Microchip Technology M2S010TS-1FGG484I

Mfr. Part

M2S010TS-1FGG484I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

SmartFusion2 SoC FPGA combining an ARM Cortex-M3 microcontroller running up to 166 MHz with an integrated FPGA fabric around 10K logic modules. 256 KB embedded Flash and 64 KB SRAM. Rich high-speed interfaces including DDR, PCIe, and SERDES, plus CAN, Ethernet, I2C, SPI, UART USART, and USB. 233 user I O. Industrial grade operating junction temperature from minus 40 to 100 degrees Celsius. RoHS3 compliant. Package is 484 ball FPBGA body size 23 x 23 mm in tray. Series SmartFusion2. Base product number M2S010. Architecture MCU plus FPGA.

Key Features

ARM Cortex M3 core up to 166 MHz

FPGA fabric about 10K logic modules for custom hardware acceleration

256 KB embedded Flash and 64 KB SRAM

High speed interfaces DDR PCIe SERDES

Connectivity CAN Ethernet I2C SPI UART USART USB

233 user I O for flexible board connections

484 FPBGA package 23 x 23 mm compact footprint

Industrial temperature range minus 40 to 100 degrees Celsius Tj

RoHS3 compliant

SmartFusion2 series for long term platform support

Key Advantages

One chip solution MCU plus FPGA reduces BOM size and speeds time to market

Flexible FPGA fabric lets you offload time critical tasks and tailor hardware to your application

High interface bandwidth with DDR PCIe and SERDES for data heavy designs

High I O count in a small package enables dense designs

Industrial temperature rating supports harsh environments

Flash based FPGA technology helps simplify configuration and can lower power compared to SRAM based options

Backed by Microchip ecosystem and tools for stable long term support

Packaging

Type 484 ball FPBGA also referred to as BGA

Material plastic fine pitch BGA with organic substrate

Size 23 mm x 23 mm body

Pin configuration 484 balls total with 233 user I O plus dedicated power ground and interface balls organized in I O banks

Thermal characteristics junction temperature range minus 40 to 100 degrees Celsius actual thermal resistance depends on board layout airflow and heatsinking

Electrical properties core up to 166 MHz multi voltage I O standards supported refer to datasheet for supply rails and I O bank details

Shipment format tray for assembly convenience

Lifecycle

Status active in production within Microchip’s SmartFusion2 family

No end of life announcement known at this time

Equivalent and alternative models

- Same family different densities M2S005 M2S025 M2S050 M2S090 check package options many are available in FGG484

- Same function without embedded MCU IGLOO2 family for FPGA only designs

- Higher performance alternative Microchip PolarFire SoC for Linux capable RISC V based SoC FPGA designs

- Cross vendor SoC FPGA options Xilinx Zynq 7000 and Intel Cyclone V SoC evaluate feature and pin compatibility carefully

For exact pin compatible drop ins and speed grade package suffix matching contact Y IC sales via our website for guidance

Key Application Areas

Industrial automation motion control robotics

Communications equipment networking gateways and protocol bridges

Automotive and transportation nodes using CAN and Ethernet

Medical instruments and imaging controllers

Power and energy smart grid protection and monitoring

Secure embedded systems and IoT edge gateways

Test and measurement and data acquisition

Aerospace and defense prototypes and rugged industrial systems

Datasheet

Y IC hosts the most authoritative datasheet for this product on our website. Download it from this page to get the latest specifications pin maps electrical and thermal details and design guidelines.

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