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| Part Number: | FL1000G |
|---|---|
| Manufacturer/Brand: | FRESCO |
| Part of Description: | FL1000G FRESCO |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. |
| Product Attribute | Attribute Value |
|---|---|
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




FL1000G
FRESCO. Y-IC is a quality distributor of FRESCO. We supply genuine parts and provide the best products and services to support your project from design to production.
FRESCO FL1000G is a specialized integrated circuit in a BGA package. It is designed for high-performance digital systems that need compact size, high I/O density, and reliable signal integrity. It fits applications where advanced control, interface management, or specialized system functions are required.
Specialized IC category for targeted system functions
BGA package for high pin count and compact footprint
High integration to reduce external components
Optimized for stable, high-speed digital designs
Broad operating use in embedded and computing platforms
Vendor case reference: 869 (consult datasheet for exact mechanicals)
RoHS/lead-free options typically available (verify on datasheet and order code)
Small size with dense ball grid for more signals in less board space
Better signal integrity and shorter interconnect paths than leaded packages
Scalable for multi-layer PCB designs and fine pitch routing
Robust assembly using industry-standard BGA reflow processes
Supports high reliability through controlled thermal and electrical design
Type: BGA (Ball Grid Array)
Material: Molded plastic package with organic substrate and lead-free solder balls (typical for BGA)
Size: Determined by the specific 869 case; use the datasheet for exact body size, height, and ball pitch
Pin configuration: Ball grid array with high I/O count; consult the ball map and pin assignment in the datasheet
Thermal characteristics: Requires proper reflow profile (J-STD-020), controlled thermal design, use of thermal vias and copper planes to manage heat
Electrical properties: Designed for high-speed signals; follow layout guidelines for impedance control, decoupling, and ESD protection as specified in the datasheet
Current lifecycle status is not indicated in the provided data and is not confirmed as near discontinuation.
If you need second-source or alternatives, contact our sales team via the Y-IC website. We can recommend functionally similar solutions based on your required interfaces, performance targets, voltage, and footprint constraints.
For the most up-to-date lifecycle, supply status, and cross-reference options, reach out to Y-IC sales for a fast response.
Embedded systems and single-board computers
Industrial PCs and controllers
Consumer electronics requiring specialized control logic
Interface expansion modules and add-in cards
Hubs, docking units, and gateways needing compact, high-I/O ICs
Test and measurement equipment and custom OEM designs
Y-IC hosts the most authoritative and up-to-date datasheet for FL1000G on our product page. Download it now to get exact mechanical dimensions, ball maps, electrical limits, timing, layout guides, and assembly instructions.
Get a Quote on Y-IC today for FL1000G. Learn More about pricing, lead time, and logistics on our website. Limited Time Offer for volume buyers and scheduled orders—secure your supply now.
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