Broadcom Limited HLMP-4700

Product summary Broadcom HLMP-4700 Red Diffused T-1 3/4 LED Lamp

The Broadcom HLMP-4700 is a red diffused through-hole LED indicator, fabricated for reliable operation and consistent performance at low DC currents. This device features a T-1 3/4 (5 mm diameter) package and delivers a dominant wavelength of 626 nm, optimized for visible red indication. Luminous intensity and forward voltage data are specified and tested at a low drive current (2 mA), making HLMP-4700 particularly suitable for direct interface with logic circuitry such as TTL and CMOS outputs. Design engineers and procurement specialists will find this device ideal for signaling and status indication in circuits prioritizing low power consumption.

Main attributes and technological aspects of the HLMP-4700 series

The HLMP-4700 leverages AlInGaP LED technology for high efficiency, low forward voltage, and low thermal generation — all critical factors in modern electronic designs. Its key features include compatibility with TTL and CMOS logic levels, ensuring seamless integration in various digital environments. A wide viewing angle enables effective visual indication across diverse applications. The series provides options in both package style and color, but the HLMP-4700 specifically focuses on red diffused output for maximum contrast and visibility in indicator roles. The low-current operation (tested at 2 mA) allows substantial power savings without sacrificing brightness uniformity.

Use cases for HLMP-4700 LED lamps

The HLMP-4700 LED finds its niche in low-power DC circuits and is an excellent choice for telecommunications equipment, portable devices, and keyboards requiring reliable indication with minimal power draw. Given its efficiency and compatibility with standard logic drivers, its use extends to battery-powered equipment where energy conservation is paramount. Engineers can deploy this LED in multi-indicator panels, signal transmit/receive displays, and embedded control systems where visibility and long-term stability are valued.

Physical dimensions and mechanical specifications of HLMP-4700

Mechanical considerations are addressed with the HLMP-4700’s standard T-1 3/4 (5 mm) radial package, featuring leads designed for secure through-hole mounting. The package’s geometry is aligned so the optical axis matches the mechanical axis, simplifying assembly and ensuring consistent light projection. Application notes specify that an epoxy meniscus may extend modestly down the leads (approx. 1 mm). These mechanical attributes facilitate straightforward integration into indicator arrays and allow predictable performance in automated and manual PCB assembly.

Electrical and optical performance characteristics of HLMP-4700

At a typical test condition of 2 mA forward current and room temperature (25°C), the HLMP-4700 offers predictable luminous intensity direct on its mechanical axis. The dominant wavelength is accurately defined using the CIE chromaticity diagram, guaranteeing color consistency between production lots. Engineers can estimate radiant intensity via the provided formula, enabling precise calculations of emitted optical power for their system requirements. The broad viewing angle and stable forward voltage further support flexible implementation in demanding environments.

Sorting, binning, and color management for HLMP-4700

To ensure uniformity in specification-critical applications, the HLMP-4700 incorporates binning for luminous intensity and color wavelength. Each intensity bin is defined with a maximum tolerance of ±18%, and color bins are controlled to within ±0.5 nm. This tight control is essential in matrixed displays or multi-device panels, where perceptual consistency is vital. Binning systems are set up to simplify procurement and guarantee that devices sourced for a single project maintain visual harmony.

Heat dissipation and soldering recommendations for HLMP-4700

Thermal and process guidelines are pivotal when integrating the HLMP-4700 on production PCBs. Lead forming is recommended before insertion and soldering to minimize mechanical stress; hand cutting should only be performed post-soldering to protect the LED internals. Manual soldering must maintain a minimum distance of 1.59 mm from the LED body, and bottom preheaters should be used to limit thermal stress. Daily monitoring of wave soldering profiles is advised to ensure solder temperature doesn’t exceed 250°C or dwell beyond 3 seconds, safeguarding the LED from delamination and premature failure. Alignment fixtures should be non-metallic and loosely fitted to reduce mechanical load during soldering and cooling.

PCB design and handling best practices for HLMP-4700

Careful attention to plated through-hole dimensions is necessary for proper mounting; oversized holes can cause device twisting during clinching, while undersized holes complicate assembly. ESD precautions are mandatory during handling and assembly owing to the HLMP-4700’s sensitivity. For assemblies combining through-hole and surface-mount components, reflow soldering of SMT components should precede TH LED insertion to avoid excessive heat exposure to the HLMP-4700.

Alternative or substitute models for HLMP-4700

For projects requiring compatibility or alternate sourcing, Broadcom’s HLMP-4719 and HLMP-4740 offer similar low-current operation and package formats. For alternate sizes, HLMP-1700, HLMP-1719, and HLMP-1790 represent the T-1 (3 mm) options within the same series, sharing core technology and process characteristics. Engineers can interchange devices within this family based on application-specific requirements for package size, indicator color, or optical output specifications, provided their system matches the voltage and current parameters outlined for each model.

Conclusion

The HLMP-4700 red diffused LED stands out for its reliable performance in low-current, logic-compatible signaling applications. Its high efficiency, robust binning, and careful packaging design make it a trusted choice for engineers and procurement professionals seeking stable indicator solutions in demanding environments. Following recommended soldering and handling precautions ensures optimal device longevity and system reliability. For projects requiring alternative sizes or colors, Broadcom’s HLMP-4700 series offers a scalable portfolio to meet diverse engineering needs.