Pad

RoHS – RoHS3 compliant, NOPB lead finish

Mounting – surface mount

Shipment – Tape & Reel (TR)

Supplier device package – 8-WSON (3x3)

Key Advantages

Very wide bandwidth for clean, fast signal amplification

High slew capability helps keep step and pulse responses sharp

Strong output drive can handle cables, filters, and low-impedance loads

Works from low 2.7 V supplies up to 5.5 V for flexible power designs

Tiny 3x3 mm WSON saves board space

Exposed thermal pad improves heat dissipation for reliable operation

Industrial temperature rating supports harsh environments

Voltage-feedback topology offers simple gain setting and predictable stability

Packaging

Package type – 8-WSON (3x3) / 8-WFDFN with exposed thermal pad; supplier device package 8-WSON (3x3)

Materials – lead-free “Green” molding compound, copper leadframe, NOPB lead finish (NiPdAu typical for TI NOPB)

Size – 3 mm x 3 mm body, low profile

Pin configuration – 8 leads plus center exposed pad. Typical single op amp functions include IN+, IN−, OUT, V+, V−, and NC pins. See datasheet for exact pinout and functions.

Thermal characteristics – exposed pad improves heat flow to PCB; follow TI land pattern and connect pad per datasheet guidance; thermal vias recommended to lower thermal resistance

Electrical properties summary (from provided data) – 1 circuit; supply 2.7–5.5 V; supply current 15.5 mA; -3 dB bandwidth 900 MHz; output current 250 mA; slew 1600 V/s (confirm units); input bias 15 A (confirm units); input offset 150 V (confirm units)

Shipment packaging – Tape & Reel (TR) for automated pick-and-place

Lifecycle

Current status – active. Not reported as nearing discontinuation based on publicly available information.

Direct drop-in equivalents – none guaranteed at this time

Alternatives – performanceor package-adjacent options may exist depending on your bandwidth, noise, drive, supply, and pinout needs; because drop-in compatibility cannot be assured, please contact Y-IC sales for a tailored cross

If you need second-source planning or last-time-buy guidance – contact our team via the website for the latest PCN/LTB updates and vetted equivalents

Key Application Areas

High-speed signal buffering and gain stages

ADC and DAC input/output drivers

Video and imaging signal chains

Test and measurement front ends and active filters

Communication IF/baseband amplification

Cable drivers and transmission-line interfaces

Wideband sensor and photodiode interfaces using voltage-feedback topologies

Datasheet

Our website hosts the most authoritative datasheet for LMH6629SD/NOPB. We recommend downloading it from this page for complete specifications, pinout, layout and thermal guidance, and application notes.

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