Intel EP2S30F672C5NRB

Mfr. Part

EP2S30F672C5NRB

Manufacturer

Intel (formerly Altera). Y-IC is a quality distributor of Intel’s FPGA products. We supply genuine parts and deliver top-tier service, support, and solutions for your designs.

Detailed Description

Stratix II family FPGA, medium-density, high-performance device. 33,880 logic elements and 1,694 LABs/CLBs, 500 user I/O. Core supply 1.15–1.25 V. Commercial operating junction temperature 0°C to 85°C. 672-ball FBGA, 27 mm x 27 mm body, surface-mount. Supplied in tray packaging. Ideal for advanced logic, DSP, and high-speed I/O applications.

Key Features

Stratix II architecture for high performance and efficient logic utilization

33,880 logic elements (LEs) for substantial design capacity

1,694 LABs/CLBs for structured logic implementation

500 user I/O pins for rich connectivity

Embedded memory and DSP/multiplier resources (TriMatrix memory architecture and dedicated DSP features typical of Stratix II)

Multiple phase-locked loops (PLLs) for robust clock management

Support for common I/O standards (e.g., LVDS, LVCMOS, SSTL, HSTL; see datasheet for bank-specific support)

Designed for use with Intel Quartus design tools and IP

Key Advantages

Strong compute and routing performance for its class

Flexible I/O and clocking to integrate with diverse interfaces

Mature ecosystem, proven reliability, and broad application history

Scalable within the Stratix II family for varying densities and packages

Well-documented device with comprehensive design resources

Packaging

Type: Fine-Pitch Ball Grid Array (FBGA)

Ball count: 672

Body size: 27 mm x 27 mm

Mounting: Surface-mount (SMT)

Supplier device package: 672-FBGA (27x27); also referenced as 672-BBGA in some materials

Shipment: Tray

Material: Molded package over organic substrate with solder ball array

Pin configuration: 672-ball grid; 500 user I/O plus dedicated power, ground, configuration, JTAG, and clock pins arranged in banks

Thermal characteristics: Junction temperature 0°C to 85°C (commercial). Follow best practices for heatsinking, copper planes, thermal vias, and airflow; consult datasheet for θJA/θJC and power dissipation guidance

Electrical properties: Core supply 1.15–1.25 V (nominal 1.2 V). Separate rails per I/O bank for supported standards. Differential I/O available. Refer to datasheet for exact voltage levels, current limits, timing, and ESD ratings

Lifecycle

Status: Mature and generally considered NRND/EOL in many channels. Availability may be limited. New designs typically migrate to newer Intel FPGA families

Same-family options (check pin, package, and speed grade carefully; not all are pin-compatible):

- EP2S30F672C5N (same family, similar density and package, RoHS)

- EP2S30F672C3N / EP2S30F672C4N (faster speed grades)

- EP2S30F672I5N (industrial temperature)

- EP2S30F780C5N / EP2S30F1020C5N (same device, different ball counts/packages)

Newer-generation alternatives (functional alternatives, not pin-compatible; choose based on performance, power, and I/O needs):

- Stratix III/IV/V families for higher performance

- Stratix 10 and Agilex for state-of-the-art performance and transceivers

- Arria V/10 for balanced performance/power

- Cyclone IV/V/10 for lower power and cost with comparable or lower densities

If you need exact drop-in or closest-match guidance, contact our sales team via the Y-IC website. We will help you identify the best replacement or migration path.

Key Application Areas

Wired communications and networking equipment (switches, routers, base stations)

High-speed data acquisition, filtering, and DSP acceleration

Video and image processing pipelines

Interface bridging and protocol conversion

Industrial automation, control, and motor control

Prototyping and hardware acceleration for custom logic

Test and measurement instruments

Aerospace/defense (use industrial-temp variants where required)

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for EP2S30F672C5NRB on our website. We strongly recommend downloading it from this page to get complete electrical, timing, I/O bank, thermal, and packaging details.

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