Intel 10AX032H3F34I2LG

Mfr. Part

10AX032H3F34I2LG

Manufacturer

Intel

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Detailed Description

Arria 10 GX family FPGA for high-performance, mid-density designs

320,000 logic elements (LEs); 119,900 LABs/CLBs

21,040,128 total RAM bits (embedded memory)

384 user I/O

Package/case: 1152-ball flip‑chip FBGA (FCBGA), 35 x 35 mm body

Supplier device package: 1152-FBGA, FC (35 x 35)

Voltage supply (core): 0.87 V to 0.93 V

Operating junction temperature: −40°C to +100°C (industrial grade)

Mounting type: Surface mount

Packaging: Tray

RoHS compliant

Key Features

Arria 10 GX architecture optimized for performance, power, and integration

Multi‑gigabit serial transceiver capability (GX class)

High I/O count and flexible I/O banking for many standards

Large embedded RAM for buffering, FIFOs, and on‑chip data processing

Rich DSP resources for signal processing, filtering, and acceleration

Robust clocking with multiple PLLs and clock networks

Supports mainstream high‑speed interfaces (for example PCIe and DDRx; see datasheet for versions and limits)

Industrial‑temperature operation for harsh environments

Low core voltage range for improved power efficiency

Supported by Intel Quartus Prime toolchain and broad IP ecosystem

Key Advantages

Strong balance of logic density (320k LEs), memory, and I/O in a single device

1152‑ball flip‑chip FBGA improves thermal performance and signal integrity

Industrial‑grade −40°C to +100°C junction temperature increases deployment range

Lower core voltage helps reduce total power and heat

Mature tools, IP, and reference designs speed time to market

Backed by Y-IC’s reliable sourcing, logistics, and technical support

Packaging

Tray

RoHS compliant

Key Features

Arria 10 GX architecture optimized for performance, power, and integration

Multi‑gigabit serial transceiver capability (GX class)

High I/O count and flexible I/O banking for many standards

Large embedded RAM for buffering, FIFOs, and on‑chip data processing

Rich DSP resources for signal processing, filtering, and acceleration

Robust clocking with multiple PLLs and clock networks

Supports mainstream high‑speed interfaces (for example PCIe and DDRx; see datasheet for versions and limits)

Industrial‑temperature operation for harsh environments

Low core voltage range for improved power efficiency

Supported by Intel Quartus Prime toolchain and broad IP ecosystem

Key Advantages

Strong balance of logic density (320k LEs), memory, and I/O in a single device

1152‑ball flip‑chip FBGA improves thermal performance and signal integrity

Industrial‑grade −40°C to +100°C junction temperature increases deployment range

Lower core voltage helps reduce total power and heat

Mature tools, IP, and reference designs speed time to market

Backed by Y-IC’s reliable sourcing, logistics, and technical support

Packaging

Type: FCBGA (flip‑chip fine‑pitch ball grid array), 1152 balls

Material: Organic substrate (BT resin) with lead‑free solder balls; RoHS compliant

Size: 35 mm x 35 mm body (nominal), low‑profile package height

Mounting: Surface mount; supplied in trays for automated assembly

Pin configuration: 384 user I/O plus dedicated power, ground, transceiver, configuration, and clock pins; organized in multiple I/O banks

Thermal characteristics: Junction temperature −40°C to +100°C; flip‑chip die attach aids heat spreading; use appropriate heatsink/airflow; consult datasheet for thermal impedance and power dissipation guidelines

Electrical properties: Core VCC 0.87–0.93 V; additional rails for transceivers, PLLs, and I/O banks per selected I/O standards; follow Intel decoupling and PDN recommendations

Notes: Refer to the official datasheet and pinout file for exact ball map, bank assignments, keep‑outs, and assembly guidance

Lifecycle

Status: Active production per latest public information. No near‑term discontinuation indicated. Lifecycle status can change; confirm with Y-IC sales for the latest supply outlook.

Equivalent or alternative models

- Same family, different densities: Arria 10 GX 10AX027, 10AX048, 10AX066, 10AX090 (select to match required logic, I/O, and transceivers)

- Same density variants: Other 10AX032 options may exist with different speed grades, packages, or temperature grades

- Step‑up performance: Intel Stratix 10 family (for higher performance and more resources)

- Lower power/cost option: Intel Cyclone 10 GX family (for cost‑sensitive designs with moderate transceiver needs)

Pin‑for‑pin or timing‑compatible substitutions depend on package (F34 1152‑FBGA), speed grade, and I/O bank needs. Contact Y-IC via our website for an exact cross, availability, and risk‑mitigation plan.

Key Application Areas

Communications and networking: Ethernet aggregation/switching, fronthaul/backhaul, protocol bridging

Data center and storage: PCIe bridging, NVMe/RAID acceleration, compression and encryption offload

Broadcast and video: IP/SDI video processing, image scaling, format conversion

Test and measurement: high‑speed data capture, protocol analysis, instrumentation

Industrial automation: machine vision, motion control, robotics, real‑time control

Medical and scientific: imaging pipelines, ultrasound, high‑throughput acquisition

Aerospace and defense: signal processing, secure communications, radar/sonar (subject to compliance)

Datasheet

Y-IC provides the most authoritative datasheet for 10AX032H3F34I2LG on this product page. Download it here to get the full specifications, electrical limits, pinout, thermal data, and design guidelines.

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