Intel KC80524KX333256

Mfr. Part

KC80524KX333256

Manufacturer

Intel

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Detailed Description

Mobile Intel Pentium II microprocessor, 32-bit, single core, 333 MHz clock, PBGA-615 package for surface-mount assembly. Supplier device package listed as 615-PBGA. I/O voltage 1.6 V. RoHS non-compliant. Main Category: Integrated Circuits (ICs). Small Classification: Embedded – Microprocessors. Available quantity: 6789 units.

Key Features

32-bit x86 architecture compatible with a wide range of legacy software

Mobile Intel Pentium II core running at 333 MHz

Single-core CPU for stable, predictable behavior in embedded tasks

PBGA-615 package for compact board layouts

I/O voltage 1.6 V for reduced I/O power

Part of the Mobile Pentium II series for portable and embedded systems

Designed for surface-mount reflow assembly

Key Advantages

Proven x86 compatibility for long-life legacy systems and software

Mature platform with broad OS support (DOS, Windows 9x/NT, many embedded RTOS)

PBGA package supports high pin count in a small footprint

Available inventory for immediate maintenance and replacement needs

Stable performance with simple thermal management compared to newer high-power CPUs

Packaging

Type: PBGA (Plastic Ball Grid Array), 615-ball count

Material: Molded plastic/organic laminate substrate with solder ball array

Size: Compact square BGA footprint typical of 615-ball devices (see datasheet for exact dimensions)

Pin configuration: 615-ball grid; detailed ball map, pitch, and signal assignments in the datasheet

Mounting: Surface mount, requires fine-pitch BGA assembly and X-ray inspection for quality

Thermal characteristics: BGA helps heat spreading to the board; use proper heat sink or thermal interface per Intel guidance; ensure airflow and board copper for heat dissipation

Electrical properties: I/O voltage 1.6 V; 32-bit data path; 333 MHz CPU frequency; follow Intel power rail, decoupling, and sequencing requirements in the datasheet

Package / Case references: 615-PBGA (also listed as 615-BGA by some sources)

Supplier Device Package: 615-PBGA

Shipping: Bulk packaging

Lifecycle

Status: Legacy product; not recommended for new designs and likely discontinued

Drop-in equivalents: None guaranteed due to unique ball-out, power rails, and package specifics

Functional alternatives (non drop-in, require redesign): Intel Mobile Pentium III family, Intel Mobile Celeron (BGA packages), VIA C3 (x86, BGA), AMD Geode GX/LX (x86, BGA). Evaluate instruction set needs, thermal limits, performance, and board compatibility carefully.

If you need exact replacements or best-fit alternatives, contact our sales team via the Y-IC website for model matching, availability, and engineering guidance

Key Application Areas

Legacy laptop and portable systems maintenance

Industrial embedded controllers needing x86 compatibility

Telecom and networking appliances from the Pentium II era

Medical and instrumentation equipment updates and repairs

Point-of-sale terminals, kiosks, thin clients running legacy OS

Educational and lab platforms requiring classic x86 behavior

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading it directly from this page to get exact pin maps, electrical specifications, timing, mechanical dimensions, and thermal guidelines.

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