AMD XCV2000E-6FG860C

Mfr. Part

XCV2000E-6FG860C

Manufacturer

AMD Xilinx

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Detailed Description

Virtex-E series FPGA with 2.54M system gates, 43,200 logic cells, and 9,600 CLBs. High I/O count with 660 user I/O. 860-ball fine-pitch BGA package, 42.5 mm x 42.5 mm body. Commercial temperature grade 0°C to 85°C (TJ). Core supply 1.71 V to 1.89 V. Surface-mount design. RoHS non-compliant. In-stock quantity available: 2618 units. Base product number XCV2000E.

Key Features

Virtex-E architecture optimized for performance and flexibility

43,200 logic cells and 9,600 CLBs for complex designs

655,360 total RAM bits (integrated block RAM)

660 user I/O for wide parallel interfaces and rich connectivity

Digital Clock Managers (DCMs) for clock conditioning, phase shifting, and frequency synthesis

SelectIO technology supporting common I/O standards such as LVCMOS, LVTTL, LVDS, HSTL, SSTL (check bank voltages per design)

Multiple configuration modes: JTAG, Master/Slave Serial, SelectMAP (parallel)

Global low-skew clock networks for reliable timing

IEEE 1149.1 boundary scan for test and debug

Proven toolchain support with Xilinx development ecosystem

Key Advantages

Very high I/O density allows broad interface coverage without external glue logic

Stable, mature platform ideal for sustaining and repairing legacy systems

Predictable timing and robust clocking through DCMs and global clock resources

Large on-chip RAM reduces external memory needs in buffering and DSP tasks

Long field history with broad community and IP availability

Y-IC support for sourcing, logistics, and technical guidance ensures smooth deployment

Packaging

Shipping type: Tray

Package and case: 860-FBGA, 42.5 mm x 42.5 mm body; also listed as 860-BGA with exposed pad

Supplier device package: 860-FBGA (42.5 x 42.5)

Material: Molded plastic over organic laminate BGA substrate with solder ball array

Mounting: Surface mount

Pin configuration: 860-ball fine-pitch grid; 660 balls are user I/O, remaining balls are power, ground, configuration, and clock

Thermal characteristics: Junction temperature 0°C to 85°C (commercial grade); exposed pad variant aids heat spreading to PCB; use ample decoupling and thermal vias for stable operation

Electrical properties: Core supply 1.71 V to 1.89 V; I/O banks support common standards (verify exact bank voltage per standard); fast clocking via DCMs; recommend tight power integrity design with local decoupling

Lifecycle

Status: Legacy Virtex-E device; many configurations in this family are discontinued or limited. It is not recommended for new designs. Availability can be constrained; plan for lifetime buys for sustainment.

Direct family variants to consider for similar functionality (check pinout, package, and speed grade carefully):

- XCV1500E (lower density, some packages may share FG860 family)

- XCV1000E (lower density)

- XCV600E, XCV400E, XCV300E (progressively smaller options within Virtex-E)

- Temperature and speed variants within XCV2000E (e.g., industrial temp options may exist)

Modern migration candidates (not pin-compatible; evaluate as design refresh options):

- Spartan-6: XC6SLX45, XC6SLX75 (similar logic scale for many applications; lower power)

- Artix-7: XC7A50T, XC7A100T (modern 28 nm, broad IO support, low power)

- Kintex-7: XC7K70T (higher performance and IO)

- Virtex-4: LX40, Virtex-5: LX50 (closer architectural lineage; stronger performance)

If you need exact form-fit-function replacements or confirmed alternates, please contact our sales team via the Y-IC website. We will verify availability, pin-compatibility, and migration guidance for your design.

Key Application Areas

Telecom and networking infrastructure

Legacy system sustainment and field repairs

High-I/O data aggregation, bus bridging, and interface converters

DSP pipelines, buffering, and packet processing

Industrial control and test equipment

Rapid prototyping and hardware acceleration where Virtex-E was originally deployed

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for this product. Download the datasheet directly on this page for full specifications, pinout, configuration modes, timing, and design guidelines.

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