NXP USA Inc. SPC5643LAMLL6

Mfr. Part

SPC5643LAMLL6

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

32-bit dual-core automotive microcontroller based on Power Architecture e200z4

64 MHz operating frequency for real-time control

1 MB on-chip Flash and 128 KB on-chip SRAM

Rich automotive connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART

Integrated peripherals: DMA, PWM, watchdog (WDT), power-on reset (POR)

32-channel, 12-bit ADC for precise analog measurement

Wide supply range 3.0 V to 5.5 V for flexible system designs

Internal oscillator, supports external clock/crystal if needed

Package 100-LQFP (14 x 14 mm), surface-mount

Operating temperature -40°C to +125°C (TA), automotive grade

RoHS3 compliant, lead-free

Part of the MPC56xx Qorivva series

Base product number SPC5643

Key Features

Dual-core e200z4 architecture with lockstep capability for safety-critical applications

1 MB Flash with ECC for data integrity and reliable program storage

128 KB SRAM with ECC for robust runtime memory

64 MHz CPU clock for responsive control loops

32-channel 12-bit ADC for multi-sensor systems

CAN, FlexRay, LIN, SPI, UART for broad vehicle network compatibility

DMA for efficient data movement with low CPU overhead

PWM timers for motor control and actuator driving

Watchdog and POR for safe startup and runtime monitoring

Internal oscillator, external clock support

Wide supply voltage 3.0–5.5 V

Automotive temperature range -40°C to +125°C

100-LQFP package for cost-effective assembly and proven reliability

Key Advantages

Designed for automotive safety and reliability with lockstep dual-core and ECC memories

FlexRay support enables modern, deterministic in-vehicle networking

Broad bus support simplifies integration in mixed network vehicles (CAN, LIN, FlexRay)

Robust analog performance with 32 x 12-bit ADC channels

Strong ecosystem and toolchain from NXP’s Qorivva family and AUTOSAR support

Wide supply range and temperature rating reduce power and thermal design constraints

LQFP package lowers assembly cost and simplifies PCB routing compared to BGAs

RoHS3 compliance helps meet environmental and regulatory requirements

Packaging

Type Tray

Package 100-LQFP (Low-Profile Quad Flat Package), 14 x 14 mm body size

Material Molded plastic epoxy, lead-free finish, RoHS3 compliant

Pin count 100 leads, quad-sided gull-wing leads

Typical lead pitch 0.5 mm (confirm exact pitch in the datasheet)

Mounting Surface-mount technology

Pin configuration 100 pins arranged on four sides; full pinout and functions are provided in the datasheet

Thermal characteristics Thermal performance depends on PCB design, copper area, and airflow; typical thermal resistance values (θJA/θJC) are provided in the datasheet

Electrical properties Supply 3.0–5.5 V; I/O levels compatible with common automotive interfaces; integrated ESD protection; detailed electrical characteristics in the datasheet

Moisture sensitivity Typical MSL 3 for LQFP devices (verify exact MSL in the datasheet)

Lifecycle

Status Widely used in automotive and industrial markets; commonly supported in long-lifecycle programs

Not currently flagged as near end-of-life based on general market use. For the latest lifecycle status, contact Y-IC sales for confirmation.

Equivalent or alternative models from NXP

- MPC5643L 1 MB Flash, dual-core e200z4, similar performance; available in multiple packages including LQFP

- MPC5642L ~768 KB Flash, dual-core e200z4; similar peripherals; potential drop-in in some designs with memory trade-offs

- MPC5644A 1.5 MB Flash, e200z4; more memory and features; suitable for designs needing extra headroom

- MPC5645L 2 MB Flash, dual-core; higher memory capacity; check pinout/package differences

- MPC5744P Power Architecture, safety-oriented, CAN and FlexRay; newer platform for ASIL-focused designs

- MPC5775E/M Safety MCUs with advanced peripherals; check feature alignment and package options

If you need exact drop-in equivalents or pin-to-pin alternatives, contact Y-IC via our website. We will match requirements like memory size, package, FlexRay, and safety features.

Key Application Areas

Automotive safety and body control modules

Chassis systems such as ABS/ESC, electric power steering (EPS)

Airbag controllers and safety gateways

Powertrain subsystems and engine/transmission support functions

Instrument clusters and driver information systems

Motor control and actuator control in vehicles and industrial equipment

Vehicle network gateways bridging CAN, LIN, and FlexRay

Industrial automation and robotics requiring deterministic control

Datasheet

Y-IC hosts the most authoritative datasheet for SPC5643LAMLL6 on our product page. Download it now to get exact pinouts, timing, electrical limits, and thermal data.

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