AMD XC2V40-5CSG144C

Mfr. Part

XC2V40-5CSG144C

Manufacturer

AMD Xilinx

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Detailed Description

Small Virtex-II FPGA for embedded designs. 40K system gates with 64 CLBs, 88 user I/Os, and 73,728 on-chip RAM bits. Core supply 1.425–1.575 V. 144-ball chip-scale BGA (12 x 12 mm). Commercial temperature grade (0°C to 85°C TJ). Surface-mount. Ideal for compact, cost-sensitive logic and interface tasks. Base product number XC2V40. Series Virtex-II. Available quantity: 2646 units. Packaged in tray.

Key Features

Virtex-II architecture (SRAM-based, reconfigurable logic)

40K system gates for light-to-moderate logic complexity

64 CLBs for flexible combinational and sequential logic

88 user I/O pins for broad interface coverage

73,728 RAM bits (~72 Kb) for FIFOs, buffers, small memories

Core voltage 1.425 V to 1.575 V for lower-power operation

144-ball LCSBGA, 12 x 12 mm footprint, surface mount

Commercial junction temperature 0°C to 85°C

Series: Virtex-II; Base product: XC2V40

Supplier device package: 144-LCSBGA (12x12)

Mounting type: Surface mount

Package: Tray

Key Advantages

Compact footprint fits dense PCBs

Balanced logic resources for glue logic and protocol bridging

Mature, proven device family with stable behavior

Broad I/O count relative to device size for flexible connectivity

Lower core voltage helps reduce power vs. older 2.5V cores

Reliable availability through Y-IC with verified quality

Supported by classic Xilinx ISE toolchain for legacy projects

Packaging

Type: Chip-Scale Ball Grid Array (CSG/LCSBGA), BGA technology

Material: Molded plastic package with organic substrate and solder ball grid

Size: 12 mm x 12 mm body, 144-ball count

Pin configuration: 12 x 12 mm CSP/BGA array, 144 balls; user-accessible I/O pins: 88

Thermal characteristics: Junction temperature 0°C to 85°C (commercial grade); use adequate copper area, vias, and airflow for heat spreading

Electrical properties: Core supply 1.425 V to 1.575 V; power depends on logic utilization and clock rates; follow AMD Xilinx guidelines for decoupling and rail integrity

Shipping form: Tray for secure handling and assembly throughput

Lifecycle

Status: Legacy Virtex-II family device. Availability may be limited and subject to last-time-buy schedules. Not recommended for new designs unless pin-compatibility or legacy toolchain constraints require it.

Nearing discontinuation: Many Virtex-II variants have reached or are approaching end-of-life; confirm current status with our sales team.

Equivalent or alternative models (same base family, availability varies):

- XC2V40-6CSG144C (faster speed grade, same package, commercial temp)

- XC2V40-5CSG144I (same speed grade, industrial temp range)

- XC2V40-6CSG144I (faster speed grade, industrial temp range)

Newer-generation functional alternatives (not pin-compatible; consider for redesigns):

- Spartan-6 family (lower power, cost-focused)

- Artix-7 family (modern 28 nm, low power with higher performance)

- Kintex-7 family (higher performance and bandwidth)

For exact compatibility, migration guidance, or current supply options, contact our sales team via the Y-IC website.

Key Application Areas

Protocol bridging and glue logic between legacy and modern interfaces

Industrial control, motor control, and factory automation

Test and measurement instruments and data capture

Embedded communications and lowto mid-speed serial links

Imaging, sensor aggregation, and small DSP preprocessing

Consumer and medical devices requiring compact programmable logic

Education, research, and FPGA training labs using classic architectures

Datasheet

Y-IC hosts the most authoritative datasheet for this model on our product page. We strongly recommend downloading the datasheet from our site for the latest specifications, pinouts, electrical limits, and design guidelines.

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