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| Part Number: | 10M04DCU324A7G |
|---|---|
| Manufacturer/Brand: | Intel |
| Part of Description: | IC FPGA 246 I/O 324UBGA |
| Datasheets: |
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| RoHs Status: | RoHS Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $10.4782 |
| 200+ | $4.0554 |
| 500+ | $3.9136 |
| 1000+ | $3.8433 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.15V ~ 1.25V |
| Total RAM Bits | 193536 |
| Supplier Device Package | 324-UBGA (15x15) |
| Series | MAX® 10 |
| Package / Case | 324-LFBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Number of Logic Elements/Cells | 4000 |
| Number of LABs/CLBs | 250 |
| Number of I/O | 246 |
| Mounting Type | Surface Mount |




10M04DCU324A7G
Intel
Y-IC is a quality distributor of Intel. We provide genuine parts, fast delivery, and professional technical support to help you build reliable products with lower risk and lower total cost.
MAX 10 family non-volatile FPGA with on-chip configuration flash
4000 logic elements (LEs) and 250 LABs/CLBs for flexible logic implementation
193,536 total RAM bits for buffering and data processing
246 user I/O in a compact 324-UBGA (15 x 15 mm) LFBGA package
Core supply 1.15 V to 1.25 V for low-power operation
Industrial to extended junction temperature range -40°C to +125°C (TJ)
Surface-mount, tray packaging, RoHS compliant
Ideal for instant-on control, bridging, sensor fusion, and embedded logic offload
Single-chip, instant-on FPGA with integrated configuration flash (no external configuration device needed)
Rich I/O mix with multiple voltage banks and support for common single-ended and differential I/O standards
Embedded memory blocks and soft CPU support (e.g., Nios II) for control-plane tasks
PLL-based clock management for clean clocking and frequency synthesis
In-system programmability via standard JTAG
On-chip security features such as configuration protection and CRC error checking
Family options include versions with integrated 12-bit ADC and user flash memory (availability depends on specific device option in the MAX 10 family)
Faster power-up and deterministic behavior thanks to non-volatile configuration
Lower BOM cost and smaller PCB area by eliminating external configuration memory
Low power and extended temperature capability improve reliability in harsh environments
Scalable within the MAX 10 family for easy migration to higher density if your design grows
Shorter development time with a mature toolchain and extensive ecosystem
Type and form factor
- 324-UBGA / 324-LFBGA, body size 15 mm x 15 mm, lead-free, RoHS compliant
- Supplied in trays for automated assembly
Pin configuration
- 324-ball BGA matrix with 246 user I/O available (banked I/O organization for voltage flexibility; refer to pinout file for exact ball map)
Materials and assembly
- Molded LFBGA package on organic substrate, Pb-free balls
- Designed for standard Pb-free reflow profiles
Thermal characteristics
- Junction temperature range -40°C to +125°C (TJ)
- Actual thermal performance (θJA/θJC) depends on PCB stack-up, copper area, airflow, and heatsinking; follow Intel thermal guidelines
Electrical properties
- Core voltage 1.15 V to 1.25 V
- I/O bank voltages depend on chosen I/O standards; consult the I/O handbook for supported levels and limits
- JTAG-based configuration and in-system programmability
Status
- Active and orderable in the Intel MAX 10 family as of today
- Not approaching end-of-life based on publicly available guidance; always check with Y-IC sales for the latest PCN/EOL updates
Equivalent or alternative models
- Same family, higher density in same 324-UBGA footprint
- 10M08DCU324A7G (higher logic density; check power, timing, and pinout differences before use)
- Same family, different packages and densities (check device options and pinouts)
- MAX 10 10M04/10M08 devices are available in other packages such as 256-ball BGA and select QFP options
- Other Intel families for higher performance or different features
- Cyclone series devices for more logic, higher speed interfaces, or expanded memory (pin-to-pin compatibility is not implied)
If you need a drop-in or functionally equivalent alternative beyond the list above, contact our Y-IC sales team via our website. We will recommend verified substitutes matched to your constraints (pinout, power, temperature, availability).
Industrial control, PLC expansion, and deterministic I/O
Motor control, power conversion, and protection
Sensor aggregation, filtering, and time-critical preprocessing at the edge
Protocol bridging, interface adaptation, and legacy bus extension
Human-machine interface control, simple display/touch bridges
Automotive and transportation subsystems requiring instant-on and extended temperature (confirm grade and qualifications for your target standard)
The most authoritative and up-to-date datasheet for 10M04DCU324A7G is available on our website. We recommend downloading it from this page to get exact pinouts, electrical limits, configuration options, and design guidelines.
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