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| Part Number: | S29GL256S11DHV020 |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | IC FLASH 256MBIT PARALLEL 64FBGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $5.527 |
| 200+ | $2.1397 |
| 500+ | $2.0639 |
| 1000+ | $2.0274 |
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| Product Attribute | Attribute Value |
|---|---|
| Write Cycle Time - Word, Page | 60ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NOR |
| Supplier Device Package | 64-FBGA (9x9) |
| Series | GL-S |
| Package / Case | 64-LBGA |
| Package | Tray |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Memory Type | Non-Volatile |
| Memory Size | 256Mbit |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel |
| Memory Format | FLASH |
| Base Product Number | S29GL256 |
| Access Time | 110 ns |




The S29GL256S11DHV020 from Cypress Semiconductor represents a 256Mbit parallel NOR flash solution, part of the GL-S family, manufactured with 65-nm MIRRORBIT™ Eclipse technology. Offering a ×16 data bus architecture and a 3.0V CMOS core, this high-density flash memory is designed for applications requiring robust non-volatile storage with fast random and page-mode access. Its page access times can be as low as 15 ns, while random read latencies range from 90 to 120 ns, supporting responsive XIP (execute-in-place) and high-throughput data storage needs. The device has a 512-byte write buffer, optimizing programming speeds and reducing host overhead—significant for firmware storage, boot code, and system data applications in industrial, automotive, and embedded segments.
The S29GL256S11DHV020 is available in several package formats, including 64-ball Fortified BGA (9x9 mm and 13x11 mm), 56-ball Fortified BGA (9x7 mm), and 56-pin TSOP, catering to a variety of PCB designs and thermal/space requirements. Supported temperature grades include industrial (−40°C to +85°C), industrial plus (−40°C to +105°C), and automotive AEC-Q100 grades, making it suitable for high-reliability environments.
A crucial aspect of the S29GL256S11DHV020 device is its flexible address space management. The flash memory employs a uniform sector architecture with 128kB sectors, simplifying memory block management, erase cycles, and boot block schemes. The chip organizes multiple overlayable address spaces:
The main flash memory array, for general data storage and code execution.
Device ID and Common Flash Interface (CFI) space, providing standardized identification and device geometry/configuration data for software auto-detection and compatibility across flash families.
Secure Silicon Region (SSR), a 1024-byte OTP area comprising both factory-programmed and customer-programmable spaces, designed for permanent data and security features.
Advanced Sector Protection (ASP) features, including persistent protection bits (PPB), dynamic protection bits (DYB), PPB lock registers (volatile/OTP), and password-enabled protection—all facilitating granular and multi-level sector protection.
The S29GL256S11DHV020 supports various device modes: standard read, data polling, status register reporting, and overlay mode for alternate address spaces (such as security and configuration regions). A robust mapping and command interface structure allows direct sector-level access, overlay management, and compatibility with legacy software algorithms.
Data integrity and device security are paramount for NOR flash deployment, particularly in critical embedded and automotive uses. The S29GL256S11DHV020 incorporates multiple layers of hardware and software-controlled protection:
Power-up and power-down write inhibit, preventing spurious operations during supply transitions via dedicated control pin logic and voltage lockout mechanisms.
Write protect (WP#) function, safeguarding either the lowest or highest address sector based on configuration, regardless of other ASP settings.
ASP features enable volatile and non-volatile protection at sector granularity. Persistent Protection Bits (PPB) and Dynamic Protection Bits (DYB) allow hardware and firmware to lock/unlock sectors as needed, with PPB states governed by hardware reset or managed through password mechanisms.
Secure Silicon Region, both factory and customer programmable, is OTP-programmable and permanently locked, suitable for storing cryptographic keys, device IDs, or immutable boot vectors.
Password protection adds a further layer—modification of PPB states requires successful entry of a 64-bit password, offering defense against unauthorized sector alteration.
These features empower system architects to implement staged, layered protection models—boot code locking, field-updatable firmware, and tamper resistance—through configuration of S29GL256S11DHV020’s registers and command sequences.
The chip’s read architecture supports both asynchronous random access and page-mode operations. Each initial random read presents an entire 32-byte aligned page, with subsequent accesses within the same page completed in a shorter cycle. This scheme significantly boosts throughput for sequential reads—ideal for code execution and data streaming.
Read commands are robustly managed by the embedded algorithm controller (EAC), ensuring stable operation after resets, during suspend/resume operations, and through interface protocol transitions. The multiple address overlays also support reading of device ID, CFI, sector protection state, and ECC status, enabling advanced software drivers to auto-configure and manage the flash and its redundancy features.
Programming performance is enhanced by two methods: single word programming and buffer-based page programming. The 512-byte buffer allows efficient multi-word writes, reducing protocol overhead and accelerating firmware updates or logging. Programming granularity matches page boundaries, and the device includes automatic error checking and correction (ECC) for every page programmed, correcting single-bit errors on reads.
Erase functionality is provided at both chip and sector levels, managed by complex embedded algorithms within the device. These algorithms autonomously undertake pre-programming, error checking, and verification. Both programming and erase operations are interruptible (suspend/resume) allowing flexibility in multi-threaded systems. Protection mechanisms prevent erasure or overwriting of locked sectors or SSR regions.
The S29GL256S11DHV020 includes advanced status feedback, with three monitoring methods: status register, data polling, and dedicated RY/BY# output. These enable host controllers and embedded software to synchronize operations and detect completion or error states without ambiguity.
Robust status and error handling is necessary to maintain system integrity during high-frequency memory operations. The S29GL256S11DHV020 offers:
Status Register: 16-bit feedback on operation success/failure, busy states, aborts, and protection errors. Specific bits indicate program, erase, write buffer abort, and sector lock status, allowing fine-grained software flow control.
Data polling (DQ7/DQ6/DQ2 bits): Direct indication of program/erase progress, toggling algorithms, and timing limit exceedance.
Automatic error clearing: Reset and clear status commands to bring the device out of error or abort states, minimizing risk of deadlocks.
Reliability specifications: Endurance of 100,000 program/erase cycles and 20-year data retention assure suitability for mission-critical and long-life deployments.
ECC: Each 32-byte page features transparent single-bit error correction on read, with ECC re-enabled after sector erase; engineering best practice is to program each page once per cycle for full ECC coverage.
Electrically, the S29GL256S11DHV020 supports a core VCC of 2.7V–3.6V and versatile I/O ranges (VIO from 1.65V up to VCC), making it compatible with different bus voltages and peripheral interfaces. Careful attention to power sequencing, decoupling (recommendation of 0.1μF capacitors), and voltage lockout ensures device integrity during power transitions.
Package options enable adaptability in board designs:
56-pin TSOP and fortified BGA packages, with several size profiles for dense environments.
Pinout and ball-grid arrangements follow JEDEC standards, with reserved and no-connect balls for safe PCB routing.
Thermal and latchup characteristics meet JEDEC JESD78C and support reliable operation in extended temperature ranges.
The GL-S series includes models at various densities and similar process, providing direct drop-in or scalable alternatives based on project requirements. Those models include:
S29GL01GS (1Gb, higher density for large code/data)
S29GL512S (512Mb, mid-range density)
S29GL128S (128Mb, lower density for cost-optimized platforms)
At the same voltage and interface specifications, these GL-S family NOR flash devices can replace the S29GL256S11DHV020 when project scope changes or when inventory availability, cost targets, or future scalability factors prompt a device substitution. Matching package types, temperature grades, and bus configuration are key parameters for smooth replacement.
The S29GL256S11DHV020 Cypress Semiconductor NOR flash delivers high performance, reliability, and configurability crucial for modern embedded and automotive systems. With a comprehensive suite of protection options, fast access architectures, flexible packaging, and solid error correction mechanisms, this device stands out for applications where data integrity, operational responsiveness, and long-term endurance are non-negotiable. For engineering teams focusing on firmware storage, secure boot, or robust code execution in harsh environments, the GL-S series provides proven scalability and compatibility, streamlining sourcing and design cycles. When selecting or migrating flash solutions, the S29GL256S11DHV020 and its family equivalents should be considered for both current requirements and future product platforms.
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