XILINX XCS30-3PG208C

Mfr. Part

XCS30-3PG208C

Manufacturer

AMD Xilinx. Y-IC is a quality distributor of AMD Xilinx products, and we will provide you with the best products and services, fast delivery, and reliable support.

Detailed Description

AMD Xilinx Spartan family FPGA device

Model XCS30 with speed grade -3 in PG208 package, commercial temperature range

Main Category Integrated Circuits ICs. Small Classification Specialized ICs

Designed for programmable digital logic, custom hardware acceleration, and glue logic tasks

Available stock quantity 1401. Date code 21+

Ideal for legacy system support and cost-sensitive designs using mature Xilinx FPGA technology

Key Features

Programmable FPGA fabric for custom digital logic and state machines

Spartan family architecture with distributed RAM inside logic cells

Speed grade -3 for faster timing performance compared to lower grades

High I/O count with 208-pin package for broad interface coverage

Standard configuration methods JTAG and dedicated PROM/serial modes

Supports common I/O standards such as LVTTL and LVCMOS per datasheet

Global clock routing resources to improve timing and reduce skew

In-system reprogrammable and field upgradable

Supported by legacy Xilinx design tools and proven project flows

Commercial temperature range C version typically 0°C to +85°C

Key Advantages

Faster time to market vs. custom ASIC

Low total cost for moderate logic densities

Flexible and reconfigurable for product updates and variants

Proven reliability and wide industry adoption

Strong ecosystem and documentation for legacy maintenance

Good fit for extending life of existing platforms without full redesign

Packaging

Package type PG208 with 208 pins. Surface-mount plastic encapsulation

Material epoxy mold compound and copper leadframe/ball array per AMD Xilinx specs

Size and mechanical outline defined by PG208 standard. Refer to datasheet for exact body dimensions and pin pitch

Pin configuration 208-pin grid pattern. High-density fine pitch suitable for compact boards

Thermal characteristics ThetaJA and ThetaJC depend on PCB, airflow, and utilization. Heatsinking or airflow recommended for high toggle rates

Electrical properties core and I/O supply voltages per datasheet. ESD ratings per JEDEC standards

Moisture sensitivity level MSL per AMD Xilinx packaging spec. Follow proper bake and reflow practices

Packaging code 1180 noted in supplier records. Date code 21+

RoHS and lead status per current datasheet and compliance statements

Lifecycle

Status mature legacy product. Many early Spartan devices are NRND or EOL in some configurations

Availability can be limited. Plan for lifetime buys if you need long-term support

Recommended AMD Xilinx alternatives and upgrades not pin-compatible. Evaluate per project needs

- Spartan‑3A XC3S50A series and XC3S200A series in PQ208 packages for cost-sensitive refresh

- Spartan‑6 XC6SLX9 and XC6SLX16 families for more features and lower power

- Artix‑7 XC7A35T and XC7A50T families for modern tool support and higher performance

If you require exact pinout or drop‑in equivalents, contact our sales team via our website. We will help verify compatibility and propose the best options for your design

Key Application Areas

Industrial control, PLC add‑ons, and machine interfaces

Communications and networking glue logic and bus bridging

Consumer electronics and set‑top boxes needing custom logic

Medical and instrumentation for protocol adapters and timing control

Legacy system maintenance and field upgrades

Custom I/O, sensor hubs, and motor control

Rapid prototyping and educational hardware labs

Datasheet

Y-IC hosts the most authoritative datasheet for XCS30-3PG208C. We recommend you download it directly on this page to get the latest mechanical, electrical, and design guidelines.

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