Micron uMCP officially sends samples, can provide 6.4Gbps speed for 5G smartphones

According to Micron's official news, Micron announced today that the industry's first universal flash memory (UFS) multi-chip package (uMCP) with LPDDR5 DRAM is officially sampling. The uMCP provides high-capacity and low-power storage space, and is designed for thin and light mid-range smartphones, which can improve 5G smartphone performance and battery life.

Micron's uMCP combines LPDRAM, NAND, and a built-in controller. Compared with the dual-chip solution, the space consumption is reduced by 40%. The optimized configuration can save power, reduce memory footprint, and support smaller and more flexible smartphones.

Dr. Raj Talluri, senior vice president and general manager of Micron, said, "This industry-first packaging solution is equipped with the latest LPDRAM and UFS interfaces, which can reduce memory and increase memory and storage bandwidth by 50%."

It is reported that Micron uMCP5 uses advanced 1y nm DRAM process technology and the world's smallest 512Gb 96-layer 3D NAND chip. This new packaging solution uses a 297 ball grid array (BGA) to support dual-channel LPDDR5 with speeds up to 6.4Gbps, which is a 50% improvement over the previous generation interface performance.

Micron emphasizes that uMCP is the ideal solution for LPDDR5 DRAM. 5G networks will be deployed on a large scale worldwide from 2020. Micron's next-generation LPDDR5 memory will meet the needs of 5G networks for higher memory performance and lower energy consumption.

At the same time, Micron said that uMCP5 equipped with LPDDR5 has started to send samples to some partners since the first quarter of this year.