Intel EP2S30F672C5RB

Mfr. Part

EP2S30F672C5RB

Manufacturer

Intel Y-IC is a quality distributor of Intel Altera brand products and we will provide you the best products and services

Detailed Description

High performance FPGA from the Stratix II family with 33880 logic elements 1694 LABs or CLBs and 500 user I O pins in a 672 ball FBGA package 27 x 27 mm Designed for advanced logic prototyping high speed parallel data processing memory interfacing and timing critical control The device operates at a core supply of 1.15 V to 1.25 V typical 1.2 V commercial temperature grade 0 to 85 C TJ Surface mount BGA package in tray packing

Key Features

Stratix II architecture with second generation adaptive logic for higher performance per logic element

33880 logic elements and 1694 LABs CLBs for mid density designs

500 I O pins with multi standard support including LVTTL LVCMOS SSTL HSTL LVDS and other differential standards

TriMatrix memory architecture across the family offering distributed small medium and large RAM blocks consult datasheet for EP2S30 specific counts

Dedicated DSP 18 x 18 multipliers and arithmetic resources for signal processing and math acceleration

Multiple PLLs and robust global and regional clock networks for precise timing and clock domain management

Flexible configuration modes including Active Serial Passive Serial Fast Passive Parallel and JTAG IEEE 1149.1

On chip clock management DQS capture and timing features for DDR SDRAM interfaces

ESD sensitive device with standard handling and storage protections required

RoHS lead free variant indicated by the RB suffix

Key Advantages

Strong performance to cost ratio for mid range FPGA applications

Large I O count supports wide parallel buses memory interfaces and many peripherals at once

Mature ecosystem tools reference designs and proven reliability in the field

Reconfigurable hardware shortens time to market compared to ASICs and allows field updates

Rich clocking and DSP features reduce external components and board complexity

Packaging

Type FBGA BGA

Material Molded substrate based plastic BGA with lead free solder balls RB suffix

Size 27 mm x 27 mm body 672 ball footprint

Pin configuration 672 ball grid array with approximately 500 user I O pins and remaining balls for power ground configuration and dedicated functions see pinout in datasheet

Mounting Surface mount compatible with standard BGA reflow per J STD 020

Moisture sensitivity BGA devices are commonly MSL 3 at 260 C reflow confirm on actual label and datasheet

Thermal characteristics Commercial junction temperature 0 C to 85 C TJ Use the Intel PowerPlay Early Power Estimator and device datasheet for power and thermal calculations Provide adequate copper area airflow or heatsinking as required

Electrical properties Core supply VCCINT 1.15 V to 1.25 V typical 1.2 V I O banks support multiple voltages such as 1.5 V 1.8 V 2.5 V 3.3 V depending on I O standard JTAG compliant to IEEE 1149.1

Lifecycle

Status Stratix II devices including EP2S30F672C5RB are mature legacy and many specific order codes are obsolete or not recommended for new designs

Recommended action For new designs consider newer families such as Intel Stratix 10 Agilex Stratix V Stratix IV or Arria families for better performance power and longevity

Same family similar alternatives EP2S30F672C5N lead free variant EP2S30F672C4N faster speed grade 4 EP2S30F672C3N speed grade 3 EP2S30F672I5N industrial temperature EP2S30F672C6N slower speed grade 6 Higher density same package family options may include EP2S60F672 devices verify pinout and timing

Cross family functional alternatives not pin compatible Stratix III EP3SL series Stratix IV EP4SE series Stratix V and Arria series depending on your performance transceiver and power needs

Pin to pin note Cross generation devices are generally not pin compatible Re verification of pinout timing and power is required

If you do not find a suitable equivalent or need lifecycle confirmation please contact our sales team on the Y IC website for the latest options lead times and vetted alternates

Key Application Areas

Wired communications and networking line cards switches routers backplane logic without multi gig serial

Industrial control motion control PLC and high channel count I O aggregation

Test and measurement protocol bridging stimulus capture and signal conditioning

Video and image processing parallel pixel pipelines color space conversion scaling and filtering

Memory interface controllers DDR and DDR2 SDRAM and SRAM with DQS alignment

High speed parallel data acquisition and processing using LVDS I O

Datasheet

Our website provides the most authoritative datasheet and technical collateral for EP2S30F672C5RB Download the datasheet directly on this page for full specifications pinouts configuration modes timing and power guidance

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