Microchip Technology M2S010TS-1FGG484T2

Mfr. Part

M2S010TS-1FGG484T2

Manufacturer

Micrel / Microchip Technology. Y-IC is a quality distributor of Microchip Technology products, and we will provide you with the best products, authentic supply, and responsive service.

Detailed Description

SmartFusion2 automotive-grade SoC FPGA with ARM Cortex-M3 at 166 MHz and a 10K logic-module FPGA fabric. 484-ball fine-pitch BGA package (23 x 23 mm). Integrated MCU + FPGA architecture with rich peripherals (DDR, PCIe, SERDES) and connectivity (CAN, Ethernet, I2C, SPI, UART/USART, USB). 256 KB embedded Flash, 64 KB RAM. AEC‑Q100 qualified, -40°C to +125°C junction temperature. RoHS3 compliant. Base product number M2S010. Supplier device package 484-FPBGA. Package delivery in tray. Quantity available: 2523 units.

Key Features

ARM Cortex-M3 core at 166 MHz for fast real-time control

FPGA fabric with 10K logic modules (M2S010 density)

Automotive, AEC‑Q100 series for enhanced reliability

-40°C to +125°C operating junction temperature range

256 KB on-chip Flash and 64 KB on-chip RAM

High-speed interfaces: DDR, PCIe, SERDES

Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB

233 user I/O pins for flexible design

484-FPBGA package, 23 x 23 mm body size

RoHS3 compliant, lead-free construction

MCU + FPGA architecture for hardware/software co-design

SmartFusion2 family ecosystem and tools support

Key Advantages

Single-chip integration reduces BOM, board space, and latency vs. multi-IC solutions

FPGA fabric enables hardware acceleration and rapid customization

Automotive AEC‑Q100 qualification supports demanding environments

Wide temperature range improves reliability in harsh conditions

Rich built-in interfaces lower the need for external components

High I/O count and SERDES simplify complex connectivity and bridging

Secure and robust platform from Microchip with long-term availability

Faster time to market using familiar ARM programming and FPGA workflows

Y-IC offers reliable sourcing, competitive pricing, and fast global delivery

Packaging

Type: Fine-Pitch Ball Grid Array (FPBGA)

Material: Molded plastic package with lead-free solder balls (RoHS3 compliant)

Size: 23 x 23 mm body, 484-ball footprint

Pin configuration: 484 BGA balls with 233 user I/O pins; dedicated balls for power, ground, and high-speed interfaces (see datasheet for full ball map)

Thermal characteristics: Junction temperature (TJ) -40°C to +125°C; BGA package supports efficient heat spreading with proper PCB design and vias

Electrical properties: 166 MHz core; FPGA logic density 10K modules; embedded Flash 256 KB; embedded RAM 64 KB; interface support for DDR, PCIe, SERDES, and standard serial buses (refer to datasheet for exact power rails, I/O standards, and timing)

Lifecycle

Current status: Active and widely used in automotive and industrial designs

Not nearing discontinuation to the best of current channel knowledge; Microchip maintains long-life support for SmartFusion2

Equivalent or alternative models in the SmartFusion2 family (density and features vary; check pinout and package options):

- M2S005TS (lower density, automotive grade)

- M2S025TS

- M2S050TS

- M2S060TS

- M2S090TS

- M2S150TS (higher density, automotive grade)

- Industrial/commercial counterparts: M2S005, M2S010, M2S025, M2S050, M2S060, M2S090, M2S150

Packageand speed-grade variants may include FGG484/FBGA options and different speed grades; verify compatibility in the datasheet

If you need a drop-in equivalent or a specific suffix match, please contact our sales team via the Y-IC website for detailed cross-references and availability

Key Application Areas

Automotive ECUs, gateways, body electronics, and driver assistance modules

Industrial automation, PLCs, robotics, motion and motor control

Networking and communications: Ethernet/CAN bridges, edge devices

Secure and safety-critical control systems

IoT gateways and embedded computing with customizable hardware acceleration

High-speed interface aggregation with DDR, PCIe, and SERDES

Mixed-signal control systems requiring real-time MCU + reconfigurable logic

Datasheet

Y-IC hosts the most authoritative datasheet for this exact model. For full specifications, ball maps, power rails, timing, and design guidelines, download the datasheet on this page now for the latest verified information.

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