Microchip Technology M1AFS250-FG256

Mfr. Part

M1AFS250-FG256

Manufacturer

Micrel / Microchip Technology

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Detailed Description

SmartFusion Fusion series mixed-signal FPGA device with about 250K system gates. 114 user I O. 256 ball FBGA or LBGA package, 17 x 17 mm body. Core supply 1.425 V to 1.575 V. Embedded RAM 36,864 bits. Surface mount, shipped in tray. Operating junction temperature 0 to 85 C. RoHS non compliant. Base product number M1AFS250. In stock quantity available 2598.

Key Features

Fusion series flash based FPGA fabric for instant on and low power

About 250K system gates for logic implementation

114 user I O for flexible board connections

On chip RAM 36,864 bits for buffers and FIFOs

Core voltage range 1.425 V to 1.575 V

256 ball FBGA LBGA, 17 x 17 mm, surface mount

JTAG and configuration support typical of Fusion family

Broad I O standards support typical for Fusion devices such as LVCMOS, LVTTL, and differential standards like LVDS

Integrated mixed signal capabilities typical of Fusion family for power monitoring and analog interfacing

Fusion family focus on security, reliability, and instant on behavior

Key Advantages

Non volatile flash fabric starts fast, no external configuration memory needed

Low power operation helps reduce heat and power budgets

Strong reliability and SEU hardness typical of flash based FPGAs

Mature ecosystem and tools for Fusion SmartFusion development

Flexible I O and package options ease PCB layout

Suitable for embedded control that needs both logic and mixed signal features

Packaging

Type FBGA and LBGA, ball grid array, 256 balls

Material Molded plastic package with organic substrate typical for BGA

Size 17 mm x 17 mm body

Pin configuration 256 ball array with 114 user I O, remaining balls for power, ground, JTAG, configuration, and dedicated pins as defined in the datasheet

Thermal characteristics Junction temperature range 0 C to 85 C. Thermal performance depends on board design and airflow. Follow datasheet thermal derating and use good copper planes for heat spreading

Electrical properties Core supply 1.425 V to 1.575 V. Embedded RAM 36,864 bits. Logic capacity about 250K system gates. I O bank voltages and standards depend on selected interfaces and must follow datasheet limits

Lifecycle

Status Mature product family. Many designs still supported. Availability may vary by package and speed grade. Often not recommended for new designs compared to newer families

Recommended alternatives for new designs

- SmartFusion2 M2S series examples M2S010 FG256, M2S050 FG256, M2S090 FG256 for enhanced security, DSP, and newer toolchain

- IGLOO2 M2GL series examples M2GL050 FG256, M2GL090 FG256 for low power flash FPGAs without ARM subsystem

- PolarFire MPF series examples MPF100T, MPF200T for higher performance and lower power mid range FPGAs

Important note Alternatives may not be pin compatible. Check mechanical, electrical, and timing details. If you need exact fit or drop in replacement, contact our sales team via the Y-IC website for guidance and cross reference support

Key Application Areas

Industrial control, PLC, and factory automation

Power management and system supervision using mixed signal features

Motor control and motion systems

Embedded control with FPGA acceleration and flexible I O

Secure systems and tamper resistant designs

Medical devices and instrumentation

Communications interfaces, protocol bridging, and custom peripherals

Datasheet

Y-IC hosts the most authoritative datasheet for M1AFS250-FG256 on our website. Download the datasheet from this page to get complete electrical limits, pin maps, timing, and design guidelines.

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