NXP USA Inc. MPC8572CLVJAULE

Mfr. Part

MPC8572CLVJAULE

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

High-performance dual-core PowerPC e500 microprocessor from the MPC85xx series. Runs at 1.333 GHz, 32-bit architecture, industrial temperature range, and rich networking I/O. Integrated DDR2/DDR3 memory controllers, four Gigabit Ethernet ports, RapidIO, DUART, high-speed serial interfaces, and signal processing SPE acceleration. Packaged in a 1023-ball flip-chip PBGA for surface-mount assembly. RoHS3 compliant.

Key Features

Core processor: Dual PowerPC e500 (2 cores, 32-bit)

Frequency: 1.333 GHz

Memory: Integrated DDR2 and DDR3 controllers

Ethernet: 4 ports, 10/100/1000 Mbps

High-speed interconnect: RapidIO

Additional interfaces: DUART, HSSI, I2C (listed as IC), and more control/management I/O

Co-processor/DSP: Signal Processing Engine (SPE)

Operating temperature: -40°C to +105°C (TA)

I/O voltages supported: 1.5 V, 1.8 V, 2.5 V, 3.3 V

Mounting: Surface mount

Package: 1023-FCPBGA (33 x 33 mm), also referenced as 1023-BBGA/FCBGA

Series: MPC85xx

Base product number: MPC8572

Compliance: RoHS3 compliant

Key Advantages

Strong performance per watt for networking and embedded control

Dual-core architecture for parallel workloads and higher throughput

Mature PowerPC ecosystem with long-field deployments and robust toolchains

Flexible memory (DDR2/DDR3) for legacy and newer designs

Rich networking I/O (4x GbE) and RapidIO for low-latency interconnect

Industrial temperature range for harsh environments

Proven reliability with flip-chip PBGA packaging for better thermal/electrical performance

Packaging

Type: Flip-Chip Plastic Ball Grid Array (FCPBGA), also noted as FCBGA/BBGA

Size: 33 mm x 33 mm; ball count 1023

Material: Organic substrate with copper routing; lead-free solder balls (RoHS3)

Pin configuration: 1023-ball grid with dedicated banks for core power, DDR2/DDR3 interfaces, Ethernet (RGMII/SGMII depending on configuration), RapidIO lanes, system control, and general purpose I/O. Refer to the ball map in the datasheet for exact assignments.

Thermal characteristics: Designed for -40°C to +105°C ambient; actual junction temperature depends on cooling and board design. Use appropriate heatsink/thermal solution. Follow NXP thermal guidelines for airflow and heat spreaders.

Electrical properties:

- I/O voltage rails: 1.5 V, 1.8 V, 2.5 V, 3.3 V (per interface requirements)

- Separate supplies for core, DDR, and I/O domains (see datasheet power rails)

- ESD protection integrated on standard I/O; implement external protection where required for high-speed ports

Shipping package: Tray (suitable for automated pick-and-place and controlled reflow profiles)

Lifecycle

Status: This is a mature PowerPC-based device. Availability can vary by specific speed grade and package option. Some MPC85xx variants are in long-term support; others may be NRND or approaching end-of-life.

Recommendation: Check current status for MPC8572CLVJAULE with Y-IC sales for up-to-date availability and longevity.

Equivalent/alternative models (functional or migration options; verify compatibility, performance, and pinout):

- NXP QorIQ P2020: Dual-core e500v2, up to ~1.2 GHz, DDR3, multiple GbE; common migration path for networking.

- NXP QorIQ P2010: Single-core e500v2; lower complexity variant.

- NXP QorIQ P1020/P1022: Dual-core/single-core devices with DDR3 and rich I/O; popular in routers and industrial systems.

- NXP MPC8568/MPC8569: PowerQUICC III with QUICC Engine for telecom; similar connectivity focus (not pin-compatible).

- NXP MPC8548/MPC8555: Single-core PowerQUICC III alternatives for simpler designs.

- NXP T1020/T1040: Power Architecture migration with updated cores and I/O (software and board changes required).

- NXP Layerscape LS1043A/LS1046A (ARM-based): Modern networking SoCs with strong performance and low power; requires architecture migration.

If you need drop-in or closest-fit replacements: Contact Y-IC via our website. We will review pinout, thermal, firmware, and performance needs and propose the best path.

Key Application Areas

Enterprise and industrial Ethernet switches and routers

Access and aggregation network equipment

Telecom transport and baseband control platforms

Industrial automation controllers and gateways

Storage appliances and NAS front-end processors

Military/aerospace systems with existing PowerPC software bases

Edge networking and security devices (firewalls, UTM) using accelerated packet handling

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for MPC8572CLVJAULE. Download the datasheet on this page to get full electrical specs, ball maps, thermal guidelines, and design recommendations.

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