AMD XC2VP4-5FGG456C

Mfr. Part

XC2VP4-5FGG456C

Manufacturer

AMD Xilinx

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Detailed Description

Virtex-II Pro family FPGA, commercial temperature grade C, speed grade -5

456-ball FBGA package, body size 23 mm x 23 mm, surface-mount

248 user I/O, 752 LABs or CLBs, 6,768 logic elements or cells

516,096 bits of on-chip RAM

Core supply voltage range 1.425 V to 1.575 V

RoHS3 compliant, lead-free

Base product number XC2VP4

Series Virtex-II Pro

Current available quantity 2606 units, subject to prior sale

Key Features

Mid-density FPGA for embedded and general-purpose logic designs

6,768 logic cells and 752 CLBs for moderate complexity designs

516 kbits on-chip RAM for FIFOs, buffers, and small memories

248 user I/O pins for broad system connectivity

Wide I/O support across banked I/O architecture, including common single-ended and differential standards

Digital clocking resources and global clock networks for precise timing

Multiple configuration modes supported by standard Xilinx flows such as JTAG and serial modes

Commercial operating junction temperature 0 to 85°C

Core voltage 1.5 V nominal with allowed range 1.425 to 1.575 V

Proven tool support with Xilinx ISE Design Suite

RoHS3 compliance for environmental regulations

Key Advantages

Mature and widely deployed platform, ideal for sustaining and extending legacy designs

Stable, predictable timing with well-understood design methodology

456-ball FBGA balances high I/O count with a manageable PCB footprint

Field reconfigurable hardware shortens development and update cycles

Backed by Y-IC supply chain, inspection, and technical support for smooth procurement and integration

Packaging

Type Fine-pitch Ball Grid Array, Xilinx package code FGG

Material Lead-free, RoHS3 compliant

Size 23 mm x 23 mm body outline, 456 balls

Mounting Surface-mount, Pb-free reflow compatible

Pin configuration 456 total balls with 248 user I/O, multiple banked I/O regions, dedicated configuration pins, and dedicated power and ground balls

Thermal characteristics Operating junction temperature 0 to 85°C, thermal performance depends on design power and heatsinking; follow Xilinx thermal guidelines

Electrical properties Core supply VCCINT 1.425 to 1.575 V nominal 1.5 V; additional auxiliary and I/O rails required per I/O standard and bank configuration; decoupling and power sequencing per datasheet

Shipping Package Tray

Notes Also referenced as 456-FBGA or 456-BBGA in some listings; see datasheet for exact ball pitch, ball map, and keep-out dimensions

Lifecycle

Status Legacy generation and generally NRND or EOL in many regions. Expect limited new production and longer lead times. Best suited for sustaining existing designs.

Recommended modern alternatives by application

- Xilinx Virtex-4 FX family for designs needing embedded processing and higher performance, for example XC4VFX12 devices

- Xilinx Virtex-5 FXT family for improved performance and transceivers, for example XC5VFX30T devices

- Xilinx 7 Series for pure FPGA logic upgrades, for example Kintex-7 XC7K160T or Artix-7 XC7A200T options depending on performance and power needs

- Xilinx Zynq-7000 SoC for FPGA plus integrated ARM processing when migrating from FPGA-plus-CPU architectures

Important Migration between families requires redesign and verification. Pinouts, voltages, IP blocks, transceivers, and toolchains differ. Review datasheets and migration guides carefully.

If you need a direct cross or a tailored replacement list for your exact features, speed, package, and I/O, please contact Y-IC sales via our website for expert assistance.

Key Application Areas

Industrial control and factory automation, especially maintenance of installed equipment

Communications infrastructure and networking systems from legacy platforms

Test and measurement equipment and instrumentation

Aerospace and defense sustainment programs

Embedded control, bridging, protocol adaptation, and glue logic

Education and research platforms aligned to ISE-era design flows

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this exact model on our product page. Download it now for pinouts, ball maps, electrical limits, configuration options, timing, and PCB layout guidance.

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