Intel EPF10K50SBC356-3

Mfr. Part

EPF10K50SBC356-3

Manufacturer

Intel (formerly Altera). Y-IC is a quality distributor of Intel devices. We provide genuine parts, fast delivery, and responsive technical and sales support to give you the best products and services.

Detailed Description

FLEX-10KS family FPGA for embedded and glue-logic applications. 2.5 V core operation, 356-ball LBGA package, 220 user I/Os, and on-chip RAM. Optimized for legacy and long-life designs that need stable availability and proven tool flows.

Key Features

Series: FLEX-10KS (Intel/Altera legacy FPGA family)

Logic: 2,880 logic elements (approx. 199k system gates)

Logic array blocks: 360 LABs/CLBs

On-chip RAM: 40,960 bits total

I/O: 220 user I/O pins

Supply voltage (core): 2.375 V to 2.625 V (nominal 2.5 V)

Package: 356-BGA (LBGA), approx. 35 x 35 mm body

Operating temperature: 0°C to +70°C (commercial)

Mounting: Surface mount

Configuration and debug: JTAG boundary-scan supported; external configuration memory required

Base product number: EPF10K50

Category: Integrated Circuits (ICs) → Embedded FPGAs

Key Advantages

Proven, stable platform for maintaining and extending legacy systems

2.5 V core reduces power versus older 3.3/5 V families

High I/O count in a compact BGA body for dense boards

Mature ecosystem and documentation simplify sustainment engineering

Available from Y-IC with professional sourcing and support

Current available quantity reference: 1486 units (subject to change; confirm on our website)

Packaging

Shipment type: Tray (factory standard for BGA)

Package style: 356-LBGA (Low-Profile Ball Grid Array)

Body size: approximately 35 mm × 35 mm

Ball count and function: 356 total balls; 220 user I/O; remaining balls for power, ground, configuration, and JTAG

Materials: Organic BGA substrate with solder balls; leaded and Pb-free variants may exist depending on suffix and date code

Thermal characteristics: Commercial temp grade 0°C to +70°C ambient; actual junction temperature depends on design power and cooling; ensure adequate copper pour/airflow

Electrical considerations: Core supply 2.375–2.625 V; I/O standards per family guidelines (verify bank voltages and standards in the datasheet); observe ESD precautions during handling

Lifecycle

Status: Mature/legacy. Many FLEX-10K family parts are NRND or discontinued by Intel; availability is limited to existing stock and remaining supply chains.

Pin-compatible/same-family alternatives (verify speed grade, temperature, and RoHS status):

- EPF10K50SBC356-2 (faster speed grade, same package)

- EPF10K50SBC356-1 (fastest speed grade, same package)

- EPF10K50SBC356-3N (commonly referenced Pb-free/RoHS variant; confirm exact ordering code)

Functional (not pin-compatible) migration alternatives from Intel (requires redesign and revalidation):

- Cyclone 10 LP (e.g., 10CL025 family members)

- Cyclone IV E (e.g., EP4CE series)

- MAX 10 (e.g., 10M08/10M16) for non-volatile needs

If you need exact drop-in guidance or cannot find a suitable alternative, contact our sales team via the Y-IC website for detailed cross-references and lifecycle confirmations.

Key Application Areas

Industrial control, PLCs, motion control, and instrumentation

Telecommunications and networking line cards

Test and measurement equipment

Consumer and office electronics that rely on legacy logic

Medical and scientific equipment (non-life-support)

Aerospace/defense ground equipment sustaining programs (commercial temp rating—verify environment)

General-purpose glue logic, bus bridging, and interface adaptation

Datasheet

The most authoritative and up-to-date datasheet for EPF10K50SBC356-3 is available on our Y-IC product page. We recommend downloading it directly from this page to get electrical characteristics, I/O standards, timing models, configuration options, and mechanical drawings.

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