English
| Part Number: | NFM21CC221R1H3D |
|---|---|
| Manufacturer/Brand: | Murata Electronics |
| Part of Description: | CAP FEEDTHRU 220PF 20% 50V 0805 |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.0479 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Rated | 50V |
| Tolerance | ±20% |
| Thread Size | - |
| Temperature Coefficient | - |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Series | EMIFIL®, NFM21 |
| Ratings | - |
| Package / Case | 0805 (2012 Metric), 3 PC Pad |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount |
| Insertion Loss | - |
| Height (Max) | 0.037" (0.95mm) |
| DC Resistance (DCR) (Max) | - |
| Current | 700 mA |
| Capacitance | 220 pF |
| Base Product Number | NFM21CC |




The NFM21CC221R1H3D from Murata Electronics is a feedthrough capacitor designed for high-frequency noise suppression in general electronic applications. This multilayer ceramic device offers a nominal capacitance of 220 pF, with a voltage rating of 50V and a maximum rated current of 700 mA. Packaged in a compact 0805 (2012 metric) SMD configuration, the NFM21CC221R1H3D is an optimal choice for engineers seeking robust EMC performance within space-constrained designs. Fully compliant with RoHS and REACH directives, this part is suitable for automated assembly processes and supports sustainable manufacturing initiatives.
A primary characteristic of the NFM21CC221R1H3D is its three-terminal structure, a low ESL (equivalent series inductance) configuration that enhances its effectiveness in high-frequency applications. Manufactured as a chip multilayer ceramic capacitor under the EMIFIL series, the device incorporates Murata's advanced ceramic processing technologies to maximize dielectric reliability and stable performance across a wide range of operating conditions. The 0805 footprint allows dense placement and makes this capacitor appropriate for compact PCBs, supporting board layouts where effective grounding and minimal transmission line impedance are required.
The NFM21CC221R1H3D features a three-pad design, which promotes superior noise shunting to ground and minimizes parasitic inductance that can degrade filtering performance. This structure is particularly well-suited for suppressing EMI in circuits with critical data lines or power rails. The base tape and top tape of the standard 8 mm-wide paper reel packaging ensure safe transport and storage prior to PCB assembly.
Engineers specifying the NFM21CC221R1H3D should note its rated values: a capacitance of 220 pF (±20%), voltage rating of DC 50V, and a current handling capacity of up to 700 mA. It is tested under standard conditions (15–35°C, 25–85% RH, atmospheric pressure 86–106 kPa) to ensure reliable operation. Capacitance, like other high dielectric constant ceramics, is temperature and voltage dependent; thus, in applications requiring tight tolerances, designers must carefully evaluate and confirm device performance under intended system conditions.
It is critical to observe the maximum applied voltage (including any superimposed AC signals) and to ensure that self-heating of the capacitor does not exceed 20°C above ambient at 25°C. Over-voltage events, including surges and excessive pulse voltages, may degrade dielectric layers and result in device failure. The NFM21CC221R1H3D is noted for its aging characteristic, as capacitance values will diminish gradually over time; periodic verification in time-constant and filter circuits is recommended for systems with strict EMC requirements.
The mechanical integrity of the NFM21CC221R1H3D is a direct function of its installation and operating environment. The capacitor is rated for unlimited moisture sensitivity (MSL 1), which facilitates ease of handling during automated assembly. However, appropriate storage at +5°C to +40°C and 20–70% RH is advised. Avoid any exposure to corrosive gases, direct sunlight, or moisture-condensing environments during storage and after installation to preserve solderability and electrical performance.
Resonance and mechanical shock must be carefully managed during PCB assembly, testing, and operation. The device should be mounted horizontally relative to board stress, especially near scores, perforations, or screw holes, to minimize the risk of cracking. Board separation, cropping, or mounting of additional components should be executed using controlled techniques (e.g., router-based separation) and jigs that minimize flexure at component locations.
For optimal reliability, the NFM21CC221R1H3D requires correctly managed mounting and soldering processes. Establish a mounting position that reduces flexural stress, particularly on densely populated or thin PCBs. Confirm the rated electrical characteristics before assembly, and avoid reusing previously mounted or dropped capacitors. Solder paste thickness should typically be between 100–150 µm to balance adhesive strength and thermal stress profile. Use only lead-free solder alloys such as Sn-3.0Ag-0.5Cu unless otherwise qualified.
During reflow and flow soldering, controlled pre-heating mitigates the impact of thermal shock, reducing the risk of cracks and solder voids. For rework, preheat both board and component before soldering iron application, and use wire and tip sizes suited for precision without imposing direct force or excessive temperature. Cleaning processes should avoid excessive ultrasonic energy; always verify process compatibility with actual assemblies.
The PCB land design is crucial for low impedance grounding and noise suppression. A sufficiently large ground plane, connected via through-holes (vias), is recommended to optimize EMI filtering. Adhesive selection, flux usage, and post-assembly washing must be managed to prevent corrosion, insufficient insulation, or degradation due to resin contraction mismatches.
NFM21CC221R1H3D capacitors should be verified within the actual circuit environment to confirm electrical, thermal, and mechanical compatibility. In high-reliability systems—such as medical, aerospace, or safety-critical controls—engineers are encouraged to contact Murata or a qualified applications expert before implementing this device. Fail-safe features such as circuit fuses should be considered, as the device is not safety standard certified and could short if cracked or critically overstressed.
Environmental atmosphere and piezoelectric phenomena must be evaluated if the capacitor is used in AC or pulse circuits, as vibration or shock may induce audible noise or performance shifts. Handling, assembly, and system operating protocols should ensure the device and assembled board are not subjected to excessive shocks, bending, or insertion forces during manufacturing or service.
For engineers considering alternative or backup sourcing, Murata offers several related series and models within the EMIFIL chip multilayer ceramic lineup, notably including the NFM21CC and compatible variants in other value ranges or package sizes (for example, NFM15CC, NFM18CC/PC, and NFM31KC/PC). These alternatives maintain similar construction and performance characteristics, allowing ease of substitution in designs where footprint and electrical specifications align. It is imperative to cross-check the capacitance, voltage, current, and package before integrating an equivalent model to ensure sustained EMC performance and mechanical reliability.
: NFM21CC221R1H3D Murata
The Murata NFM21CC221R1H3D feedthrough capacitor exemplifies robust EMI filtering performance for general electronic applications, combining compact size, high reliability, and versatile mounting options. Engineers focused on precision noise suppression and PCB integration will find this part a strong candidate for a wide spectrum of commercial design needs. Successful implementation relies on informed handling of its electrical characteristics, mechanical requirements, and process integration, as outlined in this detailed overview. For projects demanding long-term reliability and high EMC performance, the NFM21CC221R1H3D remains a compelling solution within Murata’s industry-leading ceramic capacitor portfolio.
CAP FEEDTHRU 47PF 20% 50V 0805
NO New
CAP FEEDTHRU 1000PF 20% 50V 0805
CAP FEEDTHRU 100PF 20% 50V 0805
MURATA 4kreel
MURATA 0805471
CAP FEEDTHRU 2200PF 20% 50V 0805
CAP FEEDTHRU 0.022UF 50V 0805
MURATA 4kreel
NFM21CC470R2A3D JOHANSON
MURATA 0805+
CAP FEEDTHRU 470PF 20% 50V 0805
NFM21CC220U1H3D/NFM2012R03C220RT1M00 MURATA
CAP FEEDTHRU 22PF 20% 50V 0805
MURATA SMD
September 9th, 2026
September 3th, 2026
August 25th, 2026
August 21th, 2026
August 12th, 2026
August 6th, 2026
July 29th, 2026
July 21th, 2026
July 14th, 2026
July 9th, 2026
June 29th, 2026
June 25th, 2026
June 15th, 2026
June 11th, 2026
June 5th, 2026
May 28th, 2026
May 22th, 2026
May 12th, 2026
May 8th, 2026
April 28th, 2026
April 20th, 2026
April 17th, 2026
April 8th, 2026
March 31th, 2026
March 23th, 2026
March 20th, 2026
March 9th, 2026
March 4th, 2026
February 28th, 2026
February 3th, 2026
January 28th, 2026
January 19th, 2026
January 16th, 2026
January 9th, 2026
December 29th, 2025
December 25th, 2025
December 17th, 2025
December 10th, 2025
December 4th, 2025
November 25th, 2025
November 20th, 2025
November 11th, 2025
November 3th, 2025
October 30th, 2025
October 22th, 2025
October 16th, 2025
October 9th, 2025
September 28th, 2025
September 17th, 2025
September 9th, 2025
September 1th, 2025
August 25th, 2025
August 20th, 2025
July 3th, 2025
December 18th, 2024
June 21th, 2023
April 27th, 2023
July 1th, 2022
March 4th, 2021
September 10th, 2020
January 23th, 2020
0 Articles






September 14th, 2026
August 31th, 2026
August 28th, 2026
August 18th, 2026
NFM21CC221R1H3DMurata Electronics |
Quantity*
|
Target Price(USD)
|