NXP USA Inc. S912XES384F1MAA

Mfr. Part

S912XES384F1MAA

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

16-bit HCS12X microcontroller with 384KB embedded flash, 24KB RAM, and 4KB EEPROM in an 80-QFP (14 x 14 mm) package. Runs up to 50 MHz with wide 1.72 V to 5.5 V supply range. Offers rich on-chip peripherals, including an 8-channel 12-bit ADC, CANbus, SPI, SCI, IrDA, EBI/EMI, PWM, WDT, LVD, and POR. Designed for harsh environments with -40°C to +125°C operating temperature and RoHS3 compliance. Surface-mount tray packaging. Base product family: S912, Series: HCS12X.

Key Features

Core: HCS12X 16-bit

Frequency: up to 50 MHz

Program memory: 384KB FLASH (384K x 8)

RAM: 24KB (24K x 8)

EEPROM: 4KB (4K x 8)

ADC: 8 channels, 12-bit

Peripherals: PWM, Watchdog (WDT), Low-Voltage Detect (LVD), Power-On Reset (POR)

Connectivity: CANbus, EBI/EMI, IC (listed; commonly refers to I2C), IrDA, SCI, SPI

I/O: 59 configurable I/O lines

Supply voltage: 1.72 V to 5.5 V

Oscillator: external

Package / case: 80-QFP (14 x 14 mm)

Operating temperature: -40°C to +125°C (TA)

Compliance: RoHS3

Key Advantages

Mature, proven HCS12X architecture widely used in automotive and industrial designs

Large nonvolatile memory mix (384KB FLASH + 4KB EEPROM) for application code, parameters, and calibration data

Robust CANbus and multiple serial interfaces enable easy integration into networked systems

Wide supply range supports both low-voltage and traditional 5 V systems

Extended temperature range for reliable operation in harsh environments

8-channel 12-bit ADC for precise analog sensing without external converters

Rich peripherals reduce BOM and simplify hardware design

Tray packaging and QFP form factor simplify SMT manufacturing and rework

Packaging

Type: Tray (ideal for automated SMT pick-and-place)

Package / Case: 80-QFP (Quad Flat Package), body approximately 14 x 14 mm

Supplier Device Package: 80-QFP (14 x 14)

Mounting: Surface Mount

Pins: 80 leads total, with 59 user I/O; remaining pins include power, ground, oscillator, debug/programming, and dedicated function pins

Material and compliance: RoHS3 lead-free; typical QFP construction uses epoxy molding compound with copper lead frame (refer to datasheet for exact materials and finishes)

Thermal characteristics: Qualified for -40°C to +125°C ambient operation; for detailed thermal resistance (θJA/θJC) and derating, see the datasheet

Electrical properties related to package: supports external oscillator input; wide Vcc range 1.72 V to 5.5 V; on-package lead geometry designed for stable high-speed operation and reliable solder joints

Lifecycle

Current status: Mature, long-life family widely used in legacy and ongoing designs. Availability can vary by region and demand.

Equivalent or alternatives: Pin-to-pin equivalence cannot be confirmed from the provided data alone. The HCS12/S12X ecosystem includes many density and package variants; exact compatibility depends on memory size, package code, and peripheral set.

Recommendation: Contact our sales team via the Y-IC website for a precise cross-reference, lifecycle confirmation, and validated pin-compatible or functionally equivalent options tailored to your design.

Key Application Areas

Automotive ECUs: body electronics, gateway nodes, instrument clusters, powertrain support modules

Industrial controllers: motor control, programmable controllers, safety interlocks

Building automation: HVAC control, lighting controllers, access systems

Appliances and white goods: user interface control, sensor management, connectivity bridges

Communication gateways: CAN to SPI/SCI/IrDA bridges, legacy protocol interfacing

General embedded systems needing 16-bit performance, robust CAN networking, and extended temperature operation

Datasheet

Y-IC provides the most authoritative datasheet for this model on our product page. For full specifications, pinouts, timing, thermal data, and design guidance, download the datasheet from our website now.

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