ISSI, Integrated Silicon Solution Inc IS25LP064D-JKLE

Mfr. Part

IS25LP064D-JKLE

Manufacturer

Integrated Silicon Solution, Inc. (ISSI). Y-IC is a quality distributor of ISSI and we will provide you with the best products and services, fast delivery, and reliable technical support.

Detailed Description

64Mbit (8MB) SLC NOR Flash for fast, reliable code and data storage. 3V class device with SPI, Quad I/O, and QPI interfaces plus Double Transfer Rate (DTR) for higher throughput. Automotive AEC-Q100 series, surface-mount 8-WSON (6x5) with exposed pad, -40°C to +105°C operating range. RoHS3 compliant. Typical max clock 166 MHz. Memory organized as 8M x 8 bits. Suitable as boot flash for MCUs/SoCs and high-reliability automotive applications.

Key Features

Capacity 64Mbit (8MB), organization 8M x 8

Interface SPI, Quad I/O (QSPI), QPI; supports DTR for higher effective data rate

Supply voltage 2.3V to 3.6V (3V class)

Max clock frequency up to 166 MHz

Operating temperature -40°C to +105°C (automotive range)

Package 8-WSON (6 x 5 mm), exposed thermal pad; also referenced as 8-WDFN EP

Technology NOR Flash, SLC for robust endurance and retention

Memory format FLASH with fast program/erase

Write performance fast; typical word/page program in the tens to hundreds of microseconds (check datasheet for precise values)

Erase granularity typically supports 4KB sectors and larger blocks (refer to datasheet)

Quad Enable and advanced command set for high-speed reads

Deep Power-Down and low standby current modes

Block protection, status registers, and security features common to automotive NOR

RoHS3 compliant, lead-free manufacturing

Mounting type Surface Mount, JEDEC-standard outlines

Key Advantages

High reliability SLC NOR for code execution-in-place (XiP) and stable boot behavior

Automotive AEC-Q100 series for better quality and extended temperature operation

High throughput with QPI and DTR for faster firmware reads and system boot

Wide supply range and robust timing over temperature for consistent performance

Small 6x5 mm WSON footprint saves PCB space and improves thermal performance

Simple, widely supported SPI/QSPI interface eases integration with many MCUs/MPUs

Long data retention and strong endurance compared to multi-level technologies

RoHS3 compliance supports environmentally responsible designs

Packaging

Type Bulk

Mechanical package 8-WSON (6 x 5 mm), also known as 8-WDFN with exposed pad

Materials Copper leadframe, epoxy molding compound, lead-free matte tin plating

Size Low-profile body approximately 6.0 mm x 5.0 mm; compact footprint suitable for dense layouts

Pin configuration Typical pins: CS#, SCLK, SI (IO0), SO (IO1), WP# (IO2), HOLD# (IO3), VCC, GND; center exposed pad for thermal conduction (often tied to ground—confirm in datasheet)

Thermal characteristics Exposed pad enhances heat spreading; solder to ground plane for best thermal performance. Rated operation -40°C to +105°C ambient.

Electrical properties 2.3V–3.6V supply, up to 166 MHz clock, supports SPI/Quad/QPI/DTR. RoHS3 compliant. Low-power standby and deep power-down modes. For detailed I/O levels, timing, and current consumption, see the datasheet.

Lifecycle

Status Active in ISSI’s automotive AEC-Q100 series and not indicated as nearing discontinuation based on current market data

Equivalent or alternative models (verify voltage, package, pinout, temperature grade, and command compatibility before substitution):

- ISSI IS25LP064D family variants (other package and temperature options)

- ISSI IS25WP064D (1.8V version if lower voltage is required)

- Winbond W25Q64JV or W25Q64NW (3V QSPI/QPI, various packages)

- Micron MT25QL64 or MT25QU64 (3V Quad SPI/QPI)

- Macronix MX25L6433F / MX25L6445E (3V Quad SPI)

- Infineon/Cypress S25FL064L / S25QL064 (3V Quad SPI)

- GigaDevice GD25Q64E / GD25Q64CW (3V Quad SPI)

- Adesto/Dialog AT25QL641 (3V Quad SPI)

Please check pin mapping, timing, sector sizes, and AEC-Q100 grade match for drop-in use. If you need a confirmed, pin-compatible drop-in or additional options, contact our sales team via the Y-IC website for expert guidance.

Key Application Areas

Automotive ECU boot flash, instrument clusters, infotainment, telematics, ADAS modules

Industrial control systems, PLCs, HMIs, robotics, smart factory equipment

IoT gateways and edge devices, smart meters, home automation controllers

Networking gear, routers, modems, and storage of firmware images

Consumer electronics, printers, set-top boxes, and digital signage

Medical and aerospace systems requiring reliable non-volatile code storage

Data logging, calibration tables, and over-the-air firmware update storage

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. For accurate specifications, timing, pin descriptions, and design guidelines, download the datasheet directly from this page on our website.

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