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| Part Number: | IRF7416PBF |
|---|---|
| Manufacturer/Brand: | Cypress Semiconductor (Infineon Technologies) |
| Part of Description: | MOSFET P-CH 30V 10A 8SO |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.8325 |
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| Product Attribute | Attribute Value |
|---|---|
| Vgs(th) (Max) @ Id | 1V @ 250µA |
| Vgs (Max) | ±20V |
| Technology | MOSFET (Metal Oxide) |
| Supplier Device Package | 8-SO |
| Series | HEXFET® |
| Rds On (Max) @ Id, Vgs | 20mOhm @ 5.6A, 10V |
| Power Dissipation (Max) | 2.5W (Ta) |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Package | Tube |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Input Capacitance (Ciss) (Max) @ Vds | 1700 pF @ 25 V |
| Gate Charge (Qg) (Max) @ Vgs | 92 nC @ 10 V |
| FET Type | P-Channel |
| FET Feature | - |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| Drain to Source Voltage (Vdss) | 30 V |
| Current - Continuous Drain (Id) @ 25°C | 10A (Ta) |




The IRF7416PBF from Infineon Technologies is a P-channel HEXFET® power MOSFET, specifically engineered for high-efficiency switching applications. Housed in an industry-standard SO-8 surface-mount package, this device is well-suited to modern compact, power-dense circuit designs requiring a robust combination of low on-resistance and fast switching. With a voltage rating of -30V and a continuous drain current of -10A at room temperature, the IRF7416PBF is a flexible solution for various demanding power management and load switching applications.
The IRF7416PBF leverages Infineon Technologies' Generation V HEXFET process, which significantly reduces on-resistance (as low as 20mΩ). This minimization of conduction losses is achieved without compromising speed—making this P-channel MOSFET ideal for designs where both efficiency and switching performance are critical. Other notable features include a rugged dynamic dv/dt rating, fast switching characteristics, and a surface-mount SO-8 package optimized with a customized leadframe, improving thermal performance. The device’s RoHS-compliant, lead-free construction further ensures suitability for environmentally conscious designs, and the tape-and-reel format simplifies automated assembly in high-volume production environments.
For the IRF7416PBF, robustness is a major consideration. The -30V maximum drain-to-source voltage allows for a safe operating margin in applications where voltage spikes can occur. With a continuous current capability of -10A at a device case temperature of 25°C, and a power dissipation of 2.5W (when mounted appropriately), the device supports substantial loads in space-constrained layouts. Engineers must carefully account for transient thermal impedance; the SO-8 package design allows power dissipation above 0.8W on standard FR-4 PCBs if properly heat-sunk and installed, making it essential to follow board layout guidelines for thermal management in high-current applications.
At a junction temperature of 25°C, the IRF7416PBF achieves a typical on-resistance of 0.020Ω, ensuring minimal voltage drop and conduction losses even at full rated current. Gate threshold voltage characteristics and input capacitance enable fast and efficient switching, while the device’s source-drain diode parameters provide added resilience under inductive load conditions. Dynamic figures, such as gate charge and switching times, are engineered for efficiency in synchronous rectification and DC-DC conversion, offering minimal delays and low gate drive power. For applications subject to high-frequency switching or repetitive pulsed loads, the IRF7416PBF’s dv/dt ruggedness and avalanche energy ratings provide additional confidence in robust operation.
The IRF7416PBF is supplied in a molded SO-8 package conforming to JEDEC standards (MS-012AA), with pin spacing and dimensions designed for compatibility with established surface-mount assembly lines. The customized leadframe inside the SO-8 package enhances heat dissipation, supporting the higher current ratings in a compact footprint. For engineers, this means that device placement, soldering methods (including vapor phase, IR, or wave soldering), and PCB layout are key to achieving optimal electrical and thermal performance. Mechanical drawings, dimensional tolerances, and tape-and-reel data are provided to facilitate ease of automated pick-and-place operations during manufacturing.
Thanks to its technical balance of low on-resistance, high current capability, and rugged design, the IRF7416PBF excels in applications such as load switching, battery protection circuits, DC-DC converters, and power management modules. In battery-operated portable devices, for instance, the device’s efficient switching and low losses contribute to extended battery life. In industrial or consumer power supplies, it can serve for reverse power path protection and high-side switching, minimizing heat generation and maximizing reliability. These scenarios highlight the importance of careful device selection and layout to exploit the IRF7416PBF’s advantages in both end-product efficiency and system robustness.
While the IRF7416PBF represents a class-leading solution, engineers may also consider devices with similar voltage, current, and packaging specifications as second sources or substitutes. Equivalent/replacement models are important for procurement risk management and long-term supply stability. When evaluating alternatives, compatibility in terms of gate threshold voltage, on-resistance, and SO-8 footprint should be ensured. Many leading semiconductor manufacturers offer P-channel MOSFETs with -30V ratings and similar or superior RDS(on) in SO-8 packages, making cross-component comparison a practical step during the design qualification stage.
The IRF7416PBF MOSFET by Infineon Technologies is a versatile P-channel device combining low on-resistance, high-speed switching, and robust power-handling in a compact SO-8 surface-mount package. For product selection engineers and procurement specialists, it offers tangible benefits for modern, high-efficiency power systems, backed by advanced HEXFET technology and practical integration features. When designing for compact power management, battery protection, or high-side switching, the IRF7416PBF provides the reliability and performance necessary to meet demanding engineering requirements. Additionally, considering equivalent models can ensure design resilience in a dynamic supply chain landscape.
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