English
| Part Number: | MC56F81768VLH |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC DSC 128KB/20KB LQFP64 |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $10.5725 |
| 10+ | $10.0474 |
| 30+ | $9.138 |
| 100+ | $8.3432 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - I/O | 3.30V |
| Voltage - Core | 2.7V, 3.6V |
| Type | - |
| Supplier Device Package | 64-LQFP (10x10) |
| Series | 56F8xxx |
| Package / Case | 64-LQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C (TA) |
| On-Chip RAM | 20kB |
| Non-Volatile Memory | FLASH (128kB) |
| Mounting Type | Surface Mount |
| Interface | I²C, SCI, SPI |
| Clock Rate | 100MHz |
| Base Product Number | MC56F81768 |




The NXP MC56F81768VLH is a high-performance digital signal controller (DSC) built upon the 32-bit 56800EX core architecture. Designed with both DSP and MCU functionality unified on a single chip, the MC56F81768VLH is suitable for a broad spectrum of embedded and industrial applications, such as motion control, industrial automation, smart sensors, inverters, medical monitoring, and power management systems. Housed in a 64-pin LQFP package, the device offers robust features that cater to high-speed, deterministic, and real-time processing tasks essential in modern engineering environments.
At the heart of the MC56F81768VLH lies the 32-bit 56800EX core, employing a modified dual Harvard architecture with three internal address buses and four internal data buses. The architecture enables concurrent instruction fetches and dual data accesses in the same cycle, optimizing efficiency for complex signal processing algorithms. The controller reaches up to 100 MIPS at a 100 MHz core frequency in fast mode, supporting both fractional and integer arithmetic, with a comprehensive instruction set of 162 basic instructions. Key hardware features include single-cycle multipliers for both 16x16- and 32x32-bit operations, four 36-bit accumulators, parallel instruction processing, and zero-overhead context switching with full shadowing of the register stack. Interrupt management supports nested and prioritized interrupts, with up to five levels; two fast interrupts are programmable for responsiveness in critical controls.
The MC56F81768VLH integrates up to 128 KB of flash memory, accompanied by 20 KB of RAM. Both program and data memory spaces are accessible via flexible mapping, enabling efficient resource utilization for embedded firmware. A dedicated boot ROM facilitates convenient initialization from serial communication interfaces such as SCI and I2C. The device’s memory subsystem supports rapid access and reliability, with electrical characteristics ensuring high endurance and retention—ideal for applications demanding frequent programming cycles.
MC56F81768VLH offers a powerful analog subsystem, featuring two high-speed, 12-bit ADCs each with dynamic programmable gain amplifiers (x1, x2, x4), supporting both single-ended and differential conversions. Additionally, the device incorporates two operational amplifiers (OPAMPs), programmable for gain up to x16, and up to four analog comparators, each with integrated 8-bit DAC references and selectable input sources. Engineers can benefit from the versatile 12-bit DAC with waveform generation capabilities for applications like slope compensation and internal routing to comparators. Built-in temperature sensors and sophisticated protection mechanisms, such as current injection protection and input filters, enable precision and stability for advanced control systems.
For precise motor and power control, the MC56F81768VLH includes a high-resolution eFlexPWM module, delivering up to 12 PWM outputs (8 channels with 312ps NanoEdge placement resolution). The module offers fractional delay techniques for arbitrary edge placement, double-buffering, synchronous reloads, programmable deadtime, and fault input monitoring—features tailored to serve fine-grained motor drive and inverter topologies. The device is equipped with quad timer modules (four 16-bit counters) supporting various operating modes, and period interrupt timers (PITs) for periodic task management even in low-power modes. A dedicated quadrature decoder facilitates encoder-based feedback in real-time motion systems, with digital filtering and position monitoring.
Addressing a broad range of connectivity options, the MC56F81768VLH integrates up to two high-speed queued SCI modules (with LIN slave support), one QSPI, and two LPI2C modules for bus communications. The QSCI modules provide full-duplex, baud-rate selection, and error detection; QSPI supports baud rates up to 25 Mbit/s with deep FIFOs and programmable transaction modes. LPI2C controllers accommodate standard through ultra-fast I2C protocols, supporting multi-master arbitration, clock stretching, 7/10-bit addressing, SMBus alert, and packet-level features critical for robust field bus integration. Each module is engineered for low-latency transactions—a necessity for multi-protocol system designs.
The MC56F81768VLH, in its 64-pin LQFP package, presents input/output signals organized into functional groups for analog, digital, control, and power domains. Each pin’s default and alternate functions are selectable through register configuration. All GPIO ports enable per-pin input/output direction and mode management, with programmable push-pull/open-drain outputs and configurable pull-ups/pull-downs. System designers must account for signal multiplexing and ensure proper initialization for desired operational modes, as tri-state conditions are active post-reset until GPIO configuration is complete.
The device operates within a supply voltage range of 2.7 V to 3.6 V; temperature options vary from -40°C to 105°C (V grade) and up to 125°C (M grade). Protective circuits guard against ESD and electrical overstress, with recommended handling procedures. The MC56F81768VLH includes comprehensive brown-out, low-voltage, and power-on reset monitoring. Thermal resistance and dissipation parameters should be calculated according to JEDEC guidelines, factoring in ambient conditions and PCB layout. Capacitance, switching characteristics, and current consumption specifications provide a solid basis for EMC, signal integrity, and power budgeting during PCB design.
Effective use of the MC56F81768VLH demands specific attention to electrical and thermal design practices. Key guidelines include low-impedance power routing, distributed bypass/decoupling capacitors at all supply pins, minimization of analog/digital crosstalk via layout and plane segregation, and meticulous attention to reference and analog ground routing. For ADC inputs, additional filtering minimizes PCB impedance-induced artifacts. Power-on sequencing requires managing VDD and VDDA within 100 mV to prevent substrate leakage and device misoperation. Initialization routines should accommodate supply settling before bringing peripherals—especially PLL and ADC—online. EMC considerations suggest adherence to NXP’s “EMC design” notes and robust ESD management wherever possible.
Beyond the standard 64-pin LQFP, the MC56F81xxx series encompasses variants with 48-pin and 32-pin LQFP/QFN options (availability subject to customer demand). Each package is uniquely marked per NXP’s code format and features, with specific part number fields identifying core, temperature, memory, and package families. For traceability and production management, engineers should consult the latest NXP documentation and package drawings available via the manufacturer’s portal.
Engineers seeking alternatives or replacements for MC56F81768VLH within the same performance envelope can investigate other MC56F81xxx family members, which offer varied RAM/flash capacities, temperature ratings, and package configurations. Selection should consider peripheral compatibility, package size, and maximum frequency requirements specific to the target application. For cross-brand comparisons, review integrated DSCs or MCUs that combine high-speed DSP engines with analog/motion control peripherals and similar volatile/non-volatile memory footprints.
The NXP MC56F81768VLH DSC provides a highly integrated, deterministic platform for data-intensive, real-time embedded applications. Its balanced blend of advanced core architecture, comprehensive analog/digital peripherals, robust memory resources, and engineered support for reliable operation positions it as a premium choice for motion control, industrial sensing, and smart energy solutions. By adhering to best practices in electrical and thermal design, and leveraging the documented features and package selection guidance, engineers can achieve optimal system performance and longevity with the MC56F81768VLH.
IC MCU 32BIT 16KB FLASH 32LQFP
IC MCU 32BIT 16KB FLASH 48LQFP
IC DSC 128KB/20KB LQPF48
IC MCU 32BIT 32KB FLASH 32QFN
IC DSC 128KB/20KB LQPF48
IC MCU 32BIT 16KB FLASH 48LQFP
IC MCU 32BIT 64KB FLASH 64LQFP
32-BIT DSC, 56800EX CORE, 64KB F
IC DSC 64KB/12KB LQPF48
IC DSC 128KB/20KB LQFP64
IC MCU 16B 512KB FLASH 160MAPBGA
32-BIT DSC, 56800EX CORE, 128KB
IC MCU 16B 512KB FLASH 160MAPBGA
32-BIT DSC, 56800EX CORE, 64KB F
IC DSC 64KB/12KB LQFP64
IC MCU 32BIT 16KB FLASH 32LQFP
IC MCU 32BIT 64KB FLASH 64LQFP
FREESCALE LQFP32
32-BIT DSC, 56800EX CORE, 128KB
IC MCU 16BIT 512KB FLASH 160LQFP
June 15th, 2026
June 11th, 2026
June 5th, 2026
May 28th, 2026
May 22th, 2026
May 12th, 2026
May 8th, 2026
April 28th, 2026
April 20th, 2026
April 17th, 2026
April 8th, 2026
March 31th, 2026
March 23th, 2026
March 20th, 2026
March 9th, 2026
March 4th, 2026
February 28th, 2026
February 3th, 2026
January 28th, 2026
January 19th, 2026
January 16th, 2026
January 9th, 2026
December 29th, 2025
December 25th, 2025
December 17th, 2025
December 10th, 2025
December 4th, 2025
November 25th, 2025
November 20th, 2025
November 11th, 2025
November 3th, 2025
October 30th, 2025
October 22th, 2025
October 16th, 2025
October 9th, 2025
September 28th, 2025
September 17th, 2025
September 9th, 2025
September 1th, 2025
August 25th, 2025
August 20th, 2025
July 3th, 2025
December 18th, 2024
June 21th, 2023
April 27th, 2023
July 1th, 2022
March 4th, 2021
September 10th, 2020
January 23th, 2020
0 Articles




June 26th, 2026
June 26th, 2026
June 25th, 2026
June 25th, 2026
MC56F81768VLHNXP USA Inc. |
Quantity*
|
Target Price(USD)
|