AMD XC7A50T-1CS324I

Mfr. Part

XC7A50T-1CS324I

Manufacturer

AMD Xilinx. Y-IC is a quality distributor of AMD Xilinx and we will provide you with the best products and responsive service

Detailed Description

Artix-7 FPGA, mid-density, low power 28 nm technology. 52,160 logic cells, 4,075 LABs/CLBs, 2,764,800 total RAM bits. 210 user I/O. Industrial temperature grade I. Speed grade -1. Core supply 0.95 to 1.05 V nominal 1.0 V. 324-ball CSPBGA 15 mm x 15 mm body. Surface-mount. RoHS non-compliant variant. Base product family XC7A50. Supplied in tray packaging. Category Integrated Circuits, Embedded FPGAs

Key Features

Artix-7 architecture for high performance per watt

52k logic cells and 2.76 Mb on-chip block RAM for complex designs

210 I/O for flexible board connectivity

Industrial temperature range -40 to 100°C TJ for harsh environments

Speed grade -1 for balanced timing and power

Core voltage 1.0 V nominal for low power operation

324-ball CSPBGA package with compact 15 x 15 mm footprint

Supports common I/O standards LVCMOS and differential standards like LVDS on suitable banks

Rich clocking with MMCM and PLL blocks

System Monitor XADC for on-die voltage and temperature sensing

Bitstream encryption and device DNA for configuration security

Standard configuration via JTAG and external flash options such as SPI or BPI

Key Advantages

Strong logic and memory resources in a small, low-profile package

Low power consumption suitable for battery-powered or thermally limited designs

Industrial-grade reliability for long-term field operation

Wide I/O flexibility to interface with sensors, memory, and communication peripherals

Mature 7-series tool and IP ecosystem to accelerate development and reduce risk

Competitive cost compared to higher-end FPGA families while meeting mainstream performance needs

Packaging

Type CSPBGA 324-ball, low-profile fine-pitch BGA

Material Molded epoxy package with BT resin substrate, solder ball array

Size 15 mm x 15 mm body, typical ball pitch for 324-ball CSPBGA is fine pitch consult datasheet for exact pitch

Pin configuration 324 balls total with 210 user I/O, multiple dedicated power and ground balls, configuration pins JTAG, standard clock and control pins

Thermal characteristics Junction temperature -40 to 100°C TJ, BGA array aids heat spreading and conduction through the board, use thermal vias and solid ground planes for better thermal paths

Electrical properties Core VCCINT 0.95 to 1.05 V nominal 1.0 V, auxiliary and I/O bank voltages per family guidelines typical banks support 1.8 V, 2.5 V, and 3.3 V standards, follow decoupling and power sequencing guidance

Mounting Surface mount reflow per manufacturer profile, ESD safe handling required

Supplier device package 324-CSPBGA 15x15

Shipping package Tray for safe handling and assembly

RoHS status Non-compliant variant may use tin‑lead ball composition, choose compliant alternatives if required

Lifecycle

Status Active, Artix-7 is a mature and widely deployed family, not near discontinuation

Note This specific variant is RoHS non-compliant. If you need RoHS compliance, consider equivalent lead-free versions

Pin-compatible or close alternatives within the same family

- XC7A50T-1CSG324I Industrial temp, same 324-ball package CSG is common lead-free code, similar resources and pinout

- XC7A50T-2CSG324I Faster speed grade -2, same 324-ball package, industrial temp

- XC7A50T-1CSG324C Commercial temp, same 324-ball package

Same silicon, different package not pin-compatible but functional alternatives with more I/O

- XC7A50T-1FGG484I 484-ball BGA, industrial temp

- XC7A50T-2FGG484C 484-ball BGA, faster speed grade, commercial temp

Same family, nearby densities for upor down-scaling design effort not pin-compatible unless noted

- XC7A35T variants lower density, similar features

- XC7A75T variants higher density, similar features

If you need exact pin-compatible, RoHS-compliant, or automotive-grade options, contact our sales team via the Y-IC website for a detailed cross and availability

Key Application Areas

Industrial control, PLC and motion control

Motor drives and power conversion control loops

Embedded vision and imaging pipelines

Sensor fusion and real-time signal processing

Communications bridging and protocol conversion

Robotics and drones

Medical instrumentation and diagnostics

Test and measurement equipment

Smart grid and energy management

Aerospace and defense prototyping and COTS systems

Datasheet

Our website hosts the most authoritative datasheet for this product model. Download it directly from this page for the latest specifications, pinouts, power, timing, and design guidelines

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