NXP USA Inc. SPC5603BAVLH4R

Mfr. Part

SPC5603BAVLH4R

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

32-bit automotive-grade microcontroller from the MPC56xx Qorivva family, built on the e200z0h Power Architecture core. It integrates 384KB embedded Flash, 28KB RAM, 64KB EEPROM, rich communication interfaces (CAN, LIN, SPI, SCI, I2C), and a 12-channel 10-bit ADC. Packaged in a compact 64-LQFP (10 x 10 mm), suitable for high-reliability automotive and industrial control systems. Operating temperature: -40°C to +105°C. RoHS3 compliant.

Key Features

Core: e200z0h 32-bit single-core at up to 48 MHz

Program Flash: 384KB (384K x 8)

RAM: 28KB (28K x 8)

EEPROM: 64KB (64K x 8)

I/O: 45 general-purpose pins

Connectivity: CAN bus, LIN bus, SPI, SCI (UART), I2C

Peripherals: DMA, PWM, POR, WDT

ADC: 12 channels, 10-bit resolution

Oscillator: Internal

Supply Voltage: 3.0V to 5.5V

Package: 64-LQFP (10 x 10 mm), Tape & Reel

Operating Temperature: -40°C to +105°C (TA)

Series: MPC56xx Qorivva

RoHS: ROHS3 Compliant

Key Advantages

Automotive-grade reliability with wide temperature range

Strong communication set (CAN, LIN, SPI, SCI, I2C) for vehicle networks and industrial buses

On-chip Flash, RAM, and EEPROM for code, data logging, and configuration storage

Internal oscillator simplifies design and reduces external component count

Efficient 32-bit Power Architecture core for deterministic real-time control

Integrated safety-oriented peripherals (WDT, POR) for robust system operation

Broad supply range (3.0–5.5V) fits 5V legacy systems and modern 3.3V designs

Mature ecosystem and tooling support from the Qorivva family

Packaging

Type: 64-LQFP, Tape & Reel (TR) for automated assembly

Body Size: 10 x 10 mm nominal

Material: Molded epoxy plastic package with copper alloy leadframe; matte tin lead finish

Pin Configuration: 64 gull-wing leads; typical pitch 0.5 mm; 45 GPIOs available, remaining pins include power, ground, and interface pins

Thermal Characteristics: Supports -40°C to +105°C ambient; final thermal performance depends on PCB copper area, vias, and airflow (use thermal vias and ground pour for better heat spreading)

Electrical Properties: Designed for 3.0–5.5V operation; ESD and MSL ratings per datasheet; maintain proper decoupling near VDD/VSS pins for noise and stability

Mounting Type: Surface Mount (SMT)

Case References: 64-LQFP (10x10), Supplier Device Package 64-LQFP (10x10)

Lifecycle

Status: Mature, widely deployed in automotive and industrial systems. No near-term discontinuation is indicated as of the latest public information. For the most current status, confirm with our sales team.

Equivalent/Alternative Models (same family, different memory or package; verify pinand software-compatibility via datasheet):

- SPC5601B family variants (lower Flash/RAM)

- SPC5602B family variants (mid Flash/RAM)

- SPC5604B family variants (higher Flash/RAM)

- MPC5603B family equivalents from NXP in 64-LQFP and other packages

- Related Qorivva MPC560xB parts with similar core and peripheral sets

If you need drop-in or near drop-in replacements, or long-term supply options, contact our sales team on the Y-IC website for a detailed compatibility check and the latest recommendations.

Key Application Areas

Automotive body control modules (BCM) and gateway nodes

Instrument clusters and dashboard controllers

Motor control (window lifts, seat adjusters, HVAC blowers)

Lighting control (exterior and interior lighting, PWM dimming)

Steering column and door modules

Industrial control and automation nodes using CAN/LIN/SPI/UART

Smart sensors and actuators with local processing and network connectivity

General-purpose embedded control requiring robust real-time performance

Datasheet

Y-IC provides the most authoritative datasheet for SPC5603BAVLH4R on our product page. We recommend downloading it now to get full electrical, timing, pinout, and mechanical details.

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