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| Part Number: | XC2VP4-6FFG672C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 348 I/O 672FCBGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 516096 |
| Supplier Device Package | 672-FCBGA (27x27) |
| Series | Virtex®-II Pro |
| Package / Case | 672-BBGA, FCBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 6768 |
| Number of LABs/CLBs | 752 |
| Number of I/O | 348 |
| Mounting Type | Surface Mount |
| Base Product Number | XC2VP4 |




XC2VP4-6FFG672C
AMD Xilinx — Y-IC is a quality distributor for AMD Xilinx. We deliver genuine parts, fast service, and professional support to ensure you get the best products and the best experience.
Virtex-II Pro family FPGA, mid-density device with 6768 logic cells, 752 CLBs, and 348 user I/Os. Housed in a 672-ball flip‑chip BGA (27 x 27 mm), commercial grade (C), speed grade -6. RoHS3 compliant. Supply voltage 1.425 V to 1.575 V (typ. 1.5 V core). Surface-mount device supplied in trays. Category: Integrated Circuits (ICs). Subcategory: Embedded – FPGAs (Field Programmable Gate Array). Base product number: XC2VP4. Series: Virtex‑II Pro. Available stock: 2570 units (subject to prior sale).
6768 logic elements/cells, 752 configurable logic blocks (CLBs)
348 user I/Os for broad interfacing options
Total on‑chip RAM: 516,096 bits (block/distributed RAM mix per family)
672-ball flip‑chip BGA package, 27 x 27 mm body size
Commercial operating range: 0°C to +85°C (junction)
Core supply range: 1.425 V to 1.575 V (nominal 1.5 V)
Robust clock management (family DCM resources for clock synthesis/deskew)
Standard FPGA configuration methods (e.g., JTAG, serial, SelectMAP; see datasheet for modes)
Supports common single‑ended and differential I/O standards typical for the family (see datasheet for bank voltages and standards)
RoHS3 compliant
Mature, proven platform for legacy and long‑lived designs
High I/O count simplifies wide parallel interfaces and bridging tasks
Stable supply options via Y-IC with professional sourcing and support
Tray packaging suitable for volume SMT assembly
Wide toolchain and community knowledge base (Vivado/ISE notes per device support)
Type: FCBGA (flip‑chip ball grid array), fine‑pitch
Body size: 27 mm x 27 mm (square)
Ball count: 672 balls; I/O distributed across multiple banks (refer to pinout for exact map)
Materials: Organic substrate with lead‑free solder balls (RoHS3)
Delivery form: Tray (MSL per JEDEC labeling; follow dry‑pack handling)
Mounting: Surface mount; compatible with Pb‑free reflow profiles
Thermal characteristics: Junction operating 0°C to +85°C; actual θJA/θJC depend on board, airflow, and heatsinking. Use thermal simulation and the datasheet’s guidance for power dissipation and cooling.
Electrical properties:
- Core voltage (VCCINT): 1.425 V to 1.575 V
- I/O bank supplies (VCCO): depend on selected I/O standards; see datasheet for supported levels and limits
- Configuration voltages and current draw vary by mode; see datasheet
Status: Mature/Obsolete class device. Generally not recommended for new designs.
For drop‑in or near equivalents within the same family and package (verify pin compatibility and timing in the datasheet before use):
- XC2VP4-6FFG672I (industrial temperature variant)
- XC2VP4-5FFG672C (different speed grade)
For functional alternatives (not pin‑compatible; redesign required), consider newer families:
- Artix‑7 or Kintex‑7 (lower power, higher performance per LUT)
- Virtex‑4 FX/ Virtex‑5/ Virtex‑6 (migration paths with richer features)
If you need a validated cross or confirmed lifecycle status for your exact build, please contact our sales team via the Y-IC website. We will help identify equivalent or alternative models and availability.
Communications infrastructure and protocol bridging
Industrial control and automation, motion control, PLC expansion
Test and measurement equipment, data acquisition
Embedded control and custom hardware accelerators
Video/vision pre‑processing and interface adaptation
Medical electronics (non‑life‑support), scientific instruments
Aerospace/defense (commercial grade; evaluate derating and screening)
Y-IC hosts the most authoritative, up‑to‑date datasheet for XC2VP4-6FFG672C on our product page. We recommend downloading it here to get the full pinout, electrical limits, configuration modes, timing, and thermal guidelines.
In stock and ready to quote. Get a Quote on our website now — Limited Time Offer. Need help choosing an alternative or confirming lifecycle? Learn More on the product page or contact our sales team for fast support.
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