XILINX XCV50-6FG256I

Mfr. Part

XCV50-6FG256I

Manufacturer

AMD Xilinx

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Detailed Description

Virtex family SRAM-based FPGA. 50K system-gate class device with -6 speed grade for higher performance. Industrial temperature grade (I). Fine-Pitch BGA package (FG256, 256 balls). Configurable logic, embedded memory, and rich I/O for general-purpose digital design. Category: Integrated Circuits (ICs), Specialized ICs.

Key Features

SRAM FPGA architecture: reprogrammable, non-volatile configuration stored externally

Configurable Logic Blocks for parallel digital processing

On-chip memory (distributed RAM and block RAM)

Clock management resources (DLL/clock conditioning) for stable, low-jitter clocks

SelectIO interface supports common standards (LVTTL, LVCMOS, LVDS and others)

JTAG boundary scan and in-system configuration

Multiple I/O banks with flexible voltage options

Industrial temperature operation for harsh environments

Mature toolchain support (Xilinx ISE-era flows)

Key Advantages

Fast time-to-market: hardware changes via bitstream, no PCB respin for logic changes

High flexibility: adapt logic, interfaces, and timing to evolving requirements

Integration: replace multiple glue-logic ICs with one programmable device

Performance: -6 speed grade enables higher internal and I/O frequencies

Reliability: field-proven Virtex architecture in many long-life systems

Broad ecosystem: extensive IP, reference designs, and community knowledge

Packaging

Type: FG256 Fine-Pitch Ball Grid Array (BGA)

Package / Case code: 869 (as provided)

Material: BT epoxy substrate with lead-free SnAgCu solder balls

Size: approximately 17 mm x 17 mm body; ball pitch ~1.0 mm (typical for FG256)

Pin configuration: 256-ball 16x16 matrix (corners not populated), multiple I/O banks, dedicated configuration pins, robust VCCINT/VCCO/GND distribution

Thermal characteristics: industrial temperature range typically -40°C to +85°C ambient; junction temperature limits per datasheet; thermal performance depends on PCB, airflow, and heat spreader

Electrical properties: SRAM core; typical Virtex core voltage ~2.5 V; I/O bank voltages commonly 1.8/2.5/3.3 V depending on standard; power varies with configuration and clocking; -6 speed grade supports higher Fmax than lower grades

Lifecycle

Status: Legacy/obsolete class. Generally not recommended for new designs. Availability may be limited to remaining stock and specialized supply.

Recommended alternatives (family-level guidance; choose by logic size, I/O, and performance needs):

- Spartan-7 family (cost-effective, low power)

- Artix-7 family (balanced performance and power)

- Kintex-7 family (higher performance, more DSP and memory)

- Virtex-7 and Virtex UltraScale/UltraScale+ families (high-end performance and bandwidth)

- Zynq-7000 / Zynq UltraScale+ SoC (FPGA + ARM processing system)

Exact cross-reference depends on required logic resources, RAM, I/O count, transceivers, and package. Contact our sales team via the Y-IC website for a tailored equivalent list, pin-compatible options where possible, and migration guidance.

Key Application Areas

Industrial control and automation (deterministic logic, custom interfaces)

Telecommunications and networking (protocol bridging, packet processing)

Test and measurement (high-speed capture, custom triggering)

Embedded vision and signal processing (parallel pipelines, DSP acceleration)

Aerospace/defense and transportation (ruggedized designs, legacy platform support)

Rapid prototyping and hardware verification (fast iteration without new boards)

Datasheet

Our website hosts the most authoritative datasheet for XCV50-6FG256I. For accurate electrical, timing, thermal, and configuration details, download the datasheet on this page now.

Request for Quotation Now

In stock: 1201 units available for immediate quote and shipment.

Get a Quote today on Y-IC. Learn More about compatible replacements and migration support. Limited Time Offer on select inventory—act now to secure supply and pricing.