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| Part Number: | MBRB4030T4G |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | DIODE SCHOTTKY 30V 40A D2PAK |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $1.5916 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 550 mV @ 40 A |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Technology | Schottky |
| Supplier Device Package | D²PAK |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Series | SWITCHMODE™ |
| Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tape & Reel (TR) |
| Operating Temperature - Junction | -65°C ~ 175°C |
| Mounting Type | Surface Mount |
| Current - Reverse Leakage @ Vr | 350 µA @ 30 V |
| Current - Average Rectified (Io) | 40A |
| Capacitance @ Vr, F | - |
| Base Product Number | MBRB4030 |




The MBRB4030T4G, manufactured by onsemi, is a surface-mount Schottky Barrier Power Rectifier designed for demanding switch-mode power supply and related high-current rectification applications. Packaged in the robust D2PAK (case 418B-04), it delivers a maximum repetitive reverse voltage of 30 V and a continuous forward current of up to 40 A. With its combination of high current rating, low forward voltage drop, and advanced barrier technology, the MBRB4030T4G meets both commercial and automotive requirements, including AEC-Q101 qualification and PPAP capability.
The MBRB4030T4G leverages the Schottky barrier principle and proprietary barrier metal to achieve efficient and reliable rectification. Its key features include advanced stress protection through device guarding, a maximized die size for optimal current handling, and a high maximum operating junction temperature of 175°C, catering to systems with elevated thermal constraints. The short heat sink tab, which is manufactured rather than sheared, enhances long-term durability in high-vibration or temperature-cycling conditions.
Automotive and other robust applications are supported by the NRVBB prefix variant, ensuring unique control and site-change requirements are met. All package variations are lead-free and conform to modern environmental expectations. From a design perspective, these attributes translate into reliable performance in power conversion blocks, reverse polarity protection, and output rectification for both industrial and automotive power supplies.
Engineers evaluating the MBRB4030T4G will find its electrical performance particularly suitable for fast, high-efficiency switching applications. Maximum forward voltage is tightly controlled, contributing to energy savings and reduced heat generation in dense layouts. Reverse leakage and capacitance are minimized, as demonstrated by characteristic curves, which help maintain low standby losses and high-frequency stability.
The device is capable of enduring significant dv/dt stress, with ESD ratings established at >400 V for Machine Model and >8000 V for Human Body Model. Pulse test procedures validate device behavior under duty cycles up to 2%, simulating rapid switching events typical in contemporary switching power supplies. Application engineers should note the performance curves for forward voltage, reverse current, and power dissipation, enabling accurate modeling and prediction in critical designs.
Thermal characteristics of the MBRB4030T4G support its deployment in high-temperature systems and environments requiring rugged reliability. With a 175°C maximum junction temperature and current derating curves provided for both infinite heatsink and free air scenarios, system designers can optimize PCB layouts for safe operation at rated loads. The package meets MSL1 requirements, indicating resilience to standard reflow soldering and handling operations.
Advanced engineering logic recommends close analysis of thermal resistance from junction-to-ambient and adherence to specified pad dimensions to fully exploit the device’s heat dissipation capabilities. The corrosion-resistant external finish and readily solderable leads further enhance reliability during manufacturing and in service.
The MBRB4030T4G is housed in the D2PAK 3-lead surface mount package (case 418B-04), ensuring ease of integration into high-density power electronics assemblies. Epoxy case molding complies with UL 94 V–0 flammability standards, supporting use in mission-critical and safety-sensitive applications. The device weight is approximately 1.7 grams, facilitating optimal thermal-to-mass ratios in compact assemblies.
Marking diagrams identify assembly location, production year and week, device code, and lead-free indicator for traceability and environmental compliance. The listing of soldering footprint and pad conformity to ANSI Y14.5M, 1982 standards streamlines mechanical integration and quality assurance in volume production.
For engineers and procurement teams seeking alternate sources or functionally similar parts, consideration may be given to the NRVBB4030T4G, which shares electrical and mechanical specifications with enhanced control traceability for automotive platforms. Additionally, the MBRB4030G variant—within the same family—may be evaluated depending on preferred die characteristics or application-specific derating needs. It is essential to verify package compatibility and qualification parameters such as AEC-Q101 and PPAP when sourcing replacements for critical applications.
The MBRB4030T4G Schottky Barrier Rectifier offers a comprehensive technical solution for high-current, low-voltage rectification needs in both commercial and automotive electronic systems. Its blend of advanced barrier design, robust package, thermal resilience, and industry-standard qualification makes it a dependable choice for engineers and procurement specialists seeking reliable power rectification and protection elements. Understanding its feature set and performance metrics allows teams to make informed specification and sourcing decisions, ensuring optimal integration and long-term reliability in power electronics assemblies.
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