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| Part Number: | MBRB2545CTG |
|---|---|
| Manufacturer/Brand: | AMI Semiconductor/onsemi |
| Part of Description: | DIODE ARRAY SCHOTTKY 45V D2PAK |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $4.2242 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 820 mV @ 30 A |
| Voltage - DC Reverse (Vr) (Max) | 45 V |
| Technology | Schottky |
| Supplier Device Package | D²PAK |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Series | SWITCHMODE™ |
| Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tube |
| Operating Temperature - Junction | -65°C ~ 175°C |
| Mounting Type | Surface Mount |
| Diode Configuration | 1 Pair Common Cathode |
| Current - Reverse Leakage @ Vr | 200 µA @ 45 V |
| Current - Average Rectified (Io) (per Diode) | 15A |
| Base Product Number | MBRB2545 |




The MBRB2545CTG, produced by onsemi, is a high-performance Schottky barrier power rectifier designed to deliver efficient switching and reliable rectification in demanding power electronics applications. Integrating a pair of diodes in a common-cathode configuration, this device is rated for 45 V and 15 A per leg, with a total current handling capability of up to 30 A. Housed in the industry-standard D²PAK/TO-263-3 surface mount package, the MBRB2545CTG offers a blend of robust electrical performance and mechanical flexibility, making it an ideal choice for power conversion circuits, switch-mode power supplies (SMPS), automotive modules, and other high-current applications.
The MBRB2545CTG leverages the Schottky Barrier principle with a platinum barrier metal, resulting in inherently low forward voltage drop and fast switching characteristics. The center-tap configuration enhances application versatility, particularly in full-wave rectification and synchronous switching topologies. Select features include:
Guarding for stress protection, improving robustness in transient-prone environments.
Low forward voltage, minimizing conduction losses and improving overall system efficiency.
High maximum junction temperature operation, rated up to 175°C, supporting use in thermally demanding settings.
A package design and heat sink tab engineered for effective thermal management and simplified mounting.
Compliance with UL 94 V–0 flammability requirements for safety-critical installations.
Qualification to automotive standards (AEC-Q101 and PPAP), making it suitable for automotive power distribution and control modules.
Pb-free content and compatibility with RoHS directives.
The MBRB2545CTG is engineered to handle substantial power and current with tight control of core parameters. Each diode in the dual configuration supports a repetitive peak reverse voltage of 45 V and forward average current up to 15 A, enabling a combined capability of up to 30 A in parallel applications. The device exhibits an extremely low forward voltage drop, reducing power dissipation and enhancing efficiency, especially under continuous or pulsed high-current loads often encountered in SMPS output stages.
Additionally, the device maintains low reverse leakage current, ensuring reliable blocking capability even at elevated temperatures. Protection against electrostatic discharge (ESD) is also notable, with ratings exceeding 400 V (machine model) and 8000 V (human body model), helping maintain device integrity during assembly and field operation. It is imperative that thermal performance is considered during design, with proper PCB pad layout for optimal heat transfer—critical for maintaining junction temperature below the specified maximum.
The MBRB2545CTG is encapsulated in a D²PAK (TO-263-3, Case 418B) package, a widely adopted surface-mount platform compatible with automated assembly processes. The compact form factor aligns with industry-standard TO-220 dimensions, providing mechanical interchangeability and ease of replacement in many power designs. All external surfaces are finished for corrosion resistance, and the lead terminals are optimized for reliable solderability in reflow and wave soldering processes.
The device weighs approximately 1.7 grams, and its molded epoxy body satisfies rigorous UL 94 V–0 flammability standards. For thermal and mechanical reliability, the package features a specially manufactured (not sheared) heat sink tab, suitable for efficient heat transfer to the PCB or additional heatsinks. The soldering profile accommodates a maximum lead and mounting surface temperature of 260°C for 10 seconds, fitting industry-standard assembly practices for high-reliability electronics.
The MBRB2545CTG’s characteristics position it as a staple choice in power electronics design. In switch-mode power supplies (SMPS), the device’s low forward voltage directly translates to higher conversion efficiency and reduced thermal load, critical for compact or fanless designs. Its center-tap configuration permits straightforward implementation of full-wave rectification in transformer secondary stages.
Automotive engineers will appreciate the AEC-Q101 qualification and PPAP support, ensuring the device is suitable for power distribution units, electric control modules, and high-reliability automotive subassemblies. When deploying the MBRB2545CTG, attention to thermal layout is paramount: the PCB land pattern must support effective heat dissipation, and in high-duty-cycle or elevated ambient temperature scenarios, additional thermal management strategies may be required to maintain junction temperature margins.
onsemi’s MBRB2545CTG meets rigorous automotive and industry benchmarks for reliability. The device has passed testing per AEC-Q101 and offers PPAP (Production Part Approval Process) capability, facilitating use in the automotive supply chain. Environmental standards are a key focus; the package materials are Pb-free and conform with global RoHS directives, while the molded epoxy is certified to UL 94 V–0 for fire resistance. Device robustness is reinforced by high ESD ratings and a mechanical design that meets MSL1 (Moisture Sensitivity Level 1), supporting standard storage, handling, and assembly without degradation risk.
In procurement and design-in phases, it is prudent to consider alternative or cross-compatible solutions to the MBRB2545CTG. While the MBRB2545CTG is available under both the MBRB and SBRB prefixes (the latter targeting automotive and custom-site-controlled applications), other manufacturers may offer rectifiers with similar ratings—typically 45 V/30 A Schottky diodes in TO‑263 (D²PAK) packaging. Cross reference to alternative part numbers should focus on core parameters: voltage and current ratings, forward voltage characteristics, case compatibility, automotive qualification, and environmental compliance. Always validate performance via datasheet comparisons and, when possible, direct sample evaluation, especially for applications in harsh or mission-critical environments.
: MBRB2545CTG in component selection strategy
The MBRB2545CTG from onsemi represents a robust, efficient solution for modern power rectification challenges, delivering high current handling, low forward losses, and qualified reliability in an easily deployable SMD package. Its versatility across industrial, automotive, and commercial electronics makes it a valuable device for design engineers seeking to optimize power path efficiency, thermal performance, and long-term reliability. For those in procurement or technical evaluation roles, the thorough understanding of its technical attributes, reliability certifications, and potential alternatives underpins confident, informed component selection in cost- and performance-conscious engineering projects.
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