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| Part Number: | IRFH5250TRPBF |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | MOSFET N-CH 25V 45A/100A 8PQFN |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.8424 |
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| Product Attribute | Attribute Value |
|---|---|
| Vgs(th) (Max) @ Id | 2.35V @ 150µA |
| Vgs (Max) | ±20V |
| Technology | MOSFET (Metal Oxide) |
| Supplier Device Package | 8-PQFN (5x6) |
| Series | HEXFET® |
| Rds On (Max) @ Id, Vgs | 1.15mOhm @ 50A, 10V |
| Power Dissipation (Max) | 3.6W (Ta), 160W (Tc) |
| Package / Case | 8-PowerVDFN |
| Package | Tape & Reel (TR) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Mounting Type | Surface Mount |
| Input Capacitance (Ciss) (Max) @ Vds | 7174 pF @ 13 V |
| Gate Charge (Qg) (Max) @ Vgs | 110 nC @ 10 V |
| FET Type | N-Channel |
| FET Feature | - |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| Drain to Source Voltage (Vdss) | 25 V |
| Current - Continuous Drain (Id) @ 25°C | 45A (Ta), 100A (Tc) |
| Base Product Number | IRFH5250 |




The IRFH5250TRPBF from Infineon Technologies is a highly efficient N-channel power MOSFET, engineered for demanding power switching applications where size, thermal performance, and switching speed are paramount. This device offers a voltage rating of 25 V and supports drain currents of up to 45 A at ambient temperature (Ta) and 100 A at case temperature (Tc), making it suited for medium to high-power designs. Housed in a compact 8-PQFN surface mount package (5x6 mm footprint), the IRFH5250TRPBF provides a significant power density advantage for designers focused on efficient board layout and overall system miniaturization.
The IRFH5250TRPBF integrates a range of features aimed at delivering exceptional electrical and thermal performance. Its low on-resistance ensures minimal conduction losses while enabling robust current handling for switching circuits. Fast switching behavior facilitates higher efficiency in DC/DC converters and motor drives, while the device's thermal metrics support high power dissipation—up to 3.6 W (Ta) and 160 W (Tc)—for optimal management in compact designs. Additional benefits include RoHS3 compliance for lead-free manufacturing and REACH conformant construction for enhanced environmental safety. The device also supports standard surface-mount handling, simplifying automated assembly and inspection.
Engineers can leverage the IRFH5250TRPBF in a wide spectrum of power management scenarios. Primary applications include acting as an OR-ing MOSFET in 12V bus systems, efficiently controlling in-rush currents and safeguarding power integrity in redundant supply topologies. The device is equally suited to battery-operated DC motor inverter circuits, where its low conduction losses and high current capability contribute to extended battery life and reliable motor switching. With its compact PQFN package and high-reliability characteristics, the IRFH5250TRPBF is ideal for use in portable systems, telecom infrastructure, and any space-constrained high-current circuit.
The IRFH5250TRPBF offers notable performance margins, including a maximum drain-source voltage of 25 V and drain currents of 45 A (ambient) and 100 A (case). Its maximum power dissipation reaches 160 W with proper thermal management, supporting high transient and continuous power demands. The MOSFET’s avalanche energy and maximum allowed pulse currents are key parameters for applications with inductive loads, ensuring safe operation during fault and overload conditions. Engineering teams should carefully consider thermal resistance data and de-rating curves, especially when mounting the device onto standard FR-4 boards, to ensure system reliability in temperature-varying environments.
In-depth electrical characterization data for the IRFH5250TRPBF provides critical insights for designers optimizing their circuits. The device demonstrates low gate charge and capacitance values, delivering rapid switching and enabling efficient operation in high-frequency environments. Output and transfer characteristics confirm linear behavior across specified voltage and current ranges, while temperature dependence curves facilitate predictable system design under varied operating conditions. Additional details—such as gate threshold voltage versus temperature, source-drain diode forward voltage, and normalized on-resistance—equip engineers to model device behavior with high fidelity, ensuring optimal circuit performance.
The 8-PQFN (5x6 mm) package employed by the IRFH5250TRPBF balances mechanical robustness and thermal efficiency. Key package dimensions and tolerances follow the ASME Y14.5M standard, supporting precise board placement and automated assembly. Coplanarity of the exposed heat slug and terminals ensures effective thermal conduction to the PCB, which is pivotal for managing high dissipation rates. Infineon provides detailed recommendations for footprint and stencil design, along with tape-and-reel orientation guidelines to facilitate pick-and-place processing. Designers should refer to related application notes for comprehensive mechanical integration details—these factors collectively influence assembly yield and in-system thermal management.
The IRFH5250TRPBF conforms to modern environmental directives, with full RoHS3 compliance promoting lead-free assembly and facilitating global market access. REACH status is unaffected, certifying the absence of hazardous chemicals above regulatory thresholds. While not qualified to automotive standards such as AEC Q100 or Q101, the device adheres to JEDEC qualification protocols applicable at release. These certifications assure reliability for commercial, industrial, and consumer applications. Engineers must still assess end-use environment requirements, particularly for highly regulated markets and applications with strict lifetime reliability demands.
When considering substitutions, engineers should focus on N-channel MOSFETs offering similar voltage, current, and package characteristics. Within Infineon’s lineup, models such as the IRFH5200 or IRFH5300 series may offer comparable electrical performance in PQFN packages. Alternative products from other manufacturers should be evaluated for matching maximum ratings, low on-resistance, and equivalent gate charge metrics to ensure circuit compatibility. Replacement selection must account for both electrical and mechanical fitment to maintain system efficiency and reliability.
The IRFH5250TRPBF N-channel MOSFET from Infineon Technologies delivers a combination of high current capability, robust power dissipation, and compact form factor, positioning it as an optimal choice for engineers tasked with designing modern power management and switching systems. Its advanced electrical parameters, environmental compliance, and comprehensive mechanical features support applications ranging from bus OR-ing to motor control, while detailed characterization and qualification data inform precise engineering decisions. For teams evaluating high-efficiency MOSFETs, the IRFH5250TRPBF represents a versatile, reliable, and future-ready component in high-performance electronics.
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