NXP USA Inc. LPC2132FBD64,151

Mfr. Part

LPC2132FBD64,151

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

16/32-bit ARM7 microcontroller with 64KB Flash and 16KB SRAM in a 64-LQFP (10x10 mm) package. Runs up to 60 MHz. Operates from 3.0V to 3.6V at -40°C to +85°C. Includes 47 GPIOs, 8-channel 10-bit ADC, 1-channel 10-bit DAC, PWM, watchdog, brown-out detect/reset, POR, and internal oscillator. Connectivity includes I2C, SPI/SSP (Microwire/SSI compatible), and UART/USART. RoHS3 compliant. Surface-mount, tray packaging. Series: LPC2100. Base product number: LPC2132. Available quantity: 2549.

Key Features

ARM7 core (ARM7TDMI-S), 16/32-bit, up to 60 MHz

64KB embedded Flash (64K x 8), 16KB SRAM (16K x 8)

47 programmable I/O pins

8-channel 10-bit ADC, 1-channel 10-bit DAC

Interfaces: I2C, SPI/SSP (Microwire/SSI compatible), UART/USART

Peripherals: PWM, watchdog timer (WDT), brown-out detect/reset, power-on reset (POR)

Internal oscillator and clock management

Supply voltage: 3.0V to 3.6V (typical 3.3V systems)

Operating temperature: -40°C to +85°C (TA)

64-LQFP device package (10x10 mm), surface mount

RoHS3 compliant

Key Advantages

Simple, proven ARM7 architecture for stable, long-life designs

Balanced performance at 60 MHz for control, interface, and data acquisition tasks

Integrated ADC and DAC reduce external component count

Rich serial connectivity for easy system integration (I2C, SPI/SSP, UART/USART)

Mature ecosystem and broad community resources

Wide industrial temperature range for reliable field operation

3.3V supply simplifies power design

Compact 64-LQFP footprint fits space-constrained boards

Ideal for maintaining and upgrading legacy ARM7 designs

Packaging

Type: 64-LQFP, supplier device package 64-LQFP (10x10 mm)

Material: Plastic epoxy molded LQFP, lead-free finish (RoHS3)

Size: Body 10 x 10 mm, typical lead pitch ~0.5 mm, 64 leads (approximately 16 per side)

Pin configuration: 64 perimeter leads with corner orientation mark; 47 available GPIOs; dedicated pins for power, ground, clock, and interfaces

Thermal characteristics: Typical LQFP-64 values RθJA ~65–90°C/W, RθJC ~20°C/W (refer to the official datasheet for exact values)

Electrical properties: 3.0V–3.6V supply, standard 3.3V I/O levels, internal oscillator; ESD, MSL, and exact lead finish specs should be verified in the datasheet

Mounting: Surface mount (SMT); moisture sensitivity typically aligns with LQFP standards (verify MSL on datasheet)

Shipping form: Tray

Lifecycle

Status: LPC2100 ARM7 series is a mature platform. Some variants have moved to Not Recommended for New Designs (NRND) or are approaching end of life depending on date codes and regional availability. Please confirm current lifecycle and stock status with Y-IC sales.

Pin-compatible or close family alternatives (same series and package options; confirm exact pinout and memory/peripheral differences):

- LPC2131FBD64 (lower Flash)

- LPC2134FBD64 (larger Flash)

- LPC2136FBD64 (larger Flash)

- LPC2138FBD64 (largest Flash in series)

Functional modern alternatives (not pin-compatible; newer cores):

- NXP LPC11xx (ARM Cortex-M0, low power, similar 3.3V)

- NXP LPC17xx (ARM Cortex-M3, higher performance)

- NXP LPC23xx/24xx (ARM7 with expanded peripherals; check packages)

If you need a drop-in equivalent or verified cross, contact our sales team via Y-IC.com for the most up-to-date alternatives, lifecycle guidance, and migration support.

Key Application Areas

Industrial control, machine interfaces, motor control

Instrumentation and data acquisition (ADC/DAC use)

Communication interface bridges and gateways (I2C, SPI/SSP, UART/USART)

Building automation and HVAC controllers

Consumer and appliance control modules

Medical devices and lab equipment (non-critical control)

Legacy ARM7 design maintenance and cost-optimized upgrades

Datasheet

Y-IC provides the most authoritative datasheet for LPC2132FBD64,151 on our product page. We recommend downloading the datasheet here to get full electrical, timing, pinout, and mechanical details.

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