Intel EP2AGX45CU17C5N

Mfr. Part

EP2AGX45CU17C5N

Manufacturer

Intel (Arria II GX family, formerly Altera). Y-IC is a quality distributor for Intel. We deliver original, traceable Intel FPGA products and provide customers with the best service, fast fulfillment, and reliable technical support.

Detailed Description

Mid-range Intel Arria II GX FPGA with 45K logic elements, 3.5 Mbits embedded RAM, and high-speed serial capability. 156 user I/O in a 358-ball FCBGA package (17 x 17 mm). Commercial junction temperature 0°C to 85°C. Core supply 0.87 V to 0.93 V for low power operation. Surface-mount device shipped in tray. RoHS compliant.

Key Features

Family and series: Arria II GX (Intel)

Base product: EP2AGX45 (approx. 45K logic elements)

Logic resources: 42,959 logic elements; 1,805 LABs/CLBs

Embedded memory: 3,517,440 total RAM bits (M9K blocks)

User I/O: 156

Package: 358-UBGA / FCBGA, 17 x 17 mm body, tray packing

Mounting: Surface mount

Operating temperature: 0°C to 85°C (TJ, commercial)

Core voltage: 0.87 V to 0.93 V

Transceivers: GX family includes integrated multi-gigabit serial transceivers for protocols like PCI Express, Gigabit Ethernet, Serial RapidIO, and other SERDES-based links

Clocking: Multiple PLLs and global/regional clock networks

DSP: Variable-precision DSP/multiplier blocks for signal processing

I/O standards: Supports common single-ended and differential standards (for example, LVCMOS, LVDS; bank-dependent)

Configuration methods: JTAG and serial configuration options

RoHS: Fully RoHS compliant

Key Advantages

Balanced performance and power for mid-range designs

Stable, proven platform with broad ecosystem support

Low core voltage helps reduce power consumption

Integrated transceivers simplify high-speed link design

Rich embedded memory and DSP resources for data paths and signal processing

Flexible I/O and clocking for diverse board-level requirements

Mature toolchain support and IP availability

Y-IC ensures genuine parts, competitive pricing, and fast delivery

Packaging

Type: Flip-Chip Ball Grid Array (FCBGA), also referenced as UBGA/LFBGA in supplier data

Material: Organic substrate with molded epoxy; lead-free SAC solder balls (RoHS compliant)

Size: 17 mm x 17 mm body

Ball count: 358 balls total

Pin configuration: 156 user I/O; remaining balls dedicated to power, ground, transceiver lanes, configuration pins, JTAG, reference clocks, and other system pins

Thermal characteristics: Commercial TJ 0°C to 85°C; flip-chip construction improves thermal conduction to PCB. Use good copper planes, adequate airflow, and heatsinking as required by your thermal model and Intel guidelines.

Electrical properties: Core supply 0.87–0.93 V; separate supplies for I/O banks and transceivers; supports multiple I/O standards (bank-dependent). Follow Intel power sequencing and decoupling recommendations for stable operation.

Mounting and shipping: Surface mount; shipped in trays for automated assembly. Moisture sensitivity handling per Intel datasheet and JEDEC guidelines.

Lifecycle

Status: Mature product family. Some variants may be NRND (not recommended for new designs) or approaching end-of-life depending on region and date. Confirm current status with our sales team.

Same-family equivalents and close alternatives (check pinout, speed grade, and temperature):

- EP2AGX45CU17I5N (industrial temperature range, similar resources)

- EP2AGX45CU17C4N / EP2AGX45CU17I4N (different speed grade)

- EP2AGX45F35C5N / EP2AGX45F35I5N (different BGA package size and ball map)

- Higher density, same family: EP2AGX65CU17xN, EP2AGX90CU17xN (more logic/memory; verify PCB impact)

Newer-generation alternatives for new designs (feature and toolchain advantages; not pin-compatible):

- Arria V GX/GT families

- Cyclone V GX (cost/power-focused with transceivers)

- Intel Agilex 5 (latest mid-range platform with advanced transceivers and power efficiency)

If you need drop-in or application-compatible options beyond the list above, contact our sales team via the Y-IC website for tailored guidance and the latest lifecycle updates.

Key Application Areas

Communications and networking (Ethernet, packet processing, bridging)

Industrial automation and motion control

Test and measurement equipment

Broadcast and video transport

Medical imaging and instrumentation

Storage, PCIe endpoints, and protocol bridging

Aerospace/defense prototypes and lab systems

Embedded computing acceleration and custom I/O expansion

Datasheet

Y-IC hosts the most authoritative, up-to-date datasheet for EP2AGX45CU17C5N on our product page. We recommend downloading the datasheet here to get full electrical, timing, configuration, and PCB design guidelines.

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