Renesas Electronics America Inc 70V7519S133BFI8

Mfr. Part

70V7519S133BFI8

Manufacturer

Renesas Electronics Corporation

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Detailed Description

9 Mbit synchronous dual‑port SRAM for high-speed shared memory between two processors or buses. Organization 256K x 36. Parallel interface. 133 MHz operation with 4.2 ns access time. Single 3.3 V supply (3.15–3.45 V). Industrial temperature range −40°C to +85°C. Surface‑mount BGA package. RoHS non‑compliant variant.

Key Features

Memory size 9 Mbit, organized as 256K x 36

Dual‑port architecture for simultaneous, independent access by two systems

Synchronous operation up to 133 MHz for high throughput

Fast access time 4.2 ns for low latency

Parallel interface for simple bus connection

Single 3.3 V supply (3.15–3.45 V typical range)

Industrial temperature −40°C to +85°C (TA)

Surface‑mount BGA package options

Volatile SRAM technology

Base product family 70V7519 for multiple speed and package variants

Key Advantages

Enables fast, conflict‑free data sharing between CPUs, DSPs, FPGAs, or controllers

Built for real‑time systems that need deterministic, low‑latency memory

Synchronous design simplifies timing and boosts sustained bandwidth

Industrial temperature rating improves reliability in harsh environments

BGA package saves PCB space and improves signal integrity at high speed

Parallel interface reduces design complexity and development time

Packaging

Type: 208‑ball BGA

Mechanical options: 208‑CABGA (15 x 15 mm) and 208‑LFBGA; this exact MPN is 208‑CABGA (15 x 15)

Mounting: Surface mount

Ball count and configuration: 208 balls with dedicated address/data/control for each port, plus power/ground distribution

Shipping: Tape & Reel (TR) for automated assembly

Material: Molded plastic BGA with solder balls

Thermal characteristics: BGA format aids heat spreading; rated for −40°C to +85°C ambient

Electrical properties: 3.3 V CMOS/LVTTL compatible I/O, supply 3.15–3.45 V, 133 MHz clock

RoHS status: RoHS non‑compliant (leaded balls); consider RoHS‑compliant “PF” variants if needed

Lifecycle

Status: Mature, widely used in communications and embedded systems. Select suffixes/packages may be approaching end of life depending on region and compliance needs.

Equivalent or alternative models (same base family):

- 70V7519S133BFI8 (current model, non‑RoHS, industrial, 208‑CABGA)

- 70V7519S133PFI8 (RoHS‑compliant, industrial, 208‑LFBGA)

- 70V7519S133BF (non‑RoHS, commercial temp, 208‑CABGA)

- 70V7519S133PF (RoHS‑compliant, commercial temp, 208‑LFBGA)

- 70V7519S100BF / 70V7519S100PF (100 MHz speed grade variants in BGA packages)

If you need a drop‑in or cross‑reference beyond the 70V7519 family or confirmation of lifecycle status, visit our website and contact Y-IC sales for the latest guidance and vetted alternatives.

Key Application Areas

Inter‑processor communication buffers in networking equipment (switches, routers)

Telecom and wireless infrastructure (base stations, backhaul, packet processing)

Storage and RAID controllers (shared queue and mailbox memory)

Industrial control systems and motion control (CPU/DSP shared data)

Video, imaging, and broadcast systems (frame buffers and shared FIFOs)

Aerospace and defense embedded systems requiring deterministic shared memory

FPGA‑to‑CPU bridges and coprocessor interfaces

Datasheet

Y-IC hosts the most authoritative and up‑to‑date datasheet for this product. Download the datasheet directly from this page to ensure you have the correct, complete specifications and design guidelines.

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