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| Part Number: | TPS62313YZDR |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC REG BUCK 1.8V 500MA 8DSBGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Output (Min/Fixed) | 1.8V |
| Voltage - Output (Max) | - |
| Voltage - Input (Min) | 2.7V |
| Voltage - Input (Max) | 6V |
| Topology | Buck |
| Synchronous Rectifier | Yes |
| Supplier Device Package | 8-DSBGA |
| Series | - |
| Package / Case | 8-UFBGA, DSBGA |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Output Type | Fixed |
| Output Configuration | Positive |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Number of Outputs | 1 |
| Mounting Type | Surface Mount |
| Function | Step-Down |
| Frequency - Switching | 3MHz |
| Current - Output | 500mA |
| Base Product Number | TPS623 |




The TPS62313YZDR, manufactured by Texas Instruments, is a high-frequency synchronous step-down DC-DC converter, specifically tailored for battery-powered and portable electronic applications. The device is offered in ultra-small 8-Dual Side Ball Grid Array (DSBGA) and 8-/10-pin CSP packages, enabling high-density PCB designs. With a fixed output voltage of 1.8V and a maximum continuous output current of 500mA, the TPS62313YZDR is designed to support low-voltage digital cores, processors, and high-performance portable subsystems.
The converter operates from an input voltage range that supports single-cell Li-Ion batteries and multi-cell NiMH/NiCd packs. With its optimized high-frequency operation and compact profile, the TPS62313YZDR allows engineers to minimize solution size in space-constrained designs.
The TPS62313YZDR integrates a comprehensive feature set aimed at maximizing efficiency, system flexibility, and ease of implementation:
Up to 93% conversion efficiency at 3MHz switching frequency, significantly reducing power loss and thermal dissipation.
Full load capability with 500mA output current at input voltages down to 2.7V.
Advanced control architecture ensuring fast load and line transient response, which is critical in dynamic applications such as mobile devices.
3MHz fixed-frequency operation enables a compact, low-profile output filter (1mm total solution height achievable).
Power-save mode at light load conditions, reducing quiescent current to as low as 86μA and further extending battery life in standby modes.
Excellent PWM DC voltage accuracy, tightly regulated within -0.5% to +1.3% over temperature.
Flexible mode selection and on-the-fly synchronization to an external clock, supporting noise-sensitive architectures.
100% duty cycle operation provides ultra-low dropout performance, maximizing usable battery capacity.
Comprehensive system protection including adjustable soft-start, undervoltage lockout, integrated current limit, short-circuit protection, and thermal shutdown.
The TPS62313YZDR is widely suited for space- and efficiency-critical portable systems. Its common engineering applications include:
Mobile phones and smart-phones utilizing advanced digital basebands and application processors.
Wireless LAN and Bluetooth™ modules requiring stable, low-noise power supply rails.
USB-powered devices and modems where compactness and efficiency are paramount.
Portable PDA, notebook, and handheld computer designs demanding robust DC-DC conversion.
Digital cameras and other consumer electronics that benefit from extended battery run time.
The TPS62313YZDR operates as a synchronous buck (step-down) converter with robust voltage-mode control and fast response. It employs the following operation modes:
In moderate to heavy load conditions, the device utilizes high-frequency PWM (Pulse Width Modulation) control. The controller’s input voltage feed-forward mechanism delivers superior transient response to load and input voltage changes.
At light loads, the converter automatically enters power-save mode using pulse frequency modulation (PFM), reducing switching losses and improving efficiency during system standby.
Mode selection is achieved via the MODE/SYNC pin—tied to ground for auto mode operation or pulled high to force fixed-frequency PWM, facilitating reduced output voltage ripple in noise-sensitive designs. Additionally, the converter can synchronize on-the-fly to an external clock, useful for multi-converter, phase-interleaved system architectures.
Internal soft-start circuitry limits inrush current at power-up, sequentially increasing switch current, and protecting both the external power source and converter.
The enable (EN) logic provides remote or processor-controlled power sequencing, while integrated protection features handle supply under-voltage, output short-circuit events, and over-temperature conditions.
The TPS62313YZDR is characterized for operation over a wide temperature range (-40°C to +85°C), making it suitable for industrial and consumer electronics. Notable electrical parameters include:
Input voltage operating range suitable for typical portable power sources (see device datasheet for specifics).
Fixed 1.8V output with precise tolerance.
Maximum continuous output current of 500mA.
High-speed transient response with a minimum on-time of 35ns.
Quiescent current as low as 86μA during operation (even lower during shutdown).
Shutdown supply current below 1μA, minimizing system standby losses.
Absolute maximum ratings should be observed to prevent device degradation or damage, as detailed in the official datasheet.
To maintain reliable operation, careful attention must be given to the thermal characteristics and mechanical mounting:
The CSP package (YZD, YED) offers a low thermal footprint (θJA ≈ 250°C/W), suitable for low to moderate power dissipation.
The QFN option, featuring an exposed thermal pad, allows for enhanced heat sinking via direct PCB attachment. The thermal pad must be soldered to the board for proper thermal and mechanical performance.
System-level thermal management—such as improved airflow, increased PCB copper area, and via stitching to ground planes—can extend the thermal margin and dissipate more power.
High-frequency switching regulators such as the TPS62313YZDR demand meticulous PCB layout for optimum performance:
Minimize the loop area of high di/dt current paths (input capacitor, inductor, output capacitor) using short and wide traces.
Place key passive components (input/output capacitors, inductor) as close as possible to their respective pins.
Establish a solid, low-impedance ground plane under the converter for improved EMI and thermal performance.
Use star-point grounding where necessary to separate power and analog grounds and minimize cross-interference.
The voltage feedback path (VOUT) should be routed away from noisy nodes, shielded by a guard ring where possible.
Engineers should select component values for the output filter (inductor and capacitors) to align with internal compensation, filter bandwidth, and transient performance:
The recommended starting values are L = 1μH and CO = 10μF (X5R/X7R dielectric), providing a corner frequency near 50kHz, which is optimal for loop stability with the device’s internal compensation network.
Acceptable inductor values range from 0.7μH to 6.2μH, with the rated current comfortably above peak ripple requirements. Lower inductance values trade off efficiency at light loads for improved transient response.
Output capacitors must maintain low ESR for minimal voltage ripple—ceramic types are strongly preferred. At light loads, voltage ripple is predominantly set by the converter’s internal comparator thresholds.
The input capacitor should also be low ESR (2.2μF to 4.7μF ceramic typical), especially in designs where the supply wiring is long or subject to surges.
For adjustable output voltage variants in the series (not TPS62313YZDR specifically), resistor selection and PCB layout near the feedback pin are critical to stability and accuracy, but TPS62313YZDR features a factory-set 1.8V output.
Programming and Advanced Functions:
The device supports dynamic output voltage control with external DACs (TPS62300/TPS62320), but for TPS62313YZDR (fixed 1.8V), this is not applicable.
The device also includes active discharge control (in specific variants) to expedite output rail discharge when disabled—important in systems requiring tight power-down sequencing.
Available packages include the lead-free 8-ball DSBGA and NanoFree™ CSP, as well as the QFN with PowerPAD™ for high power dissipation requirements.
The TPS62313YZDR is RoHS3 compliant (lead-free), REACH unaffected, and is categorized as MSL 1 (unlimited shelf life under suitable conditions).
Moisture sensitivity, land pattern recommendations, and stencil design considerations should follow Texas Instruments’ guidelines for optimal assembly yield.
For design engineers seeking equivalent or alternative solutions within the same family or performance envelope, Texas Instruments offers several step-down converters with comparable specifications:
TPS62311 (fixed output, other voltages available)
TPS62315 (fixed output, different voltage rating)
TPS62300 and TPS62320 (adjustable output voltage for wider application flexibility)
TPS62301, TPS62302, TPS62303, TPS62304, TPS62305 (different output voltage/fixed settings or feature sets)
Selection should be based on output voltage requirements, application flexibility, package constraints, and any system-specific features such as adjustable output or advanced sequencing.
The Texas Instruments TPS62313YZDR stands out as a highly integrated, cost-effective, and compact step-down DC-DC converter. Its efficiency, fast transient performance, and wide system-level flexibility make it ideally suited for next-generation portable and battery-powered designs. By adhering to the layout, filter selection, and thermal management guidelines outlined above, engineers can easily implement the TPS62313YZDR to deliver robust, reliable power with minimal PCB footprint. For designs needing voltage flexibility or other output rails, the extensive TPS623xx family provides drop-in alternatives, ensuring a seamless fit into both new and legacy system architectures.
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