Intel EP2AGZ350FF35I3

Mfr. Part

EP2AGZ350FF35I3

Manufacturer

Intel — Y-IC is a quality distributor for Intel. We supply genuine Intel products and deliver the best service, technical support, and fulfillment to our customers

Detailed Description

Arria II GZ family FPGA with very high logic density

348,500 logic elements and 13,940 LABs or CLBs

21270528 total RAM bits for large on-chip storage

554 user I or O for rich interface capability

1152-ball FCBGA package 35 mm x 35 mm

Industrial operating range TJ -40°C to 100°C

Core supply 0.87 V to 0.93 V for power efficiency

Surface-mount device and RoHS compliant

Base product number EP2AGZ350

Available quantity 2661 units

Standard tray packing for shipping and assembly

Key Features

High-density logic fabric for complex designs

Large embedded memory for FIFOs, buffers, and data processing

High I or O count for wide parallel interfaces and multiple peripherals

Low core voltage for reduced power consumption

Industrial-grade temperature range for harsh environments

Arria II GZ family capabilities including LVDS I or O and advanced clocking with multiple PLLs

Supports common FPGA workflows and IP cores within Intel toolchains

Broad ecosystem and design support for faster time to market

Key Advantages

Balanced performance and power for mid to high complexity systems

Strong reliability with mature silicon and proven tooling

Flexible I or O standards to connect to a wide range of interfaces

Large on-chip memory reduces external memory needs in many designs

Scalable architecture suitable for upgrades and design reuse

Well-supported by Intel and distributor networks including Y-IC

Packaging

Type FCBGA flip-chip ball grid array for high performance

Material lead-free RoHS compliant package with organic substrate and solder balls

Size 35 mm x 35 mm body 1152-ball array

Pin or ball configuration 1152 balls total with 554 user I or O available across banks consult datasheet for bank maps and ball pitch

Mounting surface mount compatible with standard reflow processes

Thermal characteristics junction temperature -40°C to 100°C use proper heatsinking and airflow design per thermal guidelines

Electrical properties core supply 0.87 V to 0.93 V typical I or O standards include LVCMOS and LVDS consult datasheet for full list and bank voltages

Supplier device package 1152-FBGA 35x35

Shipping package tray for pick-and-place readiness

Lifecycle

This device is from a mature legacy Intel Arria II GZ family. Availability may be limited depending on region and demand. For long-term programs or new designs we recommend evaluating newer families

No direct pin-compatible drop-in equivalents are available across families

Suggested functional alternatives for migration planning

Intel Arria V GX or GZ for next-generation midrange capability

Intel Arria 10 for higher performance and transceiver advancements

Intel Cyclone 10 or Cyclone V for lower power and cost-sensitive designs

Intel Stratix IV or V for higher-end applications if needed

AMD Xilinx Kintex-7 or Artix-7 as cross-vendor options when appropriate

Contact Y-IC sales for detailed cross-reference, availability checks, last-time-buy options, and lifecycle guidance via our website

Key Application Areas

Wired communications and networking switches, routers, and line cards

Industrial control, automation, and motion systems

Test and measurement instruments and data acquisition

Broadcast and video processing pipelines

Security, surveillance, and image processing

Medical equipment and diagnostics where high reliability is needed

Aerospace and defense non-radiation-tolerant roles with industrial temp range

Protocol bridging, custom accelerators, and high-speed I or O expansion

Datasheet

Y-IC provides the most authoritative datasheet and technical resources for EP2AGZ350FF35I3 on our product page. We recommend downloading the datasheet here to get exact pin maps, electrical tables, timing, transceiver options, and design guidelines

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