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| Part Number: | LPC1768FBD100K |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC MCU 32BIT 512KB FLASH 100LQFP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $7.4519 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | 2.4V ~ 3.6V |
| Supplier Device Package | 100-LQFP (14x14) |
| Speed | 100MHz |
| Series | LPC17xx |
| RAM Size | 64K x 8 |
| Program Memory Type | FLASH |
| Program Memory Size | 512KB (512K x 8) |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT |
| Package / Case | 100-LQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Number of I/O | 70 |
| Mounting Type | Surface Mount |
| EEPROM Size | - |
| Data Converters | A/D 8x12b; D/A 1x10b |
| Core Size | 32-Bit Single-Core |
| Core Processor | ARM® Cortex®-M3 |
| Connectivity | CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG |
| Base Product Number | LPC1768 |




The LPC1768FBD100K, manufactured by NXP Semiconductors, is a highly integrated 32-bit ARM Cortex-M3 based microcontroller designed for demanding embedded applications. As part of the LPC17xx series, the LPC1768FBD100K operates at up to 100MHz and offers a feature-rich blend of connectivity, memory, and real-time control in a low-power, compact package. Engineers evaluating microcontrollers for high-performance industrial, networking, or complex control systems will find the LPC1768FBD100K a compelling choice, primarily due to its advanced CPU, robust peripheral offerings, and extensive interfaces. This article provides a technical dive into its core capabilities and functional advantages.
At the heart of the LPC1768FBD100K is the ARM Cortex-M3 processor, a next-generation 32-bit core recognized for performance efficiency and modern debug support. Featuring a 3-stage pipeline Harvard architecture, it ensures separate instruction and data paths, enhancing throughput and low-latency response—crucial for real-time applications.
Key architectural elements include:
Operation Frequencies: Up to 100MHz CPU clock speed.
Nested Vectored Interrupt Controller (NVIC): Enables highly responsive and prioritized interrupt management.
Memory Protection Unit (MPU): Supports up to eight regions, facilitating robust embedded security and process separation.
Speculative Branching Support: Internal prefetch unit improves execution speed, particularly in complex control loops.
Multilayer Advanced High-performance Bus (AHB) Matrix: Ensures direct, contention-free access for each system bus master (CPU, DMA, Ethernet, USB), minimizing latency across high-bandwidth operations.
This core design makes the LPC1768FBD100K well-suited for precision industrial control, fast communication, and complex algorithm execution.
Memory architecture is central to embedded system flexibility. The LPC1768FBD100K offers:
Flash Memory: 512KB on-chip flash with an enhanced flash accelerator for zero wait-state operation up to the CPU’s full speed. This supports rapid code execution and substantial application size.
SRAM: 64KB distributed as follows:
- 32KB for main CPU access (low-latency code/data).
- Two additional 16KB SRAM blocks accessible via separate paths, ideal for peripherals like Ethernet, USB, and DMA, keeping throughput high while isolating time-critical processes.
Embedded Bootloader: Supports In-System Programming (ISP) and In-Application Programming (IAP).
EEPROM: Not present, but flash can be used for non-volatile data storage with software management.
This memory structure is optimized for applications requiring frequent data buffering, multichannel communications, and robust bootloader or field-update functionality.
The LPC1768FBD100K is engineered for system integration, with a suite of advanced interfaces and peripherals:
USB 2.0 Host/Device/OTG: Integrated PHY and DMA support, allowing rapid access to USB mass storage, peripherals, or direct host connection for firmware updates or communication.
Ethernet MAC: RMII interface and dedicated DMA, supporting high-throughput networked applications.
CANbus: Dual CAN 2.0B controllers for robust real-time field bus integration.
UARTs: Four UARTs (with FIFO, fractional baud rate, and DMA):
- One UART with RS-485/EIA-485 and modem control support.
- One UART with integrated IrDA hardware for wireless communication.
SSP/SPI: Two Synchronous Serial Port controllers (SSP) plus a dedicated SPI, enabling high-speed synchronous interfacing with external ADCs, DACs, sensors, or display modules.
I2C: Three interfaces, including one with Fast-mode Plus (1 Mbit/s) support, address decoding, and monitor mode.
I2S: Digital audio interface with DMA and fractional rate control, suitable for voice or industrial audio processing.
With up to 70 GPIOs (all supporting pull-up/down resistors and open-drain configuration), engineers can directly interface with varied digital control and sensing devices, increasing board-level integration.
Key analog and timing blocks include:
8-channel, 12-bit ADC: Provides fast (up to 200kHz) analog signal acquisition for sensor interfaces or process control.
10-bit DAC: Steers precise analog output for audio or signal generation.
Motor Control PWM: Managed three-phase PWM suitable for industrial motor drivers or complex PWM-based control.
Quadrature Encoder Interface: Supports motion and position sensing critical for robotics or industrial drives.
General-Purpose Timers: Four 32-bit timers with eight capture inputs and ten compare outputs. Integrated features allow generation of DMA requests on timer events, achieving complex timing patterns with minimal CPU load.
Real Time Clock (RTC): Operates from a dedicated power domain with battery backup, ensuring timekeeping through power cycles.
This enables highly integrated mixed-signal applications, precision motor and actuator control, and robust time-related task scheduling.
Energy efficiency is critical for both portable devices and always-on industrial nodes. The LPC1768FBD100K incorporates:
Four Power Modes: Sleep, Deep-sleep, Power-down, and Deep power-down, with the Power Management Unit (PMU) optimizing regulator settings on the fly.
Wake-up Interrupt Controller (WIC): Wakes the CPU from deep sleep or power-down on any enabled interrupt, including external signals, RTC, USB, Ethernet, or CAN.
On-chip Brown-out Detect and Power-on Reset: Ensures stable operation during voltage fluctuations or system resets.
Flexible Clocking: Main oscillator (1–25MHz), 4MHz on-chip RC (1% accuracy), and phase-locked loops (PLL) for flexible and precise clocking, adapting to power or performance requirements.
These hardware features, combined with the implementation flexibility in firmware, help designers meet stringent energy goals in battery-powered or power-sensitive systems.
The LPC1768FBD100K is housed in a 100-lead Low Profile Quad Flat Package (LQFP, 14mm × 14mm), optimized for space-constrained PCBs and high-density designs. Other related LPC17xx variants are also available in TFBGA100 and WLCSP100 packages for further miniaturization.
Pinout highlights:
100-pin LQFP: Up to 70 GPIOs, with carefully grouped analog, digital, and power domains.
Dedicated pins for all major interfaces (Ethernet, USB, CAN, UART, I2C, SSP, SPI, I2S).
Clear signal separation minimizes crosstalk, and the package ensures reliable soldering for automated manufacturing.
Moisture Sensitivity is rated at MSL 3 (168 hours), suitable for standard SMT assembly flows. Full RoHS3 and REACH compliance is maintained, aligning with global environmental requirements.
When selecting a microcontroller, it is prudent to review the full LPC17xx family:
LPC1769FBD100: Upgraded variant—operates up to 120MHz with otherwise identical features for designs needing more raw processing.
LPC1767FBD100/1766FBD100: Feature 512KB and 256KB flash respectively but limited or no USB/Ethernet/CAN support, suitable for simpler, cost-sensitive designs.
LPC1765FBD100/1764FBD100: Reduced flash and SRAM, and limited peripheral selections, further optimizing cost and power.
Pin-Compatible Replacement: These variants, as well as legacy LPC236x (ARM7), allow pin-compatible hardware upgrades or replacements, simplifying long-term platform evolution and supply chain resiliency.
The versatility of the LPC1768FBD100K makes it highly suitable for:
Industrial Networking: Native Ethernet and CAN support enable use in distributed control, factory automation, and industrial IoT edge nodes.
Motor Control: Integrated PWM, quadrature encoder interface, and high-resolution ADC/DAC make it ideal for precision drive systems, robotics, and white goods.
Smart Metering and Alarm Systems: Low-power modes, RTC with battery backup, and multiple communication interfaces support secure, robust, long-life field deployments.
Advanced Consumer and Lighting Controls: Flexible serial, analog, and digital IO promote rapid innovation in connected lighting, home, and building automation.
: Evaluating LPC1768FBD100K for Modern Embedded Solutions
The LPC1768FBD100K ARM Cortex-M3 microcontroller stands out in the embedded landscape due to its balanced blend of high-performance processing, advanced memory organization, rich connectivity, and real-time analog/digital control. Its scalable LPC17xx family, flexible packaging, and robust environmental compliance provide engineers and procurement teams with a future-proof platform for complex embedded designs. Thorough analysis of the feature set against application requirements ensures the LPC1768FBD100K will serve as a cornerstone component in state-of-the-art industrial, consumer, and networked embedded systems.
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