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| Part Number: | MWCT1015SFVMH |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | WCT1015 100BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $20.9296 |
| 200+ | $8.0994 |
| 500+ | $7.815 |
| 1000+ | $7.6743 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 2.7V ~ 5.5V |
| Supplier Device Package | 100-MAPBGA (11x11) |
| Series | - |
| Package / Case | 100-LFBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Current - Supply | - |
| Base Product Number | MWCT1015 |
| Applications | Automotive, Wireless Power Transmitter |




NXP’s MWCT1015SFVMH is a highly integrated wireless power transmitter power management IC (PMIC), targeting advanced wireless charging applications. As part of the MWCT101xS family, the MWCT1015SFVMH stands out for its versatile processing core, comprehensive set of peripherals, and support for industry-grade safety and security. Housed in a compact 100-MAPBGA package (11 x 11 mm), this device offers engineers the flexibility to implement sophisticated wireless charging solutions in a streamlined PCB footprint, making it suitable for automotive, industrial, and consumer electronics designs that demand robust performance and high integration.
MWCT1015SFVMH’s features bring forth architectural flexibility and power optimization. At its core is an Arm Cortex-M4F processor operating up to 112 MHz in High-Speed Run (HSRUN) mode, offering 1.25 DMIPS/MHz performance. With up to 2 MB of program flash, 64 KB FlexNVM supporting EEPROM emulation, and up to 256 KB SRAM—all featuring Error-Correcting Code (ECC)—the device provides ample headroom for complex application firmware, real-time processing, and critical power management routines.
For mixed-signal needs, the PMIC integrates up to two 12-bit ADCs (supporting up to 32 analog inputs each) and an analog comparator with an 8-bit DAC for system-level feedback and monitoring. The integrated digital signal processor (DSP) and floating point unit (FPU) accelerate math-intensive algorithms such as power control loops.
Power management is central to MWCT1015SFVMH. The chip supports multiple power operating modes—HSRUN, RUN, STOP, VLPR, VLPS—and features a Power Management Controller (PMC) for fine-grained energy control. Notably, certain functions like cryptographic services (CSEc) and EEPROM access require operation at standard RUN mode due to voltage/frequency constraints.
Available in several package options (including 100-MAPBGA), the MWCT1015SFVMH delivers exceptional integration density. The package is well-suited for applications sensitive to board space and offers up to 89 GPIOs supporting interrupts and flexible signal multiplexing. As part of the MWCT101xS series, it maintains pin-to-pin compatibility among variants sharing the same package, enabling straightforward upgrades or platform scaling.
The device features well-defined guidelines for power and ground connections, with important requirements for decoupling capacitor placement and types (favoring ceramic X7R types for lowest ESR). Special attention is needed for RF and analog supply design to maintain ADC performance. Comprehensive pinout and signal descriptions assist engineers in optimizing PCB layout and ensuring reliable operation.
MWCT1015SFVMH is designed for a broad range of operating conditions—2.7 V to 5.5 V supply voltage and -40°C to 125°C ambient, depending on power mode. HSRUN mode enables high compute operation up to 112 MHz but is bounded by a 105°C ambient limit, while RUN mode extends operation to 125°C. The platform features several voltage monitoring and protection circuits—including Low Voltage Reset (LVR), Low Voltage Detect (LVD), and Power-on Reset (POR)—to safeguard operation.
Power consumption is tuned for energy-sensitive designs, with different modes balancing standby and active current draw. The device supports clock gating to reduce peripheral power and offers flexible clocking through external crystals, fast and slow internal RC oscillators, and a system PLL for jitter-sensitive timing needs.
The MWCT1015SFVMH includes an extensive suite of peripherals addressing wireless power, system control, and communication gateways. It supports:
Three Low Power UART/LIN modules with DMA support—ideal for automotive and industrial networks.
Three LPSPI (Low Power Serial Peripheral Interface) modules and two LPI2C interfaces, supporting external sensor or PMIC integration.
Up to three FlexCAN modules (with CAN-FD support), ensuring compliance with in-vehicle networking standards.
A FlexIO module capable of emulating additional protocols (UART, I2C, SPI, I2S, LIN, PWM) for application-specific expansion.
For timing-critical applications, up to eight 16-bit FlexTimer modules and four-channel 32-bit interrupt timers allow advanced scheduling, pulse-width modulation (PWM), and event capture required for power system management.
Meeting the analog needs of wireless power transmitters, MWCT1015SFVMH integrates dual 12-bit ADCs suitable for feedback in closed-loop power regulation, current sensing, and system health monitoring. The device also includes an analog comparator with an integrated 8-bit DAC, enabling threshold-based detection or safety cut-off features common in power management designs.
The ADCs offer robust input structures, but designers are advised to consider PCB layout and reference quality—especially with high-frequency interfaces nearby, as these can affect analog accuracy. Detailed recommendations are provided for external filtering, input impedance, and sequence timing to optimize mixed-signal performance.
NXP’s MWCT1015SFVMH supports advanced hardware security through a built-in Cryptographic Services Engine (CSEc), implementing Secure Hardware Extension (SHE) standards with 128-bit device unique identifier and comprehensive ECC protection on all memory elements. The device further supports system-level safety with a System Memory Protection Unit (MPU), cyclic redundancy check (CRC) modules, watchdog timers, and error flagging strategies to assist with failsafe and ISO 26262-compliant design.
For development and validation, standard debug interfaces (JTAG, SWD, on-chip trace and breakpoint units) and robust instrumentation resources (including trace macrocell and real-time watchpoints) accelerate bring-up and troubleshooting in both laboratory and field scenarios.
Effective thermal management is essential for high-density PMICs like the MWCT1015SFVMH. Detailed thermal resistance, dissipation, and case/junction temperature data are provided for all package variants. The device’s thermal environment is influenced by board design (layer count, copper planes), airflow, and assembly choices. For applications approaching the upper limits of power density or requiring HSRUN mode operation, engineers should reference NXP’s guidelines for heat sink integration, board layout, and in-situ temperature monitoring to avoid derating and ensure project reliability.
When considering platform changes or multi-vendor procurement strategies, engineers should examine the MWCT101xS series from NXP for alternatives. Devices differing by memory size, peripheral set, or package (e.g., MWCT1016S, MWCT1013S) may offer drop-in compatibility due to shared pinouts among common packages. However, differences in security engine availability, I/O count, and CAN-FD support must be matched to application requirements using NXP’s feature comparison tools and reference manuals.
The NXP MWCT1015SFVMH delivers an advanced combination of processing power, power management, analog integration, and robust safety/security for wireless power transmitter applications. Its comprehensive technical feature set, extensive documentation, and attention to package-level detail make it a reliable choice for engineers driving next-generation wireless charging and power control systems. By aligning MWCT1015SFVMH’s characteristics with project-specific requirements and considering the potential for pin-compatible upgrades, product selection engineers and procurement teams can make informed, future-proof design decisions in competitive electronics markets.
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