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| Part Number: | BAS21J,115 |
|---|---|
| Manufacturer/Brand: | Nexperia |
| Part of Description: | DIODE GP 300V 250MA SOD323F |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.0088 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 100 mA |
| Voltage - DC Reverse (Vr) (Max) | 300 V |
| Technology | Standard |
| Supplier Device Package | SOD-323F |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Series | Automotive, AEC-Q100 |
| Reverse Recovery Time (trr) | 50 ns |
| Package / Case | SC-90, SOD-323F |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tape & Reel (TR) |
| Operating Temperature - Junction | 150°C (Max) |
| Mounting Type | Surface Mount |
| Current - Reverse Leakage @ Vr | 150 nA @ 250 V |
| Current - Average Rectified (Io) | 250mA |
| Capacitance @ Vr, F | 2pF @ 0V, 1MHz |
| Base Product Number | BAS21 |




The BAS21J,115, produced by Nexperia USA Inc., is a single high-speed switching diode designed for modern surface-mount applications. Encapsulated in the space-saving SOD323F (also referenced as SC-90) plastic package, the BAS21J,115 serves as a crucial component in circuits demanding fast switching, low capacitance, and robust reverse voltage tolerance. Engineered for both reliability and efficiency, this diode is a widely adopted choice for engineers seeking versatility and high performance within a compact SMD footprint.
One of the distinguishing strengths of the BAS21J,115 lies in its fast reverse recovery time, with a typical maximum $ t_{rr} $ of 50 ns. This enables minimal charge storage and swift transitions in switching circuits. Its low diode capacitance, specified at or below 2 pF, carries technical significance in high-speed logic, RF, and signal integrity applications, contributing to reduced signal distortion and improved timing.
The BAS21J,115 also offers:
High repetitive peak reverse voltage of up to 300 V, supporting robust operation against voltage spikes and inductive load switching events.
Low leakage current, enhancing energy efficiency and reducing risk of false triggering in sensitive analog domains.
Excellent package coplanarity and improved thermal management, promoting assembly reliability especially in high-density or temperature-sensitive designs.
Suitability for reflow soldering, easing integration into automated electronics manufacturing environments.
To facilitate reliable circuit design, the BAS21J,115 provides well-defined absolute maximum ratings and electrical parameters:
Maximum continuous forward current: 250 mA
Maximum non-repetitive peak forward surge current: defined per IEC 60134 standards, supporting short-duration overcurrent scenarios
Reverse voltage ( $ V_{R} $ ): up to 300 V
Repetitive peak reverse voltage ( $ V_{RRM} $ ): up to 300 V
Reverse recovery time ( $ t_{rr} $ ): ≤ 50 ns (typical at $ I_{F} = I_{R} = 30 \, \mathrm{mA} $, $ R_L = 100\,\Omega $)
Diode capacitance ( $ C_d $ ): ≤ 2 pF
Operating junction temperature range: for reliable performance under typical assembly and field-service conditions
Thermal characteristics are provided based on mounting to a standard FR4 PCB and are essential for assessing power dissipation and thermal stability—critical in tightly packed or thermally challenging layouts.
Engineers should reference the diode’s characteristic curves, such as forward current versus forward voltage and diode capacitance versus reverse voltage, to precisely model device behavior within target applications.
The SOD323F (SC-90) package of the BAS21J,115 enables high-density PCB layouts and automated assembly. Key physical and handling considerations include:
Very small form factor with flat leads, which supports advanced miniaturization in portable or size-constrained electronics.
Marking bar to indicate the cathode for correct orientation during assembly.
Only reflow soldering is recommended, ensuring compatibility with contemporary SMT production processes.
Mounting pad recommendations (1 cm² for cathode tab) support optimal thermal, mechanical, and electrical performance during PCB design.
Understanding package outlines and suggested footprints is crucial for procurement and manufacturing teams to ensure supply-chain compatibility and process yield.
The BAS21J,115 targets a wide range of engineering use cases, notably:
High-speed switching: Ideal for digital logic signal routing, level shifting, and pulse shaping in high-frequency domains.
General-purpose switching: Suitable as a universal diode in lowto medium-power analog, digital, and mixed-signal systems.
Voltage clamping: Provides circuit-level protection and stabilization against transient voltage spikes or inductive kickback.
Reverse polarity protection: Essential in safeguarding sensitive circuitry against improper power supply connection.
Representative application blocks include use in switching power supplies, analog protection circuits, and control interfaces where speed, size, and voltage handling are critical selection parameters.
When considering supply chain flexibility or second-sourcing, engineers often evaluate alternative models that match the BAS21J,115 in electrical and physical parameters. Selection of an equivalent should focus on maintaining:
Comparable maximum reverse voltage and current ratings
Similar reverse recovery time and capacitance characteristics
Footprint compatibility with SOD323F or equivalent SMD packages
Compliance with industry standard soldering and assembly processes
Common equivalents might include switching diodes from reputable manufacturers with the same or matching part numbers (e.g., BA-type series from other vendors) and the same SOD323/SOD323F case style. For specific cross-reference recommendations, technical databases and manufacturer comparison guides should be consulted, considering real-world electrical and packaging tolerances.
The BAS21J,115 from Nexperia USA Inc. remains a compelling choice for engineers tackling high-speed, high-voltage switching requirements in compact SMD environments. Its blend of rapid switching, low capacitance, robust voltage handling, and industry-standard packaging aligns with a broad array of modern electronic applications, from consumer devices to industrial control. By considering the detailed specifications, application scenarios, and potential equivalents presented above, engineers and procurement specialists can make informed, risk-mitigated decisions to secure reliable performance and efficient production for their designs.
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