Broadcom Limited ACPM-7717-TR1

Mfr. Part

ACPM-7717-TR1

Manufacturer

Avago Technologies (Broadcom). Y-IC is a quality distributor for this brand and we will provide you with the best products and services

Detailed Description

RF power amplifier module for cellular systems that supports DCS, EDGE, GSM, LTE, PCS, TD-SCDMA, and UMTS. Surface-mount 42-pad module for compact designs. Integrated gain stages, bias, and matching to simplify the transmit chain. Optimized for 50 ohm interfaces. Designed for battery-powered devices and multimode operation. Base product number ACPM-7717. Quantity available 18,945

Key Features

Multimode operation for DCS, EDGE, GSM, LTE, PCS, TD-SCDMA, UMTS

42-pad leadless SMD module for space-saving layouts

Integrated matching and bias control to reduce external parts

50 ohm RF input and output for easy RF integration

Single battery supply operation

Mode control for linear (UMTS and LTE) and saturated (GSM and EDGE) operation

High linearity to meet ACLR and EVM requirements in UMTS and LTE

High efficiency in GSM and EDGE modes for longer battery life

Optimized thermal grounding pads to spread heat into the PCB

Key Advantages

Simplifies RF PA design and shortens time to market

Small footprint and low profile for slim devices

Lower power consumption improves battery life

Reliable performance across multiple cellular standards and bands

Proven Avago technology and quality

In-stock with fast delivery, current available quantity 18,945

Packaging

Type Surface-mount multi-chip module MCM

Case 42-pad leadless SMD module, Supplier Device Package Module

Delivery Tape and Reel TR1 for automated pick-and-place

Body and materials Molded encapsulation over organic laminate substrate with integrated passive matching network

Size Compact low-profile footprint suitable for mobile handsets and modems, see datasheet for exact dimensions

Pin configuration 42 terminals including RF input, RF output, VBAT power, VCC, bias enable, band and mode control pins, detector or sense pins, and perimeter ground pads

Thermal characteristics Designed to conduct heat into PCB copper through large ground pads and thermal vias, follow layout and derating guidance in the datasheet

Electrical properties 50 ohm RF ports, single-cell battery supply operation, band and mode dependent gain and output power, linear and saturated modes supported, see datasheet for detailed specs

Lifecycle

Status Mature product in the Avago Broadcom portfolio. Availability may vary by region and schedule

Alternatives Selection depends on target bands and air interface. Potential options for similar use cases include Broadcom ACPM family parts such as ACPM-7700, ACPM-7711, ACPM-7731; Skyworks SKY77xxx series multimode PA modules; Qorvo QM77xx or TQM7xxx series multimode PA modules; and integrated RF360 style PA front-end solutions. Verify electrical specs, pinout, control logic, and thermal needs before substitution

If you need a direct drop-in or the closest functional equivalent, contact our sales team on the Y-IC website and we will provide a precise cross reference and availability update

Key Application Areas

Smartphone and feature phone transmit chains for GSM, EDGE, UMTS WCDMA, LTE

Cellular modems and M2M or IoT modules that need a multimode PA

TD-SCDMA handsets and compatible user equipment

Small cells and femtocells transmit paths where footprint and efficiency matter

Portable wireless devices and embedded modules with tight space and power budgets

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for ACPM-7717-TR1 on our product page. Download it now to get full pin maps, absolute maximum ratings, RF performance by band and mode, control timing, recommended external components, PCB layout and grounding, and thermal design guidelines

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