AMD XCV400-5FG676I

Mfr. Part

XCV400-5FG676I

Manufacturer

AMD Xilinx. Y-IC is a quality distributor of AMD Xilinx products and we will provide you with the best products and services, fast support, and reliable supply

Detailed Description

Virtex FPGA, industrial grade, 404 user I/O, 676-ball FBGA package 27 mm x 27 mm, core supply 2.375 V to 2.625 V, logic capacity ~468k system gates, 2400 CLBs, ~10,800 logic cells, total on-chip Block RAM 81,920 bits, RoHS non-compliant (leaded finish), surface-mount, tray packing. Operating junction temperature -40°C to +100°C

Key Features

Virtex architecture with CLBs, distributed RAM, and Block RAM for flexible logic and memory

404 programmable I/O with SelectIO technology for common standards (LVTTL, LVCMOS, PCI, SSTL, HSTL, GTL, and differential options via external means)

Multiple I/O banks for mixed-voltage operation per bank

Global clock networks for low-skew clock distribution

On-chip configuration via JTAG, Master/Slave Serial, and SelectMAP modes

Boundary-scan (IEEE 1149.1) for test and programming

Industrial temperature grade for harsh environments

Proven first-generation Virtex family with stable tool support in legacy flows

Key Advantages

Balanced mix of logic, memory, and I/O for control, glue logic, bridging, and moderate DSP tasks

Mature, widely deployed device family with abundant app notes and design examples

Industrial temperature range improves reliability in demanding conditions

Flexible configuration options simplify manufacturing and field updates

Broad I/O standard coverage eases interfacing to 3.3 V, 2.5 V, and lower-voltage systems

Packaging

Type 676-FBGA (fine-pitch ball grid array), also referenced as 676-BGA, Supplier Device Package 676-FBGA (27x27)

Body size 27 mm x 27 mm nominal; ball pitch typical of FG packages (consult datasheet for exact pitch)

Material Molded epoxy encapsulation, organic BT resin substrate, leaded ball finish (SnPb), RoHS non-compliant

Pin configuration 676-ball array with 404 user I/O; remaining balls are power, ground, configuration, and dedicated clock/test pins

Thermal characteristics Junction temperature -40°C to +100°C (industrial). Thermal resistance values depend on board, airflow, and heatsinking. Use solid ground/power planes, adequate decoupling, and airflow or heatsink where needed. Refer to datasheet for θJA/θJC and thermal guidelines

Electrical properties Core supply VCCINT 2.375 V to 2.625 V (nominal 2.5 V). Auxiliary/configuration supplies and I/O bank VCCO per standard (typical 1.8 V to 3.3 V). Total current depends on design utilization, toggle rates, and I/O standards. Follow Xilinx power estimation and decoupling guidance

Mounting type Surface mount, compatible with standard BGA assembly. Moisture sensitivity per JEDEC; follow bake and reflow guidelines in the datasheet

Shipment Package Tray

Lifecycle

Status Legacy and widely considered discontinued or near end-of-life. Availability may be limited and subject to last-time-buy conditions

Direct drop-in equivalents Within the exact Virtex XCV400 family, alternative speed grades and temperature grades may exist (for example XCV400-4FG676I, XCV400-6FG676I). Check pinout and timing for compatibility

Close alternatives in later families Not pin-compatible; require redesign but offer modern features and lower power

- XCV400E (Virtex-E) FG676 variants for similar capacity

- XC2V400 (Virtex-II) FG676 variants

- XC6SLX150 FGG676 (Spartan-6) for cost-effective replacement in 676-ball package

- XC7K325T FFG676 (Kintex-7) for higher performance in 676-ball package

- XC7A200T FFG676 (Artix-7) for low power, mid-range logic in similar package class

- Newer Virtex-4/-5/-6/7 series parts in comparable ball counts (not pin-compatible)

If a one-to-one equivalent or alternative is not suitable for your design, please contact our sales team via our website. Y-IC will help you assess compatibility, migration plans, and stock options

Key Application Areas

Telecom and networking line cards, MAC/PHY glue logic, bus bridging

Industrial control, motion control, and instrumentation

Embedded systems prototyping and custom hardware accelerators

Aerospace and defense systems requiring industrial temperature operation

Image and signal processing pipelines with moderate bandwidth

Legacy system maintenance, repair, and spares where Virtex is specified

Datasheet

Our website hosts the most authoritative datasheet for XCV400-5FG676I. We recommend you download it on this page to get exact pinouts, timing, power, thermal data, and configuration details

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