Texas Instruments SN74AUP1G58YEPR

Mfr. Part

SN74AUP1G58YEPR

Manufacturer

Luminary Micro/Texas Instruments. Y-IC is a quality distributor for this brand and we will provide you with the best products and services

Detailed Description

Ultra‑low‑power configurable single gate from TI’s 74AUP series. One 3‑input, multiple‑function logic cell that can implement many standard logic functions by simple pin wiring. Tiny 6‑ball DSBGA package for space‑constrained designs. Operates from 0.8 V to 3.6 V, drives 4 mA, and is RoHS3 compliant. Surface‑mount, tape‑and‑reel. Base product number 74AUP1G58. In stock quantity: 2541 units

Key Features

Logic type: Configurable multiple‑function single gate

Inputs: 3

Outputs: Single‑ended

Number of circuits: 1

Supply voltage: 0.8 V to 3.6 V

Output drive: 4 mA (high), 4 mA (low)

Series: 74AUP (advanced ultra‑low power CMOS)

Schmitt trigger input: No

Operating temperature: −40°C to +85°C

Mounting: Surface mount

Package/case: 6‑DSBGA (also referenced as 6‑XFBGA, DSBGA)

Supplier device package: 6‑DSBGA

Compliance: RoHS3

Shipment: Tape & Reel (TR)

Key Advantages

Saves board space with a tiny 6‑ball DSBGA footprint

Cuts power consumption with AUP ultra‑low‑power CMOS

Flexible “wire‑to‑configure” logic reduces BOM and simplifies design changes

Wide 0.8–3.6 V operation suits battery‑powered products

Adequate 4 mA drive for small loads and digital interfacing

Simple, fast integration for glue logic around MCUs, sensors, and radios

Available in volume now (2541 units), enabling quick builds and repairs

Packaging

Type: DSBGA wafer‑level chip‑scale package, 6 balls

Form factor: Ultra‑compact, low profile, ideal for dense portable designs

Ball array: 2×3 grid; orientation mark for pin A1 reference

Material: Bare die with polymer passivation; lead‑free SAC solder balls (typical for DSBGA)

Shipment format: Tape & Reel (TR) for automated pick‑and‑place

Thermal characteristics: Very low self‑heating due to ultra‑low power; −40°C to +85°C operating range

Electrical properties in package: 0.8–3.6 V supply, 4 mA drive, single‑ended output, no Schmitt inputs

Handling notes: Use fine‑pitch BGA pads and controlled reflow; follow TI’s board layout and moisture handling guidelines

Lifecycle

Status: Active and in production; not nearing discontinuation based on current industry status for 74AUP logic

Same‑function or similar alternatives (verify pinout and timing before substitution):

- Texas Instruments SN74LVC1G58 (higher drive, 1.65–5.5 V operation; different power profile)

- Texas Instruments SN74HC1G58 (2–6 V HC‑CMOS; higher speed, higher power)

- Texas Instruments SN74AUP1G97 (configurable logic gate variant; different function options)

- Cross‑vendor families with similar configurable gates exist; for exact cross and pin‑for‑pin matches, contact Y‑IC sales

If you need confirmed drop‑in equivalents, please contact our sales team via the Y‑IC website for detailed guidance and the latest cross‑reference

Key Application Areas

Smartphones, wearables, and portable electronics (space and power sensitive)

IoT sensor nodes and battery‑powered devices

MCU glue logic: gating, combining, inverting, multiplexing of digital signals

Consumer electronics and home appliances

Industrial control and instrumentation where low power and small size are priorities

Clock or signal routing and simple condition logic (use clean edges; no Schmitt inputs)

Datasheet

Y‑IC provides the most authoritative datasheet for this product model on our website. We recommend downloading it directly from this page for the latest specifications, pinouts, and layout guidance

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