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| Part Number: | SN74ALVC16244AGRDR |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC BUFFER NON-INVERT 3.6V 54BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.65V ~ 3.6V |
| Supplier Device Package | 54-BGA Microstar Junior (8x5.5) |
| Series | 74ALVC |
| Package / Case | 54-TFBGA |
| Package | Tape & Reel (TR) |
| Output Type | 3-State |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Product Attribute | Attribute Value |
|---|---|
| Number of Elements | 4 |
| Number of Bits per Element | 4 |
| Mounting Type | Surface Mount |
| Logic Type | Buffer, Non-Inverting |
| Input Type | - |
| Current - Output High, Low | 24mA, 24mA |
| Base Product Number | 74ALVC16244 |




The SN74ALVC16244AGRDR from Texas Instruments stands as a robust, high-speed 16-bit non-inverting buffer/driver optimized for memory address, clock, and bus-oriented signal management in modern digital systems. Operating across a wide voltage range of 1.65 V to 3.6 V, this device belongs to TI's Widebus™ family and is offered in a compact 54-ball BGA Microstar Junior package. The wide voltage compatibility and high performance make it an ideal fit for dense, low-voltage platforms such as computing motherboards, networking hardware, and embedded system designs where reliable, high-throughput data buffering is critical.
Engineers evaluating the SN74ALVC16244AGRDR will find several key features that distinguish it in high-performance digital applications:
High-speed operation, with a maximum propagation delay (t_pd) of just 3 ns at 3.3 V, enables rapid data transfer and reduced latency in time-sensitive circuits.
Strong output drive capability of ±24 mA at 3.3 V, making it suitable for interfacing with multiple loads or higher-capacitance bus lines.
Three-state outputs support efficient bus sharing, allowing multiple devices to connect to a common bus without interference.
Enhanced reliability with latch-up performance exceeding 250 mA (per JESD 17) and ESD protection levels surpassing JESD 22 standards, including 2000 V (HBM), 200 V (Machine Model), and 1000 V (Charged-Device Model).
Flexible operation as four 4-bit, two 8-bit, or a single 16-bit buffer, increasing design versatility for various system architectures.
These features ensure the SN74ALVC16244AGRDR not only meets but often exceeds the demands of modern bus and memory interface designs, supporting robust signal integrity and system reliability.
The SN74ALVC16244AGRDR is designed to function as a non-inverting buffer/driver with true outputs and symmetrical active-low output-enable (OE) control inputs. Its logical configuration allows for dynamic reconfiguration within a system, operating as:
Four independent 4-bit buffers
Two 8-bit buffers
One continuous 16-bit buffer
When the OE pin is asserted low, the respective output drivers become active, allowing data signals to pass through in buffer mode. When OE is high, the outputs are placed in a high-impedance state, effectively disconnecting the device from the bus to prevent bus contention and support systems with shared or multiplexed data lines. The inherent three-state control aids in minimizing power consumption and elevates the device's suitability for complex, multi-processor systems.
To safeguard against unwanted power-on and power-down behavior, it is recommended for designers to tie the OE input to Vcc through an appropriate pull-up resistor, ensuring predictable high-impedance output states during unstable supply conditions.
From an engineering perspective, the SN74ALVC16244AGRDR offers impressive electrical performance parameters that are pivotal for high-speed, high-density digital designs:
Operating voltage (Vcc): 1.65 V to 3.6 V, supporting compatibility with various logic families and voltage rails.
Maximum propagation delay: 3 ns at 3.3 V, minimizing timing bottlenecks for fast data pathways.
Output voltage handling: Capable of interfacing comfortably within the specified supply range.
Input and output current capabilities: ±24 mA at 3.3 V, essential for direct driving of bus lines and external devices.
ESD protection: Exceeds standard requirements, enhancing reliability in environments with potential ESD exposure.
Latch-up immunity: >250 mA (JESD 17), supporting stable long-term operation even under adverse transient events.
These parameters ensure that the SN74ALVC16244AGRDR can be confidently integrated into designs requiring high bandwidth, noise immunity, and durability—attributes particularly valued in computing, telecom, and industrial automation sectors.
To address the needs of dense PCBs and automated assembly lines, the SN74ALVC16244AGRDR is available in the Microstar Junior 54-ball BGA package. Notable considerations include:
Small footprint and low profile suited for high-density and low-profile board designs.
JEDEC-compliant outline ensures broad compatibility with standard board layouts and assembly practices.
Attention to solder mask and stencil design—adhering to IPC guidelines—ensures optimal paste deposition and reliable solder joints, minimizing risks of open or short contacts in mass production.
The recommended package mounting and handling practices (including control of moisture sensitivity and reflow conditions) are crucial to maintain device integrity and performance through the manufacturing process.
Mechanical and dimensional details are provided according to JEDEC and IPC standards, so layout, paste, and assembly engineers can confidently implement the device into new or existing platforms.
In the context of product lifecycle management and risk mitigation, it is prudent for design and procurement professionals to consider potential equivalents or alternatives to the SN74ALVC16244AGRDR. Within the Texas Instruments portfolio, alternative package variants of the SN74ALVC16244A series (such as those in TSSOP or other BGA configurations) may be available, offering identical or near-identical logic and electrical characteristics with different mechanical footprints.
For direct functionality replacement, look for parts with:
Comparable drive strength (±24 mA output)
Near-identical timing parameters (t_pd around 3 ns)
Three-state non-inverting buffer architecture, 16-bit width, and compatibility with 1.65 V to 3.6 V logic levels
Manufacturers may offer pin-compatible or functionally equivalent parts that allow drop-in replacement, easing concerns regarding end-of-life, supply chain continuity, or multi-sourcing requirements. Always validate the electrical and mechanical compatibility within your design and check the latest lifecycle and environmental compliance status before selecting alternate models.
: Selecting the SN74ALVC16244AGRDR for advanced digital designs
The SN74ALVC16244AGRDR represents a mature, high-performance solution for engineers seeking reliable, high-capacity buffering and driving in complex digital systems. Its combination of high-speed operation, robust output capability, flexible logic segmentation, and advanced ESD/latch-up protection make it a strong candidate for applications in memory address decoding, bus interfacing, and digital system synchronization. By thoroughly evaluating the device’s electrical and mechanical profiles within the context of system requirements, design engineers and procurement professionals can ensure optimal selection and deployment of the SN74ALVC16244AGRDR or its suitable alternatives for both current and future designs.
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