LSI LSISAS2208SP-2

Mfr. Part

LSISAS2208SP-2

Manufacturer

LSI. Y-IC is a quality distributor of LSI and we will provide you with the best products and services.

Detailed Description

LSI SAS2208SP-2 is a 6 Gb/s SAS/SATA RAID-on-Chip (ROC) used in many enterprise RAID adapters and server platforms. It integrates an SAS/SATA controller and hardware RAID engine to manage multiple drives with high throughput and low latency. Typical host interface is PCI Express Gen3 x8, and typical drive connectivity is 8 SAS/SATA PHYs at 6 Gb/s per lane. It is widely deployed in 2012-era data center and OEM RAID cards. Category: Integrated Circuits (ICs). Classification: Specialized ICs. Data code: 12+. Current stock: 1303 units.

Key Features

6 Gb/s SAS and SATA support

Up to 8 drive ports via integrated SAS/SATA PHYs (via expanders, supports large drive counts)

PCI Express Gen3 x8 host interface for high bandwidth

Hardware RAID levels: 0, 1, 5, 6, 10, 50, 60

Enterprise data protection features commonly supported on LSI ROC platforms (e.g., online capacity expansion, fast rebuild, consistency checks; confirm via datasheet/firmware notes)

Broad OS and platform support through LSI/Broadcom storage stacks

Proven compatibility with many OEM RAID adapters and backplanes of the 2010s

Key Advantages

Mature, widely deployed silicon with strong reliability in enterprise storage

Hardware offload for RAID operations reduces CPU load and improves I/O performance

Scales to many drives via SAS expanders

Stable firmware ecosystem and toolchain from LSI/Broadcom storage solutions

Ideal for cost-sensitive refresh and maintenance of existing 6 Gb/s SAS infrastructures

Packaging

Package/case code: 869 (manufacturer packaging ID; contact our team for exact mechanical drawing)

Package type: FCBGA (flip-chip ball grid array), lead-free, RoHS compliant

Delivery form: ESD-safe trays are typical for high-pin-count BGA devices

Size: Large BGA footprint, suitable for heatsink mounting on adapter PCBs (exact dimensions and ball map in datasheet)

Pin configuration: High pin count BGA; ball pitch and full ball map detailed in the datasheet

Thermal characteristics: Requires proper heatsink and airflow on the host card; follow thermal design guidelines to keep junction temperature within spec

Electrical properties: PCIe Gen3 x8 host interface; 6 Gb/s SAS/SATA PHYs; multi-rail power (core and I/O rails as specified in the datasheet); follow decoupling and power sequencing requirements from LSI guidelines

Lifecycle

Status: Legacy/older-generation device. Many deployments remain in service, but new designs typically use newer ROC generations.

Nearing discontinuation: Yes, this generation is considered legacy and may be NRND/EOL depending on lot and supplier. Availability varies by stock.

Equivalent or alternative models:

- Broadcom/LSI SAS3108 (12 Gb/s SAS, newer-generation ROC for modern RAID adapters)

- Broadcom/LSI SAS3008 (12 Gb/s SAS IOC/HBA; not a ROC but common alternative when hardware RAID is not required)

- Broadcom/LSI SAS2308 (6 Gb/s SAS IOC/HBA; suitable for non-RAID or software RAID scenarios)

- Broadcom/LSI SAS2008 (older 6 Gb/s IOC; for maintenance of very legacy systems)

- Note: Drop-in equivalence is unlikely. Board-level compatibility, firmware, and thermal budgets differ. Contact our sales team for guidance on the best replacement for your hardware.

If you need a direct, system-compatible alternative and do not see it listed, please contact our sales team via our website for detailed support and cross-references.

Key Application Areas

Server RAID controllers and HBAs

DAS/JBOD storage arrays

Enterprise backup and archiving systems

Rackmount storage appliances and NAS

Industrial and telecom servers requiring robust RAID and SAS connectivity

Datasheet

Our website hosts the most authoritative datasheet for LSISAS2208SP-2. For accurate mechanical, electrical, and thermal specifications, download the datasheet on this page now.

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