BROADCOM BCM82780ASKFSBG

Mfr. Part

BCM82780ASKFSBG

Manufacturer

Avago Technologies (Broadcom) — Y-IC is a quality distributor for this brand. We supply authentic parts and deliver reliable service and support.

Detailed Description

High‑speed specialized IC from Broadcom/Avago used in 100G‑class networking. Commonly deployed as a multi‑lane Ethernet/OTN PHY, retimer, or gearbox to clean, align, and map 10G/25G/28G NRZ lanes for 40G/100G links. Helps reduce jitter and bit errors, extend reach on copper or optical channels, and simplify line‑card and module designs in data center and telecom systems.

Key Features

Multi‑lane high‑speed SerDes for 10G/25G/28G NRZ signaling

Retiming with low‑jitter CDR on each lane to improve signal integrity

Gearbox and mapping functions for 40G/100G Ethernet and OTN interfaces

Support for common electrical interfaces used with QSFP28, CFP2/CFP4, and backplane links (for example CAUI‑4 or similar, feature set depends on configuration)

Adaptive equalization, CTLE/DFE, and transmit de‑emphasis for long channels

Loopback modes and PRBS generators/checkers for bring‑up and production test

Management over MDIO/I2C with on‑chip monitoring and control

Multiple reference clock options and jitter attenuation

Designed for interoperability with industry‑standard optics and backplanes

Broadcom silicon with proven deployment in carrier and hyperscale designs

Key Advantages

Lowers BER and cleans eye diagrams to meet 100G link budgets

Extends copper and optical reach without major PCB redesign

Cuts system power and cost by enabling simpler channels and modules

Speeds time‑to‑market with built‑in test features and flexible management

Backed by Broadcom ecosystem and Y‑IC’s dependable sourcing and support

Packaging

Type: Ball Grid Array BGA

Ball count: 869‑ball package (footprint optimized for high‑lane‑count SerDes)

Material: Molded organic substrate with lead‑free ball finish

Environmental: RoHS/REACH status available on request

Size: Large fine‑pitch BGA body for high‑speed routing (exact dimensions in the datasheet)

Pin configuration: Dense array including multiple differential high‑speed I/Os, reference clocks, management pins, and distributed power/ground planes

Thermal characteristics: Package designed for heatsink or airflow; use a thermal interface to the package top and follow Broadcom thermal guidelines. Board copper area and airflow determine ΘJA/ΘJC (see datasheet for recommended heatsinking and power profiles)

Electrical properties: 100‑ohm differential CML high‑speed I/Os, multiple supply rails for core and I/O, precision reference clock inputs, ESD protection structures. Detailed rail voltages, tolerances, and biasing are in the datasheet

Lifecycle

Current status: No public EOL notice identified. Availability can vary by region and build options. For the latest lifecycle and PCN status, contact Y‑IC

Nearing discontinuation: No public indication at this time

Equivalent or alternative models: No officially documented drop‑in replacements are published. Functional alternatives may exist within Broadcom’s retimer/gearbox families or from other high‑speed PHY vendors, but suitability depends on pinout, power, firmware, and protocol needs. Please contact our sales team via the Y‑IC website for a curated cross‑reference and engineering guidance

Key Application Areas

Data center switch and router line cards

Telecom OTN transport and metro aggregation

Optical transceivers and modules such as QSFP28, CFP2, CFP4

Backplane and midplane interconnects

Active optical cables and high‑speed copper DACs

Test and measurement equipment for 100G links

Network appliances, NICs, and storage fabrics

Datasheet

Y‑IC hosts the most authoritative datasheet for BCM82780ASKFSBG on our product page. For exact features, electrical limits, pinout, timing, thermal guidelines, and layout rules, download the datasheet directly on this page.

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