HP 3AA1-1106

Mfr. Part

3AA1-1106

Manufacturer

HP (Hewlett‑Packard)

Y-IC is a quality distributor for HP. We deliver original parts, strict quality control, fast logistics, and responsive support to help you get the best products and services.

Detailed Description

Integrated Circuits (ICs) – Specialized ICs

HP OEM specialized IC identified by MPN 3AA1-1106

Package/Case code: 869 (manufacturer code; confirm exact mechanical outline in datasheet)

Data/Date Code: 00+ (mixed/later lot code; ask us if you need a specific date code)

Available quantity in stock: 1244 units

Typical use: direct replacement in assemblies that specify 3AA1-1106; suitable for MRO, repair, and OEM builds that require this exact HP part

Note: This HP MPN is application‑specific. Exact function, pinout, and ratings must be confirmed in the datasheet on this page.

Key Features

Genuine HP OEM part number traceability (3AA1-1106)

Specialized IC class for targeted system functions

Package/Case 869 for footprint-matched replacement

ESD-sensitive device; handle with industry-standard precautions

Stock ready for quick shipment; lot/date code support on request

RoHS/lead status available on request (verify against specific lots)

Key Advantages

Drop‑in match for assemblies calling for 3AA1-1106 (no re‑design)

Stable supply from Y-IC with professional sourcing and QC screening

Reduced downtime for repairs and service due to ready-to-ship stock

Technical support to verify pinout, package, and handling before purchase

Flexible shipping and packing options to protect sensitive devices

Packaging

Shipment format: tape & reel, tray, or tube (chosen to protect the device and match order size; default is ESD-safe tray/tube for ICs)

Protective materials: antistatic EPE foam, moisture barrier bag, desiccant, humidity indicator, and shock-resistant outer carton

Package/Case: 869 (manufacturer mechanical code; confirm body size, height, and land pattern in the datasheet)

Body material (typical): molded epoxy encapsulation

Lead/terminal material (typical): copper alloy with Sn or Pb-free plating (verify per lot if RoHS is required)

Pin configuration: defined by HP for the 869 package; refer to datasheet for pin count, pitch, and orientation

Thermal characteristics: junction-to-ambient/board thermal metrics are package‑dependent; see datasheet for θJA, θJC and recommended thermal design

Electrical properties: supply range, I/O levels, timing, and protection features are device‑specific; confirm in datasheet before design-in

MSL (moisture sensitivity): provided per lot; we can supply labels and baking guidance on request

Lifecycle

Current lifecycle status: not publicly listed; no official EOL notice found

Because 3AA1-1106 is an HP-specific MPN, availability can vary by lot and region

Equivalent/alternative models: no publicly documented pin‑to‑pin or form‑fit‑function equivalents are available

Recommendation: if you need cross‑references or second sources, contact our Y-IC sales team via our website. We will check HP archives, approved substitutes, or compatible revisions for your exact assembly P/N and PCB revision.

Key Application Areas

Direct replacement in HP equipment and assemblies that specify 3AA1-1106

Service, repair, and refurbishment of HP systems where this IC is required

OEM/EMS builds, spares stocking, and lifecycle maintenance for legacy HP platforms

Engineering validation when maintaining compatibility with existing HP designs

Datasheet

The most authoritative datasheet for 3AA1-1106 is available on our website. Download it on this page to verify pinout, package 869 dimensions, electrical ratings, thermal limits, and handling guidelines.

Request for Quotation Now

Get a Quote on our website for 3AA1-1106. Fast pricing, real-time stock, and professional support.

Learn More by contacting our sales team for cross-checks, date code options, and packing preferences.

Limited Time Offer: secure your 1244 in-stock units today to avoid lead-time extensions.