XILINX XC2S2005FG456I

Mfr. Part

(Note: This ordering code is commonly written as XC2S200-5FG456I in Xilinx literature.)

Manufacturer

AMD Xilinx

Y-IC is a quality distributor for AMD Xilinx. We deliver genuine parts, strong technical support, and fast, reliable service.

Detailed Description

Spartan-II family FPGA. SRAM-based, mid-density device around the 200K system-gate class. Speed grade -5. Package FG456 (fine-pitch BGA, 456 balls). Industrial temperature range device. Category: Integrated Circuits > Specialized ICs. Ideal for cost-sensitive logic integration, glue logic, and legacy FPGA designs. Current listing quantity: 2400 units.

Key Features

Spartan-II architecture with 4-input LUT-based CLBs

On-chip Block RAM and distributed RAM

DLL-based clock management for low-skew clocking

JTAG boundary-scan test and configuration

Flexible configuration options: serial PROM, slave/master serial or parallel, and JTAG

Broad I/O standard support including LVTTL, LVCMOS 3.3 V/2.5 V, PCI 3.3 V, GTL and similar legacy interfaces

Industrial temperature range operation

Speed grade -5 variant for tighter timing than lower grades within the family

Proven, widely deployed platform with mature tool support (ISE legacy flow)

Key Advantages

Stable choice for maintenance of existing designs and long-life equipment

Industrial temperature option supports harsh environments

Rich set of legacy I/O standards simplifies interfacing with older logic and buses

Rapid prototyping thanks to SRAM-based configuration and JTAG support

Large ecosystem and documentation base from long market presence

Y-IC can provide screened inventory, date-code control, packaging options, and test services

Packaging

Type: FG package family, fine-pitch BGA

Ball count and style: 456-ball FBGA (FG456), grid array

Pitch: 1.0 mm typical for FG456 packages

Body and materials: Molded plastic BGA over organic substrate, Pb or Pb-free variants exist by lot and suffix

Moisture sensitivity: Plastic BGA devices are typically MSL 3; follow JEDEC J-STD-033 handling and J-STD-020 reflow (verify exact MSL in the datasheet for your lot)

Size: Standard FG456 outline per Xilinx package drawing (confirm exact dimensions in the package datasheet)

Pin configuration: Multiple I/O banks, dedicated configuration pins (CCLK, DIN, DONE, INIT), JTAG pins (TDI, TDO, TCK, TMS), global clock inputs, power/ground balls distributed for low impedance

Thermal characteristics: Industrial ambient range -40 to +85 C; thermal resistance depends on board stack-up, airflow, and copper area; use Xilinx thermal model or measure in system

Electrical properties:

- Core supply VCCINT nominal 2.5 V (family-typical)

- I/O bank VCCO supports common 3.3 V and 2.5 V standards (verify standards list per bank in datasheet)

- Configuration supply per chosen mode; JTAG per IEEE 1149.1

- Speed grade is -5 (timing per family speed files)

Package/Case note: The source listing shows “Package/Case: 1057”. That appears to be an internal listing code. The ordering code here indicates the real package is FG456.

Lifecycle

Status: Legacy product family. Many Spartan-II devices are NRND or obsolete. Do not start new designs without checking availability.

Direct pin-compatible drop-in replacements: Often none outside the same family and package. Within-family alternates may include different speed or temperature grades:

- XC2S200-5FG456C (commercial temperature)

- XC2S200-6FG456I or XC2S200-6FG456C (different speed grade)

Family migration options (not pin-to-pin; redesign required):

- Spartan-IIE family (e.g., XC2S200E in comparable packages)

- Spartan-3 family (e.g., XC3S200 or XC3S400 variants)

- Spartan-6 family (e.g., XC6SLX9 to XC6SLX25 depending on resource needs)

- Artix-7 family (e.g., XA7A or XC7A devices for modern, low-power replacements)

If you need a true drop-in or vetted cross, contact Y-IC sales on our website. We will review your BOM, speed/timing needs, I/O standards, and propose the best-fit equivalents with lead time and risk analysis.

Key Application Areas

Industrial control and factory automation

Motor control and drives

Communications and networking interface bridging

Test and measurement equipment

Consumer and set-top legacy platforms

Imaging and data acquisition front-ends

Embedded glue logic for ASIC/SoC offload

Education and legacy platform support

Datasheet

Y-IC hosts the most authoritative datasheet and package drawings for this exact ordering code on our product page. Download it now from this page for full electrical, timing, package, and configuration details.

Request for Quotation Now

Need pricing, lead time, or alternatives fast? Get a Quote on our website today. Limited Time Offer for bulk orders on in-stock 2400 units. Click Get a Quote or Learn More to talk with our specialists and lock in availability.